Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.46 |
| ▸ | LMNA | P02545 | 2/20 | 0.46 |
| ▸ | ACHE | P22303 | 2/20 | 0.46 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.46 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | NPC1 | O15118 | 1/20 | 0.38 |
| ▸ | RAB9A | P51151 | 1/20 | 0.38 |
| ▸ | CES2 | O00748 | 1/20 | 0.38 |
| ▸ | CES1 | P23141 | 1/20 | 0.38 |
| ▸ | POLB | P06746 | 2/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | VCP | P55072 | 1/20 | 0.34 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | ATM | Q13315 | 1/20 | 0.33 |
| ▸ | RCE1 | Q9Y256 | 1/20 | 0.33 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Toluene SCHEMBL28462909 | 0.91 | LMNA (0.50) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL3469199 | 0.91 | LMNA (0.50) | TSHRLMNAACHEALOX12MEN1 | |
| Adipic Acid SCHEMBL28621543 | 0.89 | FFAR1 (0.48) | KMT2ASMN1; SMN2ALDH1A1MAPT | |
| Toluene SCHEMBL11664184 | 0.89 | LMNA (0.52) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL27294596 | 0.87 | LMNA (0.50) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL11669463 | 0.87 | TSHR (0.61) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL32871 | 0.84 | ACHE (0.65) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL57282 | 0.84 | ACHE (0.65) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL29088577 | 0.84 | ACHE (0.65) | TSHRLMNAACHEALOX12MEN1 | |
| Toluene SCHEMBL7745465 | 0.84 | ACHE (0.65) | TSHRLMNAACHEALOX12MEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2590782-B1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | CABOT MICROELECTRONICS CORP (US) | 2018-02-21 | — | — | EP | claimed |
| US-20150343595-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | QED TECHNOLOGIES INTERNATIONAL, INC. | 2015-12-03 | — | — | US | claimed |
| US-9156124-B2 | Soft polishing pad for polishing a semiconductor substrate | NEXPLANAR CORPORATION (US) | 2015-10-13 | — | — | US | claimed |
| EP-2590782-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | Nexplanar Corporation (US) | 2013-05-15 | — | — | EP | claimed |
| WO-2012005778-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | NEXPLANAR CORPORATION (US) | 2012-01-12 | — | — | WO | claimed |
| US-20120009855-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | CMC MATERIALS LLC | 2012-01-12 | — | — | US | claimed |
| CN-107779989-A | A kind of composite elastic fiber and preparation method thereof | 上海益弹新材料有限公司 | 2018-03-09 | — | — | CN | disclosed |
| EP-2590782-B1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | CABOT MICROELECTRONICS CORP (US) | 2018-02-21 | — | — | EP | disclosed |
| US-9597777-B2 | Homogeneous polishing pad for eddy current end-point detection | NEXPLANAR CORPORATION (US) | 2017-03-21 | — | — | US | disclosed |
| US-20150343595-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | QED TECHNOLOGIES INTERNATIONAL, INC. | 2015-12-03 | — | — | US | disclosed |
| EP-2523777-B1 | CMP PAD WITH LOCAL AREA TRANSPARENCY | NEXPLANAR CORP (US) | 2015-12-02 | — | — | EP | disclosed |
| US-9156124-B2 | Soft polishing pad for polishing a semiconductor substrate | NEXPLANAR CORPORATION (US) | 2015-10-13 | — | — | US | disclosed |
| US-9028302-B2 | Polishing pad for eddy current end-point detection | NEXPLANAR CORPORATION (US) | 2015-05-12 | — | — | US | disclosed |
| WO-2012044683-A2 | POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION | NEXPLANAR CORPORATION (US) | 2012-04-05 | — | — | WO | disclosed |
| US-20120079773-A1 | METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION REGION FOR EDDY CURRENT END-POINT DETECTION | CMC MATERIALS LLC | 2012-04-05 | — | — | US | disclosed |
| US-20120083192-A1 | HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION | CMC MATERIALS LLC | 2012-04-05 | — | — | US | disclosed |
| WO-2012005778-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | NEXPLANAR CORPORATION (US) | 2012-01-12 | — | — | WO | disclosed |
| US-20120009855-A1 | SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE | CMC MATERIALS LLC | 2012-01-12 | — | — | US | disclosed |
| WO-2011088057-A1 | CMP PAD WITH LOCAL AREA TRANSPARENCY | NEXPLANAR CORPORATION (US) | 2011-07-21 | — | — | WO | disclosed |
| US-20110171883-A1 | CMP pad with local area transparency | NEXPLANAR CORPORATION (US) | 2011-07-14 | — | — | US | disclosed |