Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | BCHE | P06276 | 1/20 | 0.46 |
| ▸ | ACHE | P22303 | 1/20 | 0.46 |
| ▸ | HSD11B1 | P28845 | 2/20 | 0.40 |
| ▸ | ESR1 | P03372 | 1/20 | 0.38 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.38 |
| ▸ | CYP2A6 | P11509 | 1/20 | 0.38 |
| ▸ | TOP2A | P11388 | 2/20 | 0.37 |
| ▸ | LMNA | P02545 | 3/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.36 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | NPC1 | O15118 | 1/20 | 0.36 |
| ▸ | RAB9A | P51151 | 1/20 | 0.36 |
| ▸ | MGAM | O43451 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | SI | P14410 | 1/20 | 0.35 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.35 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22507458 | 0.92 | BCHE (0.47) | BCHEACHEHSD11B1ESR1ESR2 | |
| SCHEMBL10071744 | 0.86 | BCHE (0.54) | BCHEACHEHSD11B1ESR1ESR2 | |
| SCHEMBL4205066 | 0.83 | HSD11B1 (0.45) | BCHEACHEHSD11B1ALDH1A1SMN1; SMN2 | |
| SCHEMBL3249022 | 0.80 | PDGFRB (0.47) | LMNAALDH1A1SMN1; SMN2POLBKMT2A | |
| SCHEMBL4096729 | 0.79 | GRM1 (0.39) | BCHEACHEALDH1A1HPGDPTGS2 | |
| SCHEMBL28949210 | 0.79 | POLB (0.47) | BCHEACHEALDH1A1POLBKMT2A | |
| SCHEMBL14113001 | 0.77 | HCAR1 (0.45) | BCHEACHELMNAALDH1A1SMN1; SMN2 | |
| SCHEMBL15753777 | 0.77 | BCHE (0.47) | BCHEACHETOP2AMGAMGAA | |
| SCHEMBL29732755 | 0.77 | HSD11B1 (0.49) | BCHEACHEHSD11B1CYP2A6LMNA | |
| SCHEMBL63728 | 0.77 | HSD11B1 (0.49) | BCHEACHEHSD11B1CYP2A6LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7741005-B2 | A planographic printing plate precursor comprising: an aluminum support; and a photosensitive layer including a polymerization initiator, a polymerizable compound and a binder polymer; an oxygen barrier layer; and a protective layer including a filler; capable of image formation | FUJIFILM CORPORATION (JP) | 2010-06-22 | — | — | US | disclosed |
| US-7741005-B2 | A planographic printing plate precursor comprising: an aluminum support; and a photosensitive layer including a polymerization initiator, a polymerizable compound and a binder polymer; an oxygen barrier layer; and a protective layer including a filler; capable of image formation | FUJIFILM CORPORATION (JP) | 2010-06-22 | — | — | US | disclosed |
| EP-1553450-B1 | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN EI KAGAKU CO (JP) | 2010-05-26 | — | — | EP | disclosed |
| US-20070231740-A1 | A planographic printing plate precursor comprising: an aluminum support; and a photosensitive layer including a polymerization initiator, a polymerizable compound and a binder polymer; an oxygen barrier layer; and a protective layer including a filler; capable of image formation | FUJIFILM CORPORATION (JP) | 2007-10-04 | — | — | US | disclosed |
| US-20070231740-A1 | A planographic printing plate precursor comprising: an aluminum support; and a photosensitive layer including a polymerization initiator, a polymerizable compound and a binder polymer; an oxygen barrier layer; and a protective layer including a filler; capable of image formation | FUJIFILM CORPORATION (JP) | 2007-10-04 | — | — | US | disclosed |
| EP-1298155-A1 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board | San-Ei Kagaku Co. Ltd. (JP) | 2003-04-02 | — | — | EP | disclosed |