SCHEMBL3302264

SCHEMBL3302264

C=CC(=O)OC1(C)C2CC3(C)CC1CC(C)(C2)C3

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14519228 0.81 TSHR (0.33)
SCHEMBL685522 0.81
SCHEMBL14519253 0.80 TSHR (0.33)
SCHEMBL14543780 0.77 TSHR (0.31)
SCHEMBL39900 0.76 CYP17A1 (0.40)
SCHEMBL14519239 0.76 HSD11B1 (0.35)
SCHEMBL14543778 0.76 TSHR (0.33)
SCHEMBL3305006 0.75 ALDH1A1 (0.34)
SCHEMBL14519225 0.73 HSD11B1 (0.33)
SCHEMBL10171490 0.73 PKM (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7816471-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-10-19 US disclosed
US-20100099836-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2010-04-22 US disclosed
US-7662897-B2 dropping polymerization of monomers such as 1-hydroxy-3-methacryloyloxyadamantane (HMA), 5-methacryloyloxy-2,6-norbornane carbolactone (MNBL), 2-methacryloyloxy-2-methyladamantane (2-MMA), solvent extraction, redissolving, desolventing; purification; metal-free DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-16 US disclosed
US-7655743-B2 Process for producing photoresist polymeric compounds DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2010-02-02 US disclosed
US-20080268377-A1 PROCESS FOR PRODUCING PHOTORESIST POLYMERIC COMPOUNDS WATANABE HITOSHI 2008-10-30 US disclosed
EP-1491560-B1 PROCESS FOR THE PRODUCTION OF HIGH-MOLECULAR COMPOUNDS FOR PHOTORESIST DAICEL CHEM (JP) 2007-11-21 EP disclosed
US-7205090-B2 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-04-17 US disclosed
US-7205090-B2 Chemical amplification type positive resist composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-04-17 US disclosed
US-20060116494-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-20060116493-A1 Process for producing photoresist polymeric compounds WATANABE HITOSHI 2006-06-01 US disclosed
US-7015291-B2 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2006-03-21 US disclosed
US-20050100815-A1 Process for the production of high-molecular compounds for photoresist DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-05-12 US disclosed