Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD11B1 | P28845 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.35 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
| ▸ | SLC6A12 | P48065 | 3/20 | 0.32 |
| ▸ | SLC6A11 | P48066 | 3/20 | 0.32 |
| ▸ | SLC6A13 | Q9NSD5 | 3/20 | 0.32 |
| ▸ | KHK | P50053 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3293814 | 0.84 | — | — | |
| SCHEMBL5848235 | 0.82 | HSD11B1 (0.48) | HSD11B1SMN1; SMN2L3MBTL1MAPK1SLC6A12 | |
| SCHEMBL6685953 | 0.78 | — | — | |
| SCHEMBL14532383 | 0.74 | — | — | |
| SCHEMBL13346663 | 0.73 | POLB (0.45) | HSD11B1SMN1; SMN2 | |
| SCHEMBL3297463 | 0.73 | HSD11B1 (0.41) | HSD11B1SMN1; SMN2L3MBTL1MAPK1SLC6A12 | |
| SCHEMBL13370655 | 0.73 | HSD11B1 (0.41) | HSD11B1SMN1; SMN2L3MBTL1MAPK1SLC6A12 | |
| SCHEMBL3289957 | 0.73 | HSD11B1 (0.41) | HSD11B1SMN1; SMN2L3MBTL1MAPK1SLC6A12 | |
| SCHEMBL1088471 | 0.73 | NLRP3 (0.35) | — | |
| SCHEMBL202551 | 0.72 | ALDH1A1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |