Water

Water

SCHEMBL3305448

C[N+](C)(CCCCO)CCCCO.[OH-]

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ

The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 6/20 0.56
HTT P42858 1/20 0.48
SMN1; SMN2 Q16637 1/20 0.40
LMNA P02545 3/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
ALDH1A1 P00352 1/20 0.38
HSD17B10 Q99714 1/20 0.38
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21405564 0.97 DNM1 (0.59) DNM1HTTSMN1; SMN2LMNAMEN1
SCHEMBL21405559 0.94 DNM1 (0.64) DNM1HTTSMN1; SMN2LMNAMEN1
Hydrochloric Acid SCHEMBL27788022 0.91 DNM1 (0.54) DNM1HTTSMN1; SMN2
SCHEMBL12938338 0.91 DNM1 (0.61) DNM1HTTLMNAMEN1KMT2A
Bromide SCHEMBL28098242 0.91 DNM1 (0.58) DNM1HTTSMN1; SMN2LMNAMEN1
Water SCHEMBL7054484 0.91 DNM1 (0.61) DNM1HTTSMN1; SMN2LMNAMEN1
Water SCHEMBL2779681 0.90 DNM1 (0.52) DNM1HTTLMNAMEN1KMT2A
Hydrochloric Acid SCHEMBL31013624 0.88 DNM1 (0.65) DNM1HTTSMN1; SMN2LMNAMEN1
SCHEMBL12938339 0.88 DNM1 (0.64) DNM1HTTSMN1; SMN2LMNAMEN1
SCHEMBL6832657 0.87 DNM1 (0.55) DNM1HTTLMNAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8349207-B2 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device JSR CORPORATION (JP) 2013-01-08 US disclosed
US-20100099260-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHNG AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR CORPORATION (JP) 2010-04-22 US disclosed
EP-2131389-A1 AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD FOR SEMICONDUCTOR DEVICE JSR Corporation (JP) 2009-12-09 EP disclosed
US-20040077512-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2004-04-22 US disclosed
US-6716803-B2 HAVING COPPER WIRINGS ON ITS SURFACE, COMPRISING A NONIONIC SURFACTANT, ESPECIALLY A POLYOXYALKYLENE COMPOUNDS CONTAINING AN ACETYLENIC GROUP. WAKO PURE CHEMCIAL INDUSTRIES, LTD. (JP) 2004-04-06 US disclosed
US-6534458-B1 This invention relates to a cleaning agent for a semi-conductor substrate, particularly, one having copper wirings on its surface, comprising a nonionic surfactant and a method for cleaning the same. control a speed of etching on WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2003-03-18 US disclosed
US-20020016272-A1 Cleaning agent for a semi-conductor substrate WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2002-02-07 US disclosed
US-6310019-B1 COMPRISING NONIONIC SURFACTANT; FOR CLEANING SURFACE HAVING COPPER WIRINGS; CORROSION RESISTANCE WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) 2001-10-30 US disclosed