Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 3/20 | 0.47 |
| ▸ | CES2 | O00748 | 1/20 | 0.47 |
| ▸ | CES1 | P23141 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.42 |
| ▸ | HPGD | P15428 | 1/20 | 0.40 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.39 |
| ▸ | MAPT | P10636 | 3/20 | 0.38 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.38 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.38 |
| ▸ | PPARG | P37231 | 1/20 | 0.37 |
| ▸ | PPARA | Q07869 | 1/20 | 0.37 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
| ▸ | HDAC3 | O15379 | 1/20 | 0.36 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.36 |
| ▸ | SRC | P12931 | 1/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Benzene SCHEMBL28209572 | 1.00 | LMNA (0.47) | LMNACES2CES1MAPK1CYP2C19 | |
| Benzoin SCHEMBL28307199 | 0.94 | LMNA (0.58) | LMNACES2CES1MAPK1CYP2C19 | |
| Methoxymethane SCHEMBL11091635 | 0.94 | LMNA (0.42) | LMNACES2CES1MAPK1CYP2C19 | |
| Benzil SCHEMBL28225728 | 0.93 | LMNA (0.49) | LMNACES2CES1MAPK1CYP2C19 | |
| Ether SCHEMBL11098722 | 0.91 | LMNA (0.40) | LMNACES2CES1MAPK1CYP2C19 | |
| SCHEMBL29014396 | 0.88 | LMNA (0.42) | LMNACES2CES1MAPK1CYP2C19 | |
| SCHEMBL31250054 | 0.88 | LMNA (0.42) | LMNACES2CES1MAPK1CYP2C19 | |
| SCHEMBL27699434 | 0.86 | LMNA (0.49) | LMNACES2CES1MAPK1HPGD | |
| SCHEMBL2237176 | 0.81 | ADRB2 (0.42) | LMNAALDH1A1KDM4EMAPTGABRA1 | |
| SCHEMBL6438158 | 0.81 | LMNA (0.44) | LMNACES2CES1MAPK1CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 505 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118240213-A | Negative photosensitive polyimide precursor and composition thereof | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | claimed |
| CN-118244583-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | claimed |
| CN-116909100-B | Photosensitive polyimide precursor composition | 深圳先进电子材料国际创新研究院 | 2024-03-19 | — | — | CN | claimed |
| CN-116909100-A | Photosensitive polyimide precursor composition | 深圳先进电子材料国际创新研究院 | 2023-10-20 | — | — | CN | claimed |
| CN-116482933-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2023-07-25 | — | — | CN | claimed |
| CN-109988312-B | Polyamide acid ester, preparation method, negative polyimide composition and application | 深圳先进技术研究院 | 2023-04-11 | — | — | CN | claimed |
| CN-115160569-B | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-12-27 | — | — | CN | claimed |
| CN-115160569-A | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-10-11 | — | — | CN | claimed |
| US-20200316504-A1 | NANOSTRUCTURED FIBROUS MEMBRANES FOR MEMBRANE DISTILLATION | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK | 2020-10-08 | — | — | US | claimed |
| US-10702815-B2 | Nanostructured fibrous membranes for membrane distillation | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK (US) | 2020-07-07 | — | — | US | claimed |
| CN-106233205-B | Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package | 日立化成株式会社 | 2020-06-23 | — | — | CN | claimed |
| CN-105849641-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 日立化成株式会社 | 2019-12-13 | — | — | CN | claimed |
| CN-109988312-A | A kind of poly amic acid ester, preparation method and negative polyimide composition and application | 深圳先进技术研究院 | 2019-07-09 | — | — | CN | claimed |
| CN-109946925-A | A kind of compound is promoting the application in polyimides low-temperature setting, polyimide precursor composition and application thereof | 深圳先进技术研究院 | 2019-06-28 | — | — | CN | claimed |
| CN-109867787-A | A kind of polyimide precursor, resin combination, cured film and preparation method thereof | 深圳先进技术研究院 | 2019-06-11 | — | — | CN | claimed |
| US-20170326486-A1 | NANOSTRUCTURED FIBROUS MEMBRANES FOR MEMBRANE DISTILLATION | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK | 2017-11-16 | — | — | US | claimed |
| US-4387139-A | Elastomeric, ethylenically unsaturated polyurethanes and radiation polymerizable mixtures containing such polyurethanes | KALLE, NIEDERLASSUNG DER HOECHST AG (DE) | 1983-06-07 | — | — | US | claimed |
| US-4086299-A | WITH UNSATURATED CARBOXY ACID | ICI AUSTRALIA LIMITED (AU) | 1978-04-25 | — | — | US | claimed |
| US-3990958-A | Radiation polymerization of triallylamines using a non-polar, non-hydroxylic solvent | ICI AUSTRALIA LIMITED (AU) | 1976-11-09 | — | — | US | claimed |
| CN-116635452-B | Free radically polymerizable crosslinking agent, curable composition, and adhesive therefrom | 3M INNOVATIVE PROPERTIES CO. (US) | 2026-05-26 | — | — | CN | disclosed |
| CN-120152955-A | Compositions comprising isomer mixtures of itaconimide norbornene and citraconimide norbornene | 3M创新有限公司 | 2025-06-13 | — | — | CN | disclosed |
| EP-4225532-B1 | COATED ABRASIVE ARTICLE AND METHOD OF MAKING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2025-02-26 | — | — | EP | disclosed |
| CN-112105967-B | Curable high refractive index compositions and articles made therefrom | 3M创新有限公司 | 2024-09-24 | — | — | CN | disclosed |
| CN-112424245-B | Composition comprising a styrene-isobutylene block copolymer and an ethylenically unsaturated monomer | 3M创新有限公司 | 2024-09-17 | — | — | CN | disclosed |
| CN-118355324-A | Photosensitive resin composition, photosensitive element, method for producing cured product pattern, and method for producing circuit board | 株式会社力森诺科 | 2024-07-16 | — | — | CN | disclosed |
| CN-114258439-B | Sheath-core filaments comprising diene-based rubber and method of printing the same | 3M创新有限公司 | 2024-07-12 | — | — | CN | disclosed |
| EP-4398289-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID | FUJIFILM Corporation (JP) | 2024-07-10 | — | — | EP | disclosed |
| WO-2024142487-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING WIRING BOARD | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| WO-2024142486-A1 | PHOTOSENSITIVE ELEMENT AND METHOD FOR PRODUCING CIRCUIT BOARD | 株式会社レゾナック | 2024-07-04 | — | — | WO | disclosed |
| WO-2024134889-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2024-06-27 | — | — | WO | disclosed |
| WO-2024135574-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2024-06-27 | — | — | WO | disclosed |
| CN-118240213-A | Negative photosensitive polyimide precursor and composition thereof | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | disclosed |
| CN-118244583-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2024-06-25 | — | — | CN | disclosed |
| CN-118235088-A | Photosensitive resin composition, photosensitive element, and method for producing laminate | 株式会社力森诺科 | 2024-06-21 | — | — | CN | disclosed |
| WO-2024116513-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 株式会社レゾナック | 2024-06-06 | — | — | WO | disclosed |
| WO-2024116247-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 株式会社レゾナック | 2024-06-06 | — | — | WO | disclosed |
| CN-118131567-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-06-04 | — | — | CN | disclosed |
| EP-3953105-B1 | ANIONIC POLISHING PADS FORMED BY PRINTING PROCESSES | APPLIED MATERIALS INC (US) | 2024-05-22 | — | — | EP | disclosed |
| CN-113614130-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117980821-A | Photosensitive resin composition, photosensitive element, and method for producing laminate | 株式会社力森诺科 | 2024-05-03 | — | — | CN | disclosed |
| CN-115667404-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-113168093-B | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2024-04-30 | — | — | CN | disclosed |
| CN-116736635-B | Photosensitive resin composition, adhesive polymer, monomer, element, resist pattern manufacturing method, and printed wiring manufacturing method | 珦盛新材料(珠海)有限公司 | 2024-04-19 | — | — | CN | disclosed |
| US-11960208-B2 | Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for manufacturing printed wiring board | RESONAC CORPORATION (JP) | 2024-04-16 | — | — | US | disclosed |
| WO-2024075158-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 株式会社レゾナック | 2024-04-11 | — | — | WO | disclosed |
| WO-2024075626-A1 | PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD, AND PRINTED WIRING BOARD MANUFACTURING METHOD | 株式会社レゾナック | 2024-04-11 | — | — | WO | disclosed |
| CN-113412289-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2024-04-05 | — | — | CN | disclosed |
| CN-117836715-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and alkali generator | 富士胶片株式会社 | 2024-04-05 | — | — | CN | disclosed |
| CN-117751326-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device | 富士胶片株式会社 | 2024-03-22 | — | — | CN | disclosed |
| CN-117730280-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device | 富士胶片株式会社 | 2024-03-19 | — | — | CN | disclosed |
| CN-116909100-B | Photosensitive polyimide precursor composition | 深圳先进电子材料国际创新研究院 | 2024-03-19 | — | — | CN | disclosed |
| US-11934102-B2 | Manufacturing method for cured substance, manufacturing method for laminate, and manufacturing method for semiconductor device, and treatment liquid | FUJIFILM CORPORATION (JP) | 2024-03-19 | — | — | US | disclosed |
| CN-117715982-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-03-15 | — | — | CN | disclosed |
| CN-117642442-A | Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device | 富士胶片株式会社 | 2024-03-01 | — | — | CN | disclosed |
| EP-4317287-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2024-02-07 | — | — | EP | disclosed |
| CN-114008092-B | Cross-linking agent and curable composition comprising same | 3M创新有限公司 | 2024-02-02 | — | — | CN | disclosed |
| CN-116661245-B | Photosensitive resin composition, cage-type polysilsesquioxane compound, element, resist pattern, and method for producing printed wiring | 珦盛新材料(珠海)有限公司 | 2024-01-26 | — | — | CN | disclosed |
| CN-116679530-B | Photosensitive resin composition, cyclic siloxane compound, element, resist pattern, and method for producing printed wiring | 珦盛新材料(珠海)有限公司 | 2024-01-26 | — | — | CN | disclosed |
| EP-4307049-A1 | PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, AND PRODUCTION METHOD FOR LAYERED PRODUCT | RESONAC CORPORATION (JP) | 2024-01-17 | — | — | EP | disclosed |
| WO-2024009432-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE SUBSTATE OR PRINTED WIRING BOARD | 株式会社レゾナック | 2024-01-11 | — | — | WO | disclosed |
| WO-2024009870-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE OR RINTED WIRING BOARD | 株式会社レゾナック | 2024-01-11 | — | — | WO | disclosed |
| CN-117378044-A | Polyimide-containing part forming composition, method for producing bonded body, method for producing device, and device | 富士胶片株式会社 | 2024-01-09 | — | — | CN | disclosed |
| US-11860538-B2 | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2024-01-02 | — | — | US | disclosed |
| US-11851570-B2 | Anionic polishing pads formed by printing processes | APPLIED MATERIALS, INC. (US) | 2023-12-26 | — | — | US | disclosed |
| WO-2023238299-A1 | ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2023-12-14 | — | — | WO | disclosed |
| CN-117222944-A | Resin for photoresist, photoresist and cured product | 日油株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-117203746-A | Method for manufacturing bonded body, method for manufacturing semiconductor device, and resin composition | 富士胶片株式会社 | 2023-12-08 | — | — | CN | disclosed |
| WO-2023233547-A1 | PATTERN FORMING METHOD | 株式会社レゾナック | 2023-12-07 | — | — | WO | disclosed |
| WO-2023233543-A1 | PATTERN FORMATION METHOD AND PATTERN FORMATION STRUCTURE | 株式会社レゾナック | 2023-12-07 | — | — | WO | disclosed |
| EP-3700975-B1 | ACTINICALLY CURABLE ADHESIVE COMPOSITION WITH IMPROVED PROPERTIES | SUN CHEMICAL CORP (US) | 2023-12-06 | — | — | EP | disclosed |
| CN-117099052-A | Method for producing regenerated developer and method for producing flexographic printing plate using same | 东洋纺MC株式会社 | 2023-11-21 | — | — | CN | disclosed |
| CN-117083346-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-117063121-A | Photosensitive film, photosensitive element, and method for producing laminate | 株式会社力森诺科 | 2023-11-14 | — | — | CN | disclosed |
| CN-113383273-B | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-117043677-A | Photosensitive resin composition, photosensitive element, and method for producing laminate | 株式会社力森诺科 | 2023-11-10 | — | — | CN | disclosed |
| CN-117043273-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-11-10 | — | — | CN | disclosed |
| US-20230356362-A1 | COATED ABRASIVE ARTICLE AND METHOD OF MAKING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY | 2023-11-09 | — | — | US | disclosed |
| US-20230350305-A1 | MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID | FUJIFILM CORPORATION (JP) | 2023-11-02 | — | — | US | disclosed |
| CN-116909100-A | Photosensitive polyimide precursor composition | 深圳先进电子材料国际创新研究院 | 2023-10-20 | — | — | CN | disclosed |
| CN-116917808-A | Improved colour fading | 西托斯股份公司 | 2023-10-20 | — | — | CN | disclosed |
| CN-116888187-A | Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and precursor of cyclized resin | 富士胶片株式会社 | 2023-10-13 | — | — | CN | disclosed |
| CN-116888217-A | Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and alkali generator | 富士胶片株式会社 | 2023-10-13 | — | — | CN | disclosed |
| WO-2023188008-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR MANUFACTURING CURED PRODUCT, METHOD FOR MANUFACTURING CURED PRODUCT PATTERN, AND METHOD FOR MANUFACTURING WIRING BOARD | 株式会社レゾナック | 2023-10-05 | — | — | WO | disclosed |
| CN-116848461-A | Photosensitive film, photosensitive element, and method for producing laminate | 株式会社力森诺科 | 2023-10-03 | — | — | CN | disclosed |
| CN-116830037-A | Photosensitive element, method for producing cured product pattern, and method for producing circuit board | 株式会社力森诺科 | 2023-09-29 | — | — | CN | disclosed |
| CN-116830036-A | Two-component system | 西托斯股份公司 | 2023-09-29 | — | — | CN | disclosed |
| WO-2023176509-A1 | WAVELENGTH CONVERSION MEMBER AND MANUFACTURING METHOD THEREFOR | 日亜化学工業株式会社 | 2023-09-21 | — | — | WO | disclosed |
| US-20230288802-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2023-09-14 | — | — | US | disclosed |
| CN-116736635-A | Photosensitive resin composition, adhesive polymer, monomer, element, resist pattern manufacturing method, and printed wiring manufacturing method | 珦盛新材料(珠海)有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-116724071-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-09-08 | — | — | CN | disclosed |
| CN-116710282-A | Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and compound | 富士胶片株式会社 | 2023-09-05 | — | — | CN | disclosed |
| CN-116679530-A | Photosensitive resin composition, cyclic siloxane compound, element, resist pattern, and method for producing printed wiring | 珦盛新材料(珠海)有限公司 | 2023-09-01 | — | — | CN | disclosed |
| CN-116685622-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-09-01 | — | — | CN | disclosed |
| WO-2023161753-A1 | (METH)ACRYLATED HYPERBRANCHED POLYMERS, METHOD OF MAKING, COMPOSITIONS INCLUDING THE SAME, AND ELECTRONIC DEVICE | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2023-08-31 | — | — | WO | disclosed |
| US-20230273518-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2023-08-31 | — | — | US | disclosed |
| CN-116661245-A | Photosensitive resin composition, cage-type polysilsesquioxane compound, element, resist pattern, and method for producing printed wiring | 珦盛新材料(珠海)有限公司 | 2023-08-29 | — | — | CN | disclosed |
| CN-116648313-A | Resin composition, cured product, laminate, method for producing cured product, and semiconductor device | 富士胶片株式会社 | 2023-08-25 | — | — | CN | disclosed |
| CN-116635453-A | Method for producing cured product, method for producing laminate, method for producing semiconductor device, and treatment liquid | 富士胶片株式会社 | 2023-08-22 | — | — | CN | disclosed |
| EP-4225532-A1 | COATED ABRASIVE ARTICLE AND METHOD OF MAKING THE SAME | 3M Innovative Properties Company (US) | 2023-08-16 | — | — | EP | disclosed |
| EP-4214267-A1 | HYPERBRANCHED POLYMER, METHOD OF MAKING, AND CURABLE COMPOSITION INCLUDING THE SAME | 3M Innovative Properties Company (US) | 2023-07-26 | — | — | EP | disclosed |
| CN-116482933-A | Negative photosensitive polyimide precursor resin composition | 深圳先进电子材料国际创新研究院 | 2023-07-25 | — | — | CN | disclosed |
| WO-2023136105-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND PRODUCTION METHOD OF LAMINATE | 株式会社レゾナック | 2023-07-20 | — | — | WO | disclosed |
| CN-111630454-B | Photosensitive resin composition, resin, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-07-14 | — | — | CN | disclosed |
| US-20230213858-A1 | MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2023-07-06 | — | — | US | disclosed |
| EP-3298080-B1 | SUPERHYDROPHOBIC UV CURABLE COATING | SUN CHEMICAL CORP (US) | 2023-07-05 | — | — | EP | disclosed |
| CN-113840886-B | Composition comprising a styrene-isoprene block copolymer and an ethylenically unsaturated monomer | 3M创新有限公司 | 2023-07-04 | — | — | CN | disclosed |
| CN-110741318-B | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-06-30 | — | — | CN | disclosed |
| CN-111479693-B | Optically clear adhesive containing trialkyl borane complex initiator and photoacid | 3M创新有限公司 | 2023-06-16 | — | — | CN | disclosed |
| CN-116234845-A | Method for producing cured product, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2023-06-06 | — | — | CN | disclosed |
| CN-116209571-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2023-06-02 | — | — | CN | disclosed |
| CN-116209955-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 株式会社力森诺科 | 2023-06-02 | — | — | CN | disclosed |
| US-20230161248-A1 | PHOTOSENSITIVE FILM, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING LAMINATE | RESONAC CORPORATION (JP) | 2023-05-25 | — | — | US | disclosed |
| US-20230145264-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PRODUCING WIRING BOARD | RESONAC CORPORATION (JP) | 2023-05-11 | — | — | US | disclosed |
| CN-116075777-A | Method for producing cured product, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2023-05-05 | — | — | CN | disclosed |
| WO-2023074630-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND LAMINATE PRODUCTION METHOD | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| WO-2023074629-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND LAMINATE PRODUCTION METHOD | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| WO-2023073799-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND LAMINATE PRODUCTION METHOD | 株式会社レゾナック | 2023-05-04 | — | — | WO | disclosed |
| CN-115989457-A | Method for producing cured product, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2023-04-18 | — | — | CN | disclosed |
| CN-109988312-B | Polyamide acid ester, preparation method, negative polyimide composition and application | 深圳先进技术研究院 | 2023-04-11 | — | — | CN | disclosed |
| CN-109313397-B | Method for manufacturing laminate, method for manufacturing semiconductor element, and laminate | 富士胶片株式会社 | 2023-04-11 | — | — | CN | disclosed |
| CN-115867864-A | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 昭和电工材料株式会社 | 2023-03-28 | — | — | CN | disclosed |
| WO-2023032820-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND COMPOUND | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032475-A1 | METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND TREATMENT SOLUTION AND RESIN COMPOSITION | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032545-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROCESSING LIQUID | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| WO-2023032821-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| CN-115768832-A | Resin composition, method for producing same, and method for producing composition for pattern formation | 富士胶片株式会社 | 2023-03-07 | — | — | CN | disclosed |
| US-11596886-B2 | Nanostructured fibrous membranes for membrane distillation | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK (US) | 2023-03-07 | — | — | US | disclosed |
| CN-115729037-A | Cured product, laminate, semiconductor device, method for producing same, resin composition, and compound | 富士胶片株式会社 | 2023-03-03 | — | — | CN | disclosed |
| CN-112888714-B | Method for producing cured film, resin composition, cured film, method for producing laminate, and method for producing semiconductor element | 富士胶片株式会社 | 2023-02-28 | — | — | CN | disclosed |
| CN-112805317-B | Resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-02-28 | — | — | CN | disclosed |
| WO-2023008090-A1 | METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2023-02-02 | — | — | WO | disclosed |
| WO-2023008001-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, SEMICONDUCTOR DEVICE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2023-02-02 | — | — | WO | disclosed |
| WO-2023008049-A1 | CURED PRODUCT MANUFACTURING METHOD, LAMINATE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2023-02-02 | — | — | WO | disclosed |
| CN-115667404-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-01-31 | — | — | CN | disclosed |
| US-11567405-B2 | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | FUJIFILM CORPORATION (JP) | 2023-01-31 | — | — | US | disclosed |
| CN-112272606-B | Active energy ray-curable resin composition for three-dimensional modeling support material, and ink | 科巨希化学股份有限公司 | 2023-01-24 | — | — | CN | disclosed |
| WO-2023286571-A1 | RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2023-01-19 | — | — | WO | disclosed |
| CN-110325911-B | Photosensitive resin composition, heterocyclic ring-containing polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-01-06 | — | — | CN | disclosed |
| CN-115524924-A | Photosensitive resin composition, photosensitive element, and method for producing laminate | 昭和电工材料株式会社 | 2022-12-27 | — | — | CN | disclosed |
| CN-115160569-B | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-12-27 | — | — | CN | disclosed |
| CN-115469510-A | Photosensitive resin composition, photosensitive element, and method for producing laminate | 昭和电工材料株式会社 | 2022-12-13 | — | — | CN | disclosed |
| US-11518895-B2 | Energy cured heat activated ink jet adhesives for foiling applications | INX INTERNATIONAL INK CO. (US) | 2022-12-06 | — | — | US | disclosed |
| CN-115298615-A | Photosensitive resin composition, photosensitive element, and method for producing wiring board | 昭和电工材料株式会社 | 2022-11-04 | — | — | CN | disclosed |
| CN-115190891-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-115160569-A | Photosensitive polyamic acid ester resin, resin composition and electronic component | 明士(北京)新材料开发有限公司 | 2022-10-11 | — | — | CN | disclosed |
| WO-2022208663-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND CURABLE COMPOSITION | 昭和電工マテリアルズ株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022210466-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATED BODY, CURED PRODUCT MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND POLYIMIDE PRECURSOR | 富士フイルム株式会社 | 2022-10-06 | — | — | WO | disclosed |
| WO-2022203010-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-09-29 | — | — | WO | disclosed |
| EP-4063953-A1 | PATTERN FORMING METHOD, PHOTOCURABLE RESIN COMPOSITION, LAYERED BODY MANUFACTURING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | FUJIFILM Corporation (JP) | 2022-09-28 | — | — | EP | disclosed |
| CN-115103871-A | Resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-09-23 | — | — | CN | disclosed |
| CN-115038727-A | Curable composition for forming light scattering layer | 3M创新有限公司 | 2022-09-09 | — | — | CN | disclosed |
| CN-115038755-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-09-09 | — | — | CN | disclosed |
| CN-114981360-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-08-30 | — | — | CN | disclosed |
| CN-114930251-A | Copolymer, anticorrosive coating composition containing the copolymer, dispersant containing the copolymer, and resist resin containing the copolymer | 日油株式会社 | 2022-08-19 | — | — | CN | disclosed |
| CN-114911132-A | Photosensitive composition and dry film photoresist produced therefrom | 杜邦电子公司 | 2022-08-16 | — | — | CN | disclosed |
| CN-114855119-A | Method for manufacturing metal mask | 昭和电工材料株式会社 | 2022-08-05 | — | — | CN | disclosed |
| CN-114761466-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2022-07-15 | — | — | CN | disclosed |
| CN-114730145-A | Pattern forming method, photocurable resin composition, method for producing laminate, and method for producing electronic device | 富士胶片株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-114730132-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2022-07-08 | — | — | CN | disclosed |
| CN-108700836-B | Method for manufacturing laminate and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-06-28 | — | — | CN | disclosed |
| US-20220187518-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, AND IMAGE DISPLAY DEVICE | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-06-16 | — | — | US | disclosed |
| US-20220187517-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, AND WAVELENGTH CONVERSION RESIN COMPOSITION | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-06-16 | — | — | US | disclosed |
| US-20220179138-A1 | WAVELENGTH CONVERSION MEMBER AND UTILIZATION THEREOF, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2022-06-09 | — | — | US | disclosed |
| US-20220171285-A1 | METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2022-06-02 | — | — | US | disclosed |
| CN-114514470-A | Pattern forming method, photosensitive resin composition, method for manufacturing laminate, and method for manufacturing semiconductor device | 富士胶片株式会社 | 2022-05-17 | — | — | CN | disclosed |
| CN-108027556-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing touch panel | 昭和电工材料株式会社 | 2022-05-06 | — | — | CN | disclosed |
| CN-114402256-A | Organic film, method for producing same, composition, laminate, and semiconductor device | 富士胶片株式会社 | 2022-04-26 | — | — | CN | disclosed |
| WO-2022074474-A1 | COATED ABRASIVE ARTICLE AND METHOD OF MAKING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2022-04-14 | — | — | WO | disclosed |
| CN-112055737-B | Shaped siliceous abrasive agglomerates with shaped abrasive particles, abrasive articles, and related methods | 3M创新有限公司 | 2022-04-12 | — | — | CN | disclosed |
| CN-114341731-A | Method for producing cured film, photocurable resin composition, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2022-04-12 | — | — | CN | disclosed |
| WO-2022064917-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| WO-2022064933-A1 | METHOD FOR PRODUCING COMPOSITE PATTERN, RESIN COMPOSITION, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-31 | — | — | WO | disclosed |
| CN-114258439-A | Sheath-core filaments comprising diene-based rubbers and methods of printing | 3M创新有限公司 | 2022-03-29 | — | — | CN | disclosed |
| CN-107107461-B | Active energy ray-curable resin composition for three-dimensional molded support | 科巨希化学股份公司 | 2022-03-29 | — | — | CN | disclosed |
| WO-2022058810-A1 | HYPERBRANCHED POLYMER, METHOD OF MAKING, AND CURABLE COMPOSITION INCLUDING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2022-03-24 | — | — | WO | disclosed |
| WO-2022059621-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-24 | — | — | WO | disclosed |
| WO-2022050229-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | 昭和電工マテリアルズ株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050278-A1 | CURABLE RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, SEMICONDUCTOR DEVICE, AND PHOTOBASE GENERATOR | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050135-A1 | CURED PRODUCT PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD | 富士フイルム株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022045060-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| WO-2022045275-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, SEMICONDUCTOR DEVICE, AND COMPOUND | 富士フイルム株式会社 | 2022-03-03 | — | — | WO | disclosed |
| CN-114127136-A | Polymers for pressure-sensitive adhesives with antistatic properties | 3M创新有限公司 | 2022-03-01 | — | — | CN | disclosed |
| US-20220056288-A1 | ENERGY CURABLE, HEAT ACTIVATED FLEXOGRAPHIC ADHESIVES FOR DIE-LESS FOILING | INX INTERNATIONAL INK CO. | 2022-02-24 | — | — | US | disclosed |
| EP-3953105-A1 | ANIONIC POLISHING PADS FORMED BY PRINTING PROCESSES | Applied Materials, Inc. (US) | 2022-02-16 | — | — | EP | disclosed |
| CN-114008092-A | Crosslinking agent and curable composition containing the same | 3M创新有限公司 | 2022-02-01 | — | — | CN | disclosed |
| CN-114008526-A | Curable resin composition, method for producing curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-02-01 | — | — | CN | disclosed |
| CN-114008527-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polyimide or polyimide precursor | 富士胶片株式会社 | 2022-02-01 | — | — | CN | disclosed |
| CN-113994258-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-01-28 | — | — | CN | disclosed |
| EP-3940018-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED BODY, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR | FUJIFILM Corporation (JP) | 2022-01-19 | — | — | EP | disclosed |
| US-20220002488-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR | FUJIFILM CORPORATION (JP) | 2022-01-06 | — | — | US | disclosed |
| WO-2021261429-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND THERMOSETTING RESIN | 富士フイルム株式会社 | 2021-12-30 | — | — | WO | disclosed |
| US-11180681-B2 | Actinically curable adhesive composition with improved properties | SUN CHEMICAL CORPORATION (US) | 2021-11-23 | — | — | US | disclosed |
| CN-113614130-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-11-05 | — | — | CN | disclosed |
| CN-113574091-A | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and polymer precursor | 富士胶片株式会社 | 2021-10-29 | — | — | CN | disclosed |
| CN-113557456-A | Wavelength conversion member, application thereof, backlight unit and image display device | 昭和电工材料株式会社 | 2021-10-26 | — | — | CN | disclosed |
| CN-113557457-A | Wavelength conversion member, backlight unit and image display device | 昭和电工材料株式会社 | 2021-10-26 | — | — | CN | disclosed |
| CN-113557610-A | Wavelength conversion member, backlight unit, image display device, and resin composition for wavelength conversion | 昭和电工材料株式会社 | 2021-10-26 | — | — | CN | disclosed |
| CN-113544584-A | Photosensitive resin composition, photosensitive element, and method for producing wiring board | 昭和电工材料株式会社 | 2021-10-22 | — | — | CN | disclosed |
| CN-110678487-B | Curable resin composition, glass member, display device, and mobile terminal | 昭和电工材料株式会社 | 2021-10-15 | — | — | CN | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| CN-113412289-A | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2021-09-17 | — | — | CN | disclosed |
| US-20210286265-A1 | PHOTOSENSITIVE ELEMENT, RESIN COMPOSITION FOR FORMING BARRIER LAYER, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2021-09-16 | — | — | US | disclosed |
| CN-113383273-A | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | 富士胶片株式会社 | 2021-09-10 | — | — | CN | disclosed |
| WO-2021153545-A1 | COPOLYMER, RUST PREVENTIVE COATING COMPOSITION CONTAINING SAME, DISPERSANT AND RESIST RESIN | 日油株式会社 | 2021-08-05 | — | — | WO | disclosed |
| EP-3859447-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2021-08-04 | — | — | EP | disclosed |
| CN-113168093-A | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | 富士胶片株式会社 | 2021-07-23 | — | — | CN | disclosed |
| US-11054744-B2 | Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-07-06 | — | — | US | disclosed |
| WO-2021132578-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-07-01 | — | — | WO | disclosed |
| WO-2021117414-A1 | METHOD FOR PRODUCING DRIED RESIN, METHOD FOR PRODUCING COMPOSITION, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING MULTILAYER BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-06-17 | — | — | WO | disclosed |
| WO-2021112189-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2021-06-10 | — | — | WO | disclosed |
| WO-2021107024-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2021-06-03 | — | — | WO | disclosed |
| CN-112888714-A | Method for producing cured film, resin composition, cured film, method for producing laminate, and method for producing semiconductor element | 富士胶片株式会社 | 2021-06-01 | — | — | CN | disclosed |
| CN-112805317-A | Resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-05-14 | — | — | CN | disclosed |
| US-20210139719-A1 | ENERGY CURED HEAT ACTIVATED INK JET ADHESIVES FOR FOILING APPLICATIONS | INX INTERNATIONAL INK CO. | 2021-05-13 | — | — | US | disclosed |
| US-20210139768-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, AND CURABLE COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-20210139769-A1 | WAVELENGTH CONVERSION MEMBER, BACK LIGHT UNIT, IMAGE DISPLAY DEVICE, CURABLE COMPOSITION AND CURED PRODUCT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-05-13 | — | — | US | disclosed |
| WO-2021084603-A1 | RESIN COMPOSITION FOR WAVELENGTH CONVERSION, CURED RESIN MATERIAL FOR WAVELENGTH CONVERSION, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | 昭和電工マテリアルズ株式会社 | 2021-05-06 | — | — | WO | disclosed |
| WO-2021085072-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, LAYERED BODY MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2021-05-06 | — | — | WO | disclosed |
| CN-112752798-A | Resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-05-04 | — | — | CN | disclosed |
| WO-2021075305-A1 | NEGATIVE CURABLE COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-04-22 | — | — | WO | disclosed |
| CN-112639615-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, semiconductor element, and thermoalcogenating agent | 富士胶片株式会社 | 2021-04-09 | — | — | CN | disclosed |
| CN-112639616-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-04-09 | — | — | CN | disclosed |
| CN-108290970-B | Photocurable resin composition | 株式会社德山 | 2021-04-02 | — | — | CN | disclosed |
| US-10960651-B2 | Laminate, wavelength conversion member, backlight unit, and image display device | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-03-30 | — | — | US | disclosed |
| CN-112513219-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2021-03-16 | — | — | CN | disclosed |
| WO-2021045126-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, RESIN, AND METHOD FOR PRODUCING RESIN | 富士フイルム株式会社 | 2021-03-11 | — | — | WO | disclosed |
| WO-2021039841-A1 | METHOD FOR PRODUCING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD FOR PRODUCING LAMINATE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-03-04 | — | — | WO | disclosed |
| WO-2021039782-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, RESIN, AND METHOD FOR PRODUCING RESIN | 富士フイルム株式会社 | 2021-03-04 | — | — | WO | disclosed |
| US-10927269-B2 | Energy cured heat activated ink jet adhesives for foiling applications | INX INTERNATIONAL INK CO. (US) | 2021-02-23 | — | — | US | disclosed |
| WO-2021028977-A1 | WAVELENGTH CONVERSION MATERIAL, METHOD FOR MANUFACTURING WAVELENGTH CONEVRSION MATERIAL, LAMINATE, BACKLIGHT UNIT, AND IMAGE DISPLAY DEVICE | 昭和電工マテリアルズ株式会社 | 2021-02-18 | — | — | WO | disclosed |
| WO-2021029240-A1 | WAVELENGTH CONVERSION MATERIAL, METHOD FOR PRODUCING WAVELENGTH CONVERSION MATERIAL, MULTILAYER BODY, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | 昭和電工マテリアルズ株式会社 | 2021-02-18 | — | — | WO | disclosed |
| US-20210040384-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-02-11 | — | — | US | disclosed |
| US-20210040383-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-02-11 | — | — | US | disclosed |
| EP-3768795-A1 | STRUCTURED ABRASIVES CONTAINING POLISHING MATERIALS FOR USE IN THE HOME | 3M Innovative Properties Company (US) | 2021-01-27 | — | — | EP | disclosed |
| US-20210018671-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2021-01-21 | — | — | US | disclosed |
| EP-3767345-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2021-01-20 | — | — | EP | disclosed |
| CN-112230319-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2021-01-15 | — | — | CN | disclosed |
| CN-112204464-A | Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board | 昭和电工材料株式会社 | 2021-01-08 | — | — | CN | disclosed |
| WO-2021002383-A1 | CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2021-01-07 | — | — | WO | disclosed |
| EP-3761080-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2021-01-06 | — | — | EP | disclosed |
| EP-3761079-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT AND IMAGE DISPLAY DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2021-01-06 | — | — | EP | disclosed |
| EP-3761077-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE, CURABLE COMPOSITION AND CURED PRODUCT | Hitachi Chemical Company, Ltd. (JP) | 2021-01-06 | — | — | EP | disclosed |
| EP-3761076-A1 | WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, IMAGE DISPLAY DEVICE AND CURABLE COMPOSITION | Hitachi Chemical Company, Ltd. (JP) | 2021-01-06 | — | — | EP | disclosed |
| CN-112180488-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2021-01-05 | — | — | CN | disclosed |
| WO-2020255825-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYIMIDE, POLY BENZOOXAZOLE, POLYIMIDE PRECURSOR, OR POLY BENZOOXAZOLE PRECURSOR | 富士フイルム株式会社 | 2020-12-24 | — | — | WO | disclosed |
| WO-2020255859-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND POLYIMIDE OR POLYIMIDE PRECURSOR | 富士フイルム株式会社 | 2020-12-24 | — | — | WO | disclosed |
| WO-2020246234-A1 | NEGATIVE CURABLE COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-12-10 | — | — | WO | disclosed |
| CN-111971591-A | Wavelength conversion member, backlight unit, image display device, and curable composition | 日立化成株式会社 | 2020-11-20 | — | — | CN | disclosed |
| WO-2020226131-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-11-12 | — | — | WO | disclosed |
| WO-2020226132-A1 | CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-11-12 | — | — | WO | disclosed |
| CN-111919142-A | Wavelength conversion member, backlight unit, image display device, curable composition, and cured product | 日立化成株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111919172-A | Photosensitive resin composition, cured film, laminate, method for producing same, semiconductor device, and thermal alkali generator used for same | 富士胶片株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111919144-A | Wavelength conversion member, backlight unit, and image display device | 日立化成株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111919145-A | Wavelength conversion member, backlight unit, and image display device | 日立化成株式会社 | 2020-11-10 | — | — | CN | disclosed |
| CN-111902744-A | Wavelength conversion member, backlight unit, image display device, and curable composition | 日立化成株式会社 | 2020-11-06 | — | — | CN | disclosed |
| EP-3734334-A1 | LAMINATE, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, AND IMAGE DISPLAY DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2020-11-04 | — | — | EP | disclosed |
| US-20200339838-A1 | ACTINICALLY CURABLE ADHESIVE COMPOSITION WITH IMPROVED PROPERTIES | SUN CHEMICAL CORPORATION (US) | 2020-10-29 | — | — | US | disclosed |
| US-20200331244-A1 | LAMINATE, WAVELENGTH CONVERSION MEMBER, BACKLIGHT UNIT, AND IMAGE DISPLAY DEVICE | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2020-10-22 | — | — | US | disclosed |
| US-20200325353-A1 | ANIONIC POLISHING PADS FORMED BY PRINTING PROCESSES | APPLIED MATERIALS, INC. | 2020-10-15 | — | — | US | disclosed |
| WO-2020209965-A1 | ANIONIC POLISHING PADS FORMED BY PRINTING PROCESSES | APPLIED MATERIALS, INC. (US) | 2020-10-15 | — | — | WO | disclosed |
| US-20200316504-A1 | NANOSTRUCTURED FIBROUS MEMBRANES FOR MEMBRANE DISTILLATION | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK | 2020-10-08 | — | — | US | disclosed |
| WO-2020195993-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020196363-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-10-01 | — | — | WO | disclosed |
| WO-2020189481-A1 | CURABLE RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-09-24 | — | — | WO | disclosed |
| WO-2020189358-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAYERED BODY, CURED FILM PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POLYMER PRECURSOR | 富士フイルム株式会社 | 2020-09-24 | — | — | WO | disclosed |
| US-10780679-B2 | Laminate, method for manufacturing laminate, semiconductor device, and method for manufacturing the semiconductor device | FUJIFILM CORPORATION (JP) | 2020-09-22 | — | — | US | disclosed |
| EP-3339352-B1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2020-09-16 | — | — | EP | disclosed |
| CN-111630454-A | Photosensitive resin composition, resin, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2020-09-04 | — | — | CN | disclosed |
| EP-3700975-A1 | ACTINICALLY CURABLE ADHESIVE COMPOSITION WITH IMPROVED PROPERTIES | Sun Chemical Corporation (US) | 2020-09-02 | — | — | EP | disclosed |
| CN-111566521-A | Laminate, wavelength conversion member, backlight unit, and image display device | 日立化成株式会社 | 2020-08-21 | — | — | CN | disclosed |
| CN-106232217-B | Creating and harvesting surface-bound emulsions | 安捷伦科技有限公司 | 2020-08-04 | — | — | CN | disclosed |
| US-10725379-B2 | Polymide precursor resin composition | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2020-07-28 | — | — | US | disclosed |
| CN-111379392-A | Method for mounting decorative wall or floor coverings | 塔吉特GDL公司 | 2020-07-07 | — | — | CN | disclosed |
| US-10702815-B2 | Nanostructured fibrous membranes for membrane distillation | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK (US) | 2020-07-07 | — | — | US | disclosed |
| CN-106233205-B | Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package | 日立化成株式会社 | 2020-06-23 | — | — | CN | disclosed |
| CN-111183376-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2020-05-19 | — | — | CN | disclosed |
| CN-111149022-A | Wavelength conversion member, backlight unit, image display device, wavelength conversion resin composition, and wavelength conversion resin cured product | 日立化成株式会社 | 2020-05-12 | — | — | CN | disclosed |
| EP-3645284-A1 | ENERGY CURED HEAT ACTIVATED INK JET ADHESIVES FOR FOILING APPLICATIONS | Inx International Ink Co. (US) | 2020-05-06 | — | — | EP | disclosed |
| CN-106462057-B | Resin composition, cured film and patterned cured film formed therefrom, and method for producing same | 日立化成杜邦微系统股份有限公司 | 2020-04-21 | — | — | CN | disclosed |
| CN-108137803-B | Resin, composition, cured film, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2020-04-17 | — | — | CN | disclosed |
| EP-3633455-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2020-04-08 | — | — | EP | disclosed |
| WO-2020066435-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND THERMOBASE GENERATOR | 富士フイルム株式会社 | 2020-04-02 | — | — | WO | disclosed |
| WO-2020066975-A1 | RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-04-02 | — | — | WO | disclosed |
| WO-2020066416-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-04-02 | — | — | WO | disclosed |
| WO-2020066244-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAYERED PRODUCT, PRODUCTION METHOD FOR CURED FILM, SEMICONDUCTOR DEVICE, AND THERMAL BASE GENERATOR | 富士フイルム株式会社 | 2020-04-02 | — | — | WO | disclosed |
| WO-2020066976-A1 | RESIN COMPOSITION, CURED FILM, MULTILAYER BODY, METHOD FOR PRODUCING CURED FILM AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-04-02 | — | — | WO | disclosed |
| CN-105829968-B | Resin composition containing polyimide precursor and method for producing cured film using same | 日立化成杜邦微系统股份有限公司 | 2020-03-27 | — | — | CN | disclosed |
| WO-2020054226-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-03-19 | — | — | WO | disclosed |
| US-20200089113-A1 | PHOTOSENSITIVE RESIN COMPOSITION, POLYMER PRECURSOR, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2020-03-19 | — | — | US | disclosed |
| CN-104781730-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 日立化成株式会社 | 2020-03-06 | — | — | CN | disclosed |
| US-10564543-B2 | Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2020-02-18 | — | — | US | disclosed |
| CN-110741318-A | Photosensitive resin composition, cured film, laminate, method for producing cured film, semiconductor device, and compound | 富士胶片株式会社 | 2020-01-31 | — | — | CN | disclosed |
| CN-110692018-A | Photosensitive resin composition, polymer precursor, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2020-01-14 | — | — | CN | disclosed |
| CN-110678487-A | Curable resin composition, glass member, display device, and mobile terminal | 日立化成株式会社 | 2020-01-10 | — | — | CN | disclosed |
| CN-104834184-B | Photosensitive element | 日立化成株式会社 | 2019-12-31 | — | — | CN | disclosed |
| CN-106324993-B | Photosensitive resin composition and application thereof | 常州强力电子新材料股份有限公司 | 2019-12-31 | — | — | CN | disclosed |
| CN-105849641-B | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | 日立化成株式会社 | 2019-12-13 | — | — | CN | disclosed |
| CN-104914673-B | Photosensitive polymer combination, photosensitive element, the forming method of resist pattern and touch panel manufacturing method | 日立化成株式会社 | 2019-12-03 | — | — | CN | disclosed |
| CN-104678700-B | The forming method of photosensitive polymer combination, photosensitive element and corrosion-resisting pattern | HITACHI CHEMICAL (JP) | 2019-11-01 | — | — | CN | disclosed |
| US-10450417-B2 | Resin, composition, cured film, method for manufacturing cured film and semiconductor device | FUJIFILM CORPORATION (JP) | 2019-10-22 | — | — | US | disclosed |
| WO-2019189110-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2019-10-03 | — | — | WO | disclosed |
| WO-2019189111-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR MANUFACTURING THESE, SEMICONDUCTOR DEVICE, AND THERMAL BASE GENERATOR USED IN THESE | 富士フイルム株式会社 | 2019-10-03 | — | — | WO | disclosed |
| WO-2019180656-A1 | STRUCTURED ABRASIVES CONTAINING POLISHING MATERIALS FOR USE IN THE HOME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2019-09-26 | — | — | WO | disclosed |
| CN-108136756-B | Laminated body, the manufacturing method of laminated body, the manufacturing method of semiconductor devices and semiconductor devices | 富士胶片株式会社 | 2019-08-23 | — | — | CN | disclosed |
| CN-110023837-A | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | 日立化成株式会社 | 2019-07-16 | — | — | CN | disclosed |
| CN-109988312-A | A kind of poly amic acid ester, preparation method and negative polyimide composition and application | 深圳先进技术研究院 | 2019-07-09 | — | — | CN | disclosed |
| US-10345704-B2 | Photosensitive element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2019-07-09 | — | — | US | disclosed |
| EP-3339023-B1 | LAMINATE, METHOD FOR MANUFACTURING THE LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2019-07-03 | — | — | EP | disclosed |
| CN-109946925-A | A kind of compound is promoting the application in polyimides low-temperature setting, polyimide precursor composition and application thereof | 深圳先进技术研究院 | 2019-06-28 | — | — | CN | disclosed |
| CN-109942817-A | A kind of polyimide precursor, preparation method and resin combination and its application | 深圳先进技术研究院 | 2019-06-28 | — | — | CN | disclosed |
| CN-109867787-A | A kind of polyimide precursor, resin combination, cured film and preparation method thereof | 深圳先进技术研究院 | 2019-06-11 | — | — | CN | disclosed |
| EP-3492982-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2019-06-05 | — | — | EP | disclosed |
| CN-104870565-B | Polyimide precursor resin composition | 日立化成杜邦微系统股份有限公司 | 2019-04-26 | — | — | CN | disclosed |
| WO-2019005798-A1 | ENERGY CURED HEAT ACTIVATED INK JET ADHESIVES FOR FOILING APPLICATIONS | INX INTERNATIONAL INK CO. (US) | 2019-01-03 | — | — | WO | disclosed |
| CN-104111583-B | Photosensitive polymer combination, photosensitive element, the forming method of photoresist figure and the manufacturing method of printed circuit board | 日立化成株式会社 | 2019-01-01 | — | — | CN | disclosed |
| US-10168617-B2 | Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2019-01-01 | — | — | US | disclosed |
| US-20180371270-A1 | ENERGY CURED HEAT ACTIVATED INK JET ADHESIVES FOR FOILING APPLICATIONS | INX INTERNATIONAL INK CO. | 2018-12-27 | — | — | US | disclosed |
| US-10156787-B2 | Composition for forming interlayer insulating film, interlayer insulating film, method for forming interlayer insulating film pattern, and device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-12-18 | — | — | US | disclosed |
| US-10103359-B2 | Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2018-10-16 | — | — | US | disclosed |
| US-10104781-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-10-16 | — | — | US | disclosed |
| US-20180237549-A1 | COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RESIST, AND PHOTOSENSITIVE ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-08-23 | — | — | US | disclosed |
| US-20180222164-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-08-09 | — | — | US | disclosed |
| US-20180215874-A1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR MANUFACTURING CURED FILM AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2018-08-02 | — | — | US | disclosed |
| EP-3339352-A1 | RESIN, COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2018-06-27 | — | — | EP | disclosed |
| EP-3339023-A1 | LAMINATE, METHOD FOR MANUFACTURING LAMINATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI-FILM Corporation (JP) | 2018-06-27 | — | — | EP | disclosed |
| US-10005915-B2 | High-stretch energy curable inks and method of use in heat transfer label applications | SUN CHEMICAL CORPORATION (US) | 2018-06-26 | — | — | US | disclosed |
| CN-108136756-A | Laminated body, the manufacturing method of laminated body, the manufacturing method of semiconductor devices and semiconductor devices | 富士胶片株式会社 | 2018-06-08 | — | — | CN | disclosed |
| US-9989854-B2 | Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-06-05 | — | — | US | disclosed |
| US-20180134904-A1 | SUPERHYDROPHOBIC UV CURABLE COATING | SUN CHEMICAL CORPORATION (US) | 2018-05-17 | — | — | US | disclosed |
| EP-3298080-A1 | SUPERHYDROPHOBIC UV CURABLE COATING | Sun Chemical Corporation (US) | 2018-03-28 | — | — | EP | disclosed |
| CN-104133342-B | Photosensitive polymer combination, photosensitive element, the forming method of photoresist figure and the manufacture method of printed circuit board (PCB) | 日立化成株式会社 | 2018-01-23 | — | — | CN | disclosed |
| EP-3257677-A1 | INKS OR COATINGS AND METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS | Sun Chemical Corporation (US) | 2017-12-20 | — | — | EP | disclosed |
| US-20170326486-A1 | NANOSTRUCTURED FIBROUS MEMBRANES FOR MEMBRANE DISTILLATION | THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK | 2017-11-16 | — | — | US | disclosed |
| US-9799854-B2 | Multilayer film for encapsulating oxygen and/or moisture sensitive electronic devices | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2017-10-24 | — | — | US | disclosed |
| US-20170285473-A1 | COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, METHOD FOR FORMING INTERLAYER INSULATING FILM PATTERN, AND DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-20170285472-A1 | COMPOSITION FOR FORMING INTERLAYER INSULATING FILM, INTERLAYER INSULATING FILM, METHOD FOR FORMING INTERLAYER INSULATING FILM PATTERN, AND DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-2739481-B1 | HIGH-STRETCH ENERGY CURABLE INKS AND METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS | SUN CHEMICAL CORP (US) | 2017-09-20 | — | — | EP | disclosed |
| US-20170261851-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR PRODUCING SUBSTRATE WITH RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2017-09-14 | — | — | US | disclosed |
| US-9751984-B2 | Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2017-09-05 | — | — | US | disclosed |
| US-20170153551-A1 | METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, PHOTOSENSITIVE RESIN COMPOSITION FOR PROJECTION EXPOSURE AND PHOTOSENSITIVE ELEMENT | RESONAC CORPORATION (JP) | 2017-06-01 | — | — | US | disclosed |
| CN-106462067-A | Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element | 日立化成株式会社 | 2017-02-22 | — | — | CN | disclosed |
| CN-106462057-A | Resin composition, cured film and patterned cured film formed therefrom, and method for producing same | 日立化成杜邦微系统股份有限公司 | 2017-02-22 | — | — | CN | disclosed |
| US-20170045817-A1 | PHOTOSENSITIVE ELEMENT, LAMINATE, PERMANENT MASK RESIST, METHOD FOR PRODUCING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-02-16 | — | — | US | disclosed |
| WO-2016187363-A1 | EMULSION COMPOSITION FOR ENERGY CURABLE INK COMPOSITIONS AND A PRINTING PROCESS AND METHOD THEREOF | LUBRIZOL ADVANCED MATERIALS, INC. (US) | 2016-11-24 | — | — | WO | disclosed |
| WO-2016187569-A1 | SUPERHYDROPHOBIC UV CURABLE COATING | SUN CHEMICAL CORPORATION (US) | 2016-11-24 | — | — | WO | disclosed |
| US-20160333203-A1 | ENERGY CURABLE INKS WITH IMPROVED ADHESION AND A METHOD FOR FORMULATING | SUN CHEMICAL CORPORATION (US) | 2016-11-17 | — | — | US | disclosed |
| EP-3092268-A1 | ENERGY CURABLE INKS WITH IMPROVED ADHESION A METHOD FOR FORMULATING | Sun Chemical Corporation (US) | 2016-11-16 | — | — | EP | disclosed |
| US-20160330845-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2016-11-10 | — | — | US | disclosed |
| US-9486940-B2 | Radiation curable resin systems for composite materials and methods for use thereof | AUTOLIV ASP, INC. (US) | 2016-11-08 | — | — | US | disclosed |
| US-9482946-B2 | Photosensitive resin composition, photosensitive element using same, method for forming partition wall of image display device, and method for manufacturing image display device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2016-11-01 | — | — | US | disclosed |
| EP-2437939-B1 | MULTILAYER BARRIER FILM | AGENCY SCIENCE TECH & RES (SG) | 2016-09-28 | — | — | EP | disclosed |
| US-20160170299-A1 | PHOTOSENSITIVE RESIN COMPOSITION FOR PROJECTION EXPOSURE, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, PROCESS FOR PRODUCING PRINTED WIRING BOARD AND PROCESS FOR PRODUCING LEAD FRAME | RESONAC CORPORATION (JP) | 2016-06-16 | — | — | US | disclosed |
| US-20160137857-A1 | HIGH-STRETCH ENERGY CURABLE INKS & METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS | SUN CHEMICAL CORPORATION (US) | 2016-05-19 | — | — | US | disclosed |
| US-9275560-B2 | High-stretch energy curable inks and method of use in heat transfer label applications | SUN CHEMICAL CORPORATION (US) | 2016-03-01 | — | — | US | disclosed |
| US-20160024329-A1 | ENERGY CURABLE INKS WITH IMPROVED ADHESION | SUN CHEMICAL CORPORATION (US) | 2016-01-28 | — | — | US | disclosed |
| US-20150353685-A1 | POLYIMIDE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING SAID POLYIMIDE PRECURSOR, AND CURED-PATTERN-FILM MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE USING SAID PHOTOSENSITIVE RESIN COMPOSITION | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2015-12-10 | — | — | US | disclosed |
| US-20150337116-A1 | POLYMIDE PRECURSOR RESIN COMPOSITION | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2015-11-26 | — | — | US | disclosed |
| EP-2934880-A1 | RADIATION CURABLE RESIN SYSTEMS FOR COMPOSITE MATERIALS AND METHODS FOR USE THEREOF | Autoliv ASP, Inc. (US) | 2015-10-28 | — | — | EP | disclosed |
| US-20150293443-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2015-10-15 | — | — | US | disclosed |
| US-20150227042-A1 | PHOTOSENSITIVE ELEMENT | RESONAC CORPORATION (JP) | 2015-08-13 | — | — | US | disclosed |
| WO-2015105668-A1 | ENERGY CURABLE INKS WITH IMPROVED ADHESION A METHOD FOR FORMULATING | SUN CHEMICAL CORPORATION (US) | 2015-07-16 | — | — | WO | disclosed |
| EP-2823007-A1 | ENERGY CURABLE INKS WITH IMPROVED ADHESION | Sun Chemical Corporation (US) | 2015-01-14 | — | — | EP | disclosed |
| EP-2281420-B1 | MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES | AGENCY SCIENCE TECH & RES (SG) | 2014-10-15 | — | — | EP | disclosed |
| US-20140220315-A1 | HIGH-STRETCH ENERGY CURABLE INKS & METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS | SUN CHEMICAL CORPORATION (US) | 2014-08-07 | — | — | US | disclosed |
| US-20140179040-A1 | MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2014-06-26 | — | — | US | disclosed |
| WO-2014099656-A1 | RADIATION CURABLE RESIN SYSTEMS FOR COMPOSITE MATERIALS AND METHODS FOR USE THEREOF | AUTOLIV ASP, INC. (US) | 2014-06-26 | — | — | WO | disclosed |
| US-20140167333-A1 | RADIATION CURABLE RESIN SYSTEMS FOR COMPOSITE MATERIALS AND METHODS FOR USE THEREOF | AUTOLIV ASP, INC. (US) | 2014-06-19 | — | — | US | disclosed |
| EP-2739481-A1 | HIGH-STRETCH ENERGY CURABLE INKS & METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS | Sun Chemical Corporation (US) | 2014-06-11 | — | — | EP | disclosed |
| EP-2731790-A2 | METHOD AND COMPOSITION FOR RESTORING DAMAGED OPTICAL SUBSTRATES UTILIZING HIGH REFRACTIVE INDEX ULTRAVIOLET CURABLE COATING | DIC Imaging Products USA LLC (US) | 2014-05-21 | — | — | EP | disclosed |
| US-20140087619-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING SAME, METHOD FOR FORMING PARTITION WALL OF IMAGE DISPLAY DEVICE, AND METHOD FOR MANUFACTURING IMAGE DISPLAY DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-27 | — | — | US | disclosed |
| US-8614051-B2 | Photosensitive resin composition and circuit formation substrate using the same | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2013-12-24 | — | — | US | disclosed |
| US-8592130-B2 | Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-11-26 | — | — | US | disclosed |
| US-8586284-B2 | Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-11-19 | — | — | US | disclosed |
| US-20130298398-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-11-14 | — | — | US | disclosed |
| WO-2013134110-A1 | ENERGY CURABLE INKS WITH IMPROVED ADHESION | SUN CHEMICAL CORPORATION (US) | 2013-09-12 | — | — | WO | disclosed |
| US-8501392-B2 | Photosensitive element, method for formation of resist pattern, and method for production of print circuit board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-20130143011-A1 | PHOTOSENSITIVE RESIN COMPOSITION | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2013-06-06 | — | — | US | disclosed |
| EP-1773912-B1 | HARDCOAT COMPOSITIONS AND METHODS | 3M INNOVATIVE PROPERTIES CO (US) | 2013-03-27 | — | — | EP | disclosed |
| EP-1670643-B1 | UV CURE INK JET INK FOR NONPOROUS SUBSTRATES | JETRION L L C (US) | 2013-03-06 | — | — | EP | disclosed |
| WO-2013019821-A1 | HIGH-STRETCH ENERGY CURABLE INKS & METHOD OF USE IN HEAT TRANSFER LABEL APPLICATIONS | SUN CHEMICAL CORPORATION (US) | 2013-02-07 | — | — | WO | disclosed |
| WO-2013010079-A2 | METHOD AND COMPOSITION FOR RESTORING DAMAGED OPTICAL SUBSTRATES UTILIZING HIGH REFRACTIVE INDEX ULTRAVIOLET CURABLE COATING | DIC IMAGING PRODUCTS USA LLC (US) | 2013-01-17 | — | — | WO | disclosed |
| US-20120328856-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-12-27 | — | — | US | disclosed |
| US-8304160-B2 | Photosensitive resin composition and circuit formation substrate using the same | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-11-06 | — | — | US | disclosed |
| WO-2012102978-A1 | ABRASIVE ARTICLE WITH REPLICATED MICROSTRUCTURED BACKING AND METHOD OF USING SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2012-08-02 | — | — | WO | disclosed |
| US-20120164434-A1 | MULTILAYER BARRIER FILM | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2012-06-28 | — | — | US | disclosed |
| US-8198008-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-12 | — | — | US | disclosed |
| US-8192916-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-05 | — | — | US | disclosed |
| EP-2437939-A1 | MULTILAYER BARRIER FILM | Agency For Science, Technology And Research (SG) | 2012-04-11 | — | — | EP | disclosed |
| US-8153195-B2 | Isodecyl acrylate primer has low surface tension; benzoin methyl ether photoinitiator; alkoxylated diacrylates, alkoxylated triacrylates, amino acrylates UV curable monomers; coat primer applied first, cured with actinic radiation, cationic curable ink, jet ink is printed on surface of clear coat primer | ELECTRONICS FOR IMAGING, INC. (US) | 2012-04-10 | — | — | US | disclosed |
| WO-2012024263-A2 | EPOXY/ACRYLATE HYBRID COATINGS FOR OPTHALMIC LENSES | HONEYWELL INTERNATIONAL INC. (US) | 2012-02-23 | — | — | WO | disclosed |
| US-8105759-B2 | Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| US-8092980-B2 | Photosensitive element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-01-10 | — | — | US | disclosed |
| EP-2389423-A1 | STRUCTURED FIXED ABRASIVE ARTICLES INCLUDING SURFACE TREATED NANO-CERIA FILLER, AND METHOD FOR MAKING AND USING THE SAME | 3M Innovative Properties Company (US) | 2011-11-30 | — | — | EP | disclosed |
| WO-2011142986-A1 | FIXED ABRASIVE PAD WITH SURFACTANT FOR CHEMICAL MECHANICAL PLANARIZATION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2011-11-17 | — | — | WO | disclosed |
| US-20110256408-A1 | Method of making coated article having anti-bacterial and/or anti-fungal coating and resulting product | GUARDIAN INDUSTRIES CORP., (US) | 2011-10-20 | — | — | US | disclosed |
| US-7993809-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-08-09 | — | — | US | disclosed |
| US-20110159430-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN AND METHOD OF PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-06-30 | — | — | US | disclosed |
| US-20110132449-A1 | MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2011-06-09 | — | — | US | disclosed |
| EP-2327088-A2 | STRUCTURED ABRASIVE ARTICLE, METHOD OF MAKING THE SAME, AND USE IN WAFER PLANARIZATION | 3M Innovative Properties Company (US) | 2011-06-01 | — | — | EP | disclosed |
| US-20110086309-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-04-14 | — | — | US | disclosed |
| EP-2281420-A1 | MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES | Agency for Science, Technology And Research (SG) | 2011-02-09 | — | — | EP | disclosed |
| WO-2010140980-A1 | MULTILAYER BARRIER FILM | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2010-12-09 | — | — | WO | disclosed |
| EP-2061845-B1 | DOT SIZE CONTROLLING PRIMER COATING FOR RADIATION CURABLE INK JET INKS | ELECTRONICS FOR IMAGING INC (US) | 2010-11-17 | — | — | EP | disclosed |
| US-20100285408-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2010-11-11 | — | — | US | disclosed |
| US-20100279229-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2010-11-04 | — | — | US | disclosed |
| US-20100260983-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-10-14 | — | — | US | disclosed |
| US-20100233627-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PLASMA DISPLAY PANEL | HITACHI CHEMICAL CO., LTD. (JP) | 2010-09-16 | — | — | US | disclosed |
| WO-2010085587-A1 | STRUCTURED FIXED ABRASIVE ARTICLES INCLUDING SURFACE TREATED NANO-CERIA FILLER, AND METHOD FOR MAKING AND USING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2010-07-29 | — | — | WO | disclosed |
| US-7736834-B2 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-06-15 | — | — | US | disclosed |
| US-20100112481-A1 | PHOTOSENSITIVE ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-05-06 | — | — | US | disclosed |
| WO-2010025003-A2 | STRUCTURED ABRASIVE ARTICLE, METHOD OF MAKING THE SAME, AND USE IN WAFER PLANARIZATION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2010-03-04 | — | — | WO | disclosed |
| US-20100028808-A1 | PHOTOSENSITIVE ELEMENT | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-02-04 | — | — | US | disclosed |
| US-20090297982-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMATION OF RESIST PATTERN, AND METHOD FOR PRODUCTION OF PRINT CIRCUIT BOARD | RESONAC CORPORATION (JP) | 2009-12-03 | — | — | US | disclosed |
| EP-2121314-A1 | SOLAR CONTROL MULTILAYER FILM | 3M Innovative Properties Company (US) | 2009-11-25 | — | — | EP | disclosed |
| US-7622243-B2 | Photosensitive element, resist pattern formation method and printed wiring board production method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-11-24 | — | — | US | disclosed |
| US-7611818-B2 | Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-11-03 | — | — | US | disclosed |
| EP-2111326-A1 | COATED ABRASIVE DISC AND METHOD OF MAKING THE SAME | 3M Innovative Properties Company (US) | 2009-10-28 | — | — | EP | disclosed |
| WO-2009126115-A1 | MULTILAYER FILM FOR ENCAPSULATING OXYGEN AND/OR MOISTURE SENSITIVE ELECTRONIC DEVICES | AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH (SG) | 2009-10-15 | — | — | WO | disclosed |
| EP-2096493-A1 | PHOTOSENSITIVE ELEMENT | Hitachi Chemical Company, Ltd. (JP) | 2009-09-02 | — | — | EP | disclosed |
| US-20090202944-A1 | PHOTOSENSITIVE RESIN COMPOSITION, AND, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PARTITION WALL FOR PLASMA DISPLAY PANEL USING THE COMPOSITION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-08-13 | — | — | US | disclosed |
| US-7560499-B2 | Initiator and ultraviolet absorber blends for changing lens power by ultraviolet light | CALHOUN VISION, INC. (US) | 2009-07-14 | — | — | US | disclosed |
| EP-2061845-A2 | DOT SIZE CONTROLLING PRIMER COATING FOR RADIATION CURABLE INK JET INKS | Electronics for Imaging, Inc. (US) | 2009-05-27 | — | — | EP | disclosed |
| US-7517636-B2 | Can shorten developing time and has high stripping property and tent reliability | HITACHI CHEMICAL CO., LTD. (JP) | 2009-04-14 | — | — | US | disclosed |
| US-20090029289-A1 | Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board | RESONAC CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-2009497-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMATION OF RESIST PATTERN, AND METHOD FOR PRODUCTION OF PRINT CIRCUIT BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-12-31 | — | — | EP | disclosed |
| WO-2008088939-A1 | SOLAR CONTROL MULTILAYER FILM | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2008-07-24 | — | — | WO | disclosed |
| WO-2008079708-A1 | COATED ABRASIVE DISC AND METHOD OF MAKING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2008-07-03 | — | — | WO | disclosed |
| WO-2008060730-A1 | THERMOSETTING COATING COMPOSITIONS WITH THREE OR MORE CURE MECHANISMS | BASF CORPORATION (US) | 2008-05-22 | — | — | WO | disclosed |
| US-20080119580-A1 | THERMOSETTING COATING COMPOSITIONS WITH THREE OR MORE CURE MECHANISMS | BASF CORPORATION | 2008-05-22 | — | — | US | disclosed |
| EP-1907451-A1 | INITIATOR AND ULTRAVIOLET ABSORBER FOR CHANGING LENS POWER BY ULTRAVIOLET LIGHT | Calhoun Vision, Inc. (US) | 2008-04-09 | — | — | EP | disclosed |
| WO-2008030555-A2 | DOT SIZE CONTROLLING PRIMER COATING FOR RADIATION CURABLE INK JET INKS | ELECTRONICS FOR IMAGING, INC. (US) | 2008-03-13 | — | — | WO | disclosed |
| US-20080063799-A1 | DOT SIZE CONTROLLING PRIMER COATING FOR RADIATION CURABLE INK JET INKS | ELECTRONICS FOR IMAGING INC. (US) | 2008-03-13 | — | — | US | disclosed |
| US-7338751-B2 | Process for producing printed wiring board and photosensitive resin composition used in the same | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-04 | — | — | US | disclosed |
| WO-2008019077-A1 | LOW REFRACTIVE INDEX COMPOSITION | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-02-14 | — | — | WO | disclosed |
| US-7309559-B2 | Resist pattern, process for producing same, and utilization thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2007-12-18 | — | — | US | disclosed |
| US-20070269738-A1 | Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| EP-1846523-A1 | ARTICLES COMPRISING A FLUOROCHEMICAL SURFACE LAYER AND RELATED METHODS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2007-10-24 | — | — | EP | disclosed |
| EP-1838793-A1 | STAIN-RESISTANT FLUOROCHEMICAL COMPOSITIONS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2007-10-03 | — | — | EP | disclosed |
| EP-1831288-A1 | FLUOROPOLYMER NANOPARTICLE COATING COMPOSITION | 3M Innovative Properties Company (US) | 2007-09-12 | — | — | EP | disclosed |
| US-20070185287-A1 | Modified epoxy resin, process for its production, photosensitive resin composition and photsensitive element | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-08-09 | — | — | US | disclosed |
| WO-2007075803-A2 | HIGHLY WATER REPELLENT FLUOROPOLYMER COATING | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2007-07-05 | — | — | WO | disclosed |
| US-20070111136-A1 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, process for manufacturing printed circuit board and method for removing photocured product | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-05-17 | — | — | US | disclosed |
| US-20070105036-A1 | Photosensitive element, resist pattern formation method and printed wiring board production method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-05-10 | — | — | US | disclosed |
| US-20070077514-A1 | Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2007-04-05 | — | — | US | disclosed |
| WO-2006135572-A1 | INITIATOR AND ULTRAVIOLET ABSORBER FOR CHANGING LENS POWER BY ULTRAVIOLET LIGHT | CALHOUN VISION, INC. (US) | 2006-12-21 | — | — | WO | disclosed |
| EP-1670643-A4 | UV CURE INK JET INK FOR NONPOROUS SUBSTRATES | JETRION L L C (US) | 2006-10-04 | — | — | EP | disclosed |
| US-7105585-B2 | Alkyl (meth)acrylate with an 8 carbon alkyl group, a poly(alkylene oxide) modified poly(dimethyl siloxane), and a pigment; free of unreactive volatile organic compounds; low viscosity, printable on vinyl | FLINT INK CORPORATION (US) | 2006-09-12 | — | — | US | disclosed |
| WO-2006086081-A1 | FLUOROPOLYMER NANOPARTICLE COATING COMPOSITION | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2006-08-17 | — | — | WO | disclosed |
| US-7078151-B2 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2006-07-18 | — | — | US | disclosed |
| WO-2006074085-A1 | ARTICLES COMPRISING A FLUOROCHEMICAL SURFACE LAYER AND RELATED METHODS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2006-07-13 | — | — | WO | disclosed |
| WO-2006074033-A1 | STAIN-RESISTANT FLUOROCHEMICAL COMPOSITIONS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2006-07-13 | — | — | WO | disclosed |
| US-20060142528-A1 | Initiator and ultraviolet absorber blends for changing lens power by ultraviolet light | CALHOUN VISION, INC (US) | 2006-06-29 | — | — | US | disclosed |
| US-7067228-B2 | Photosensitive resin composition, photosensitive element employing it, resist pattern forming method, and printed wiring board fabrication method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-06-27 | — | — | US | disclosed |
| EP-1670643-A2 | UV CURE INK JET INK FOR NONPOROUS SUBSTRATES | Jetrion, L.L.C (US) | 2006-06-21 | — | — | EP | disclosed |
| US-7064153-B2 | UV cure ink jet ink with low monofunctional monomer content | JETRION, L.L.C. (US) | 2006-06-20 | — | — | US | disclosed |
| EP-1664159-A2 | UV CURE INK JET INK WITH LOW MONOFUNCTIONAL MONOMER CONTENT | Jetrion, L.L.C (US) | 2006-06-07 | — | — | EP | disclosed |
| US-7022747-B2 | Method for creating microsphere polymers and particles | BASF CORPORATION (US) | 2006-04-04 | — | — | US | disclosed |
| US-20050146586-A1 | UV cure ink jet for nonporous substrates | GLAS USA LLC [SUCCESSOR COLLATERAL AGENT] | 2005-07-07 | — | — | US | disclosed |
| US-6905810-B2 | Permanent resist, permanent resist-laminated substrate and process for producing the same | HITACHI MEDICAL CO., LTD. (JP) | 2005-06-14 | — | — | US | disclosed |
| US-20050119365-A1 | UV cure ink jet ink with low monofunctional monomer content | GLAS USA LLC [SUCCESSOR COLLATERAL AGENT] | 2005-06-02 | — | — | US | disclosed |
| CN-1620245-A | Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof | DU PONT (US) | 2005-05-25 | — | — | CN | disclosed |
| WO-2005030879-A2 | UV CURE INK JET INK FOR NONPOROUS SUBSTRATES | JETRION LLC (US) | 2005-04-07 | — | — | WO | disclosed |
| WO-2005030881-A2 | UV CURE INK JET INK WITH LOW MONOFUNCTIONAL MONOMER CONTENT | JETRION, LLC (US) | 2005-04-07 | — | — | WO | disclosed |
| EP-1487612-A1 | COATED ABRASIVE ARTICLE COMPRISING AN AROMATIC POLYEPOXIDE | 3M Innovative Properties Company (US) | 2004-12-22 | — | — | EP | disclosed |
| WO-2004096869-A1 | METHOD FOR CREATING MICROSPHERE POLYMERS AND PARTICLES | BASF CORPORATION (US) | 2004-11-11 | — | — | WO | disclosed |
| US-20040220318-A1 | atomizing a polymerizable styrene-acrylic ester mixture and an aminoplast or isocyanate crosslinking agent, irradiation polymerization, collecting the particulate terpolymer powder coating product in an aqueous slurry; increased random polymerization; particle size uniformity; rheology control agent | BASF CORPORATION | 2004-11-04 | — | — | US | disclosed |
| US-20040101777-A1 | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-05-27 | — | — | US | disclosed |
| US-20040086801-A1 | Method for manufacturing printeed wiring board and photosensitive resin composition used to be used for it | HITACHI CHEMICAL CO., LTD (JP) | 2004-05-06 | — | — | US | disclosed |
| US-20040063025-A1 | Resist pattern, process for producing same, and utilization thereof | HITACHI CHEMICAL CO., LTD. (JP) | 2004-04-01 | — | — | US | disclosed |
| WO-2004011568-A2 | HIGH STRENGTH PRESSURE SENSITIVE ADHESIVE | ADHESIVES RESEARCH, INC. (US) | 2004-02-05 | — | — | WO | disclosed |
| US-20040018446-A1 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-01-29 | — | — | US | disclosed |
| US-20030186166-A1 | Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board | HITACHI CHEMICAL CO., LTD. (JP) | 2003-10-02 | — | — | US | disclosed |
| WO-2003080294-A1 | COATED ABRASIVE ARTICLE COMPRISING AN AROMATIC POLYEPOXIDE | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2003-10-02 | — | — | WO | disclosed |
| WO-1991011031-A1 | PROCESSES FOR MAKING THIN FILMS AND CIRCUIT ELEMENTS OF HIGH TEMPERATURE SUPERCONDUCTORS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1991-07-25 | — | — | WO | disclosed |
| EP-0405582-A2 | Method for making optically readable media containing embossed information | Koninklijke Philips Electronics N.V. (NL) | 1991-01-02 | — | — | EP | disclosed |
| EP-0403758-A2 | Solid imaging method using compositions containing core-shell polymers | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-12-27 | — | — | EP | disclosed |
| EP-0393676-A1 | Solid imaging method using photohardenable compositions containing hollow spheres | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-10-24 | — | — | EP | disclosed |
| EP-0393675-A1 | Solid imaging method using photohardenable materials of self limiting thickness | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-10-24 | — | — | EP | disclosed |
| EP-0393677-A2 | Solid imaging system | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-10-24 | — | — | EP | disclosed |
| EP-0393672-A2 | Additives imparting reduction of shrinkage to photohardenable compositions | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-10-24 | — | — | EP | disclosed |
| EP-0393673-A2 | Solid imaging method using multiphasic photohardenable compositions | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-10-24 | — | — | EP | disclosed |
| EP-0393674-A1 | Solid imaging method utilizing photohardenable compositions of self limiting thickness by phase separation | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-10-24 | — | — | EP | disclosed |
| CN-1009346-B | The laser chemistry curing of high-molecular coating | COMMW OF AUSTRALIA DEPT OF IND (AU) | 1990-08-29 | — | — | CN | disclosed |
| EP-0382936-A2 | Elimination of voids in vacuum-laminated solder mask-coated printed-circuit boards by fluid pressurizing | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-08-22 | — | — | EP | disclosed |
| US-4922004-A | Copolymerizable photoinitiators | Merck Patent Gesellschaft mit bescrankter Haftung (DE) | 1990-05-01 | — | — | US | disclosed |
| EP-0357063-A2 | Photosensitive ceramic coating composition | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-03-07 | — | — | EP | disclosed |
| EP-0123158-B1 | PRELAMINATION, IMAGEWISE EXPOSURE OF PHOTOHARDENABLE LAYER IN PROCESS FOR SENSITIZING, REGISTERING AND EXPOSING CIRCUIT BOARDS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1989-12-13 | — | — | EP | disclosed |
| US-4833035-A | Oriented polymer materials | MERCK PATENT GESELLSCHAFT MIT BESCHRANKTER HAFTUNG (DE) | 1989-05-23 | — | — | US | disclosed |
| EP-0176356-B1 | PHOTOSENSITIVE POLYMER COMPOSITIONS, ELECTROPHORETIC DEPOSITION PROCESSES USING SAME, AND THE USE OF SAME IN FORMING FILMS ON SUBSTRATES | ROHM AND HAAS COMPANY (US) | 1988-11-02 | — | — | EP | disclosed |
| US-4775731-A | Hydrophilic three dimensional polymer and a method for production thereof | CESKOSLOVENSKA AKADEMIE VED (CS) | 1988-10-04 | — | — | US | disclosed |
| EP-0091693-B1 | IMPROVED COVER SHEET IN A PHOTOSENSITIVE ELEMENT | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1988-07-27 | — | — | EP | disclosed |
| EP-0254949-A2 | Orientated polymeric material | MERCK PATENT GmbH (DE) | 1988-02-03 | — | — | EP | disclosed |
| CN-86103263-A | The laser chemistry curing of high-molecular coating | — | 1986-11-12 | — | — | CN | disclosed |
| US-4604440-A | Hydrophilic three dimensional polymer and a method for production thereof | CESKOSLOVENSKA AKADEMIE VED (CS) | 1986-08-05 | — | — | US | disclosed |
| US-4497889-A | Release compound in negative acting photopolymerizable element | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1985-02-05 | — | — | US | disclosed |
| EP-0129443-A2 | Curable compositions containing photoinitiators | LOCTITE CORPORATION (US) | 1984-12-27 | — | — | EP | disclosed |
| EP-0128014-A2 | Photopolymerizable composition, products made therefrom and processes for preparing such products | MORTON THIOKOL, INC. (US) | 1984-12-12 | — | — | EP | disclosed |
| US-4477326-A | ULTRAVIOLET - CURABLE MIXTURE OF AN A-ALLYLBENZOIN ETHER-MODIFIED POLYSILOXANE AND UNSATURATED MONOMER; COATINGS | LOCTITE CORPORATION (US) | 1984-10-16 | — | — | US | disclosed |
| US-4399239-A | MOLDING COMPOSITION OR FOAM | HOECHST AKTIENGESELLSCHAFT (DE) | 1983-08-16 | — | — | US | disclosed |
| US-4387139-A | Elastomeric, ethylenically unsaturated polyurethanes and radiation polymerizable mixtures containing such polyurethanes | KALLE, NIEDERLASSUNG DER HOECHST AG (DE) | 1983-06-07 | — | — | US | disclosed |
| US-4207156-A | Ultraviolet photoinitiator systems utilizing aromatic sulfides and triplet state energizers | CELANESE CORPORATION (US) | 1980-06-10 | — | — | US | disclosed |
| EP-0002676-A1 | Radiation curable coating composition and a process for coating a substrate therewith | GAF CORPORATION (US) | 1979-07-11 | — | — | EP | disclosed |
| EP-0002676-A1 | Radiation curable coating composition and a process for coating a substrate therewith | GAF CORPORATION (US) | 1979-07-11 | — | — | EP | disclosed |