SCHEMBL331305

SCHEMBL331305

O=C1C=CC(=O)N1c1ccc(S(=O)(=O)c2ccc(N3C(=O)C=CC3=O)cc2)cc1

nearest known ligand 0.68

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 16/20 0.68
FAAH O00519 6/20 0.68
HSP90AA1 P07900 3/20 0.56
TDP1 Q9NUW8 2/20 0.56
PKM P14618 1/20 0.56
MAPK1 P28482 1/20 0.56
NPSR1 Q6W5P4 1/20 0.56
ALDH1A1 P00352 1/20 0.53
LMNA P02545 1/20 0.53
CCR6 P51684 1/20 0.53
CACNA1B Q00975 1/20 0.53
APBA1 Q02410 1/20 0.53
APOBEC3G Q9HC16 1/20 0.53
BCHE P06276 1/20 0.50
DDAH1 O94760 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9718403 1.00 MGLL (0.68) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL24119970 0.92 MGLL (0.63) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL27043314 0.89 MGLL (0.66) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL332770 0.89 MGLL (0.66) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL27043316 0.84 MGLL (0.60) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL8396902 0.83 MGLL (0.49) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL1830817 0.83 MGLL (0.62) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL32665177 0.83 MGLL (0.62) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL28752490 0.83 MGLL (0.62) MGLLFAAHHSP90AA1TDP1PKM
SCHEMBL1632277 0.83 CA1 (0.63) MGLLFAAHHSP90AA1TDP1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 975 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 CN claimed
EP-4380922-A1 NOVEL BISMALEIMIDE COMPOUNDS HAVING IMPROVED SOLUBILITY AND THEIR USE IN CURABLE COMPOSITIONS Evonik Operations GmbH (DE) 2024-06-12 EP claimed
US-20240084135-A1 RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD PREPARED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2024-03-14 US claimed
EP-3632941-B1 RESIN COMPOSITION CUBICURE GMBH (AT) 2023-08-23 EP claimed
WO-2023011938-A1 NOVEL BISMALEIMIDE COMPOUNDS HAVING IMPROVED SOLUBILITY AND THEIR USE IN CURABLE COMPOSITIONS EVONIK OPERATIONS GMBH (DE) 2023-02-09 WO claimed
US-20210237375-A1 EX-SITU PREPARATION METHOD FOR LIQUID MOLDING COMPOSITE MATERIAL NINGBO NOTTINGHAM NEW MATERIALS INSTITUTE CO., LTD. (CN) 2021-08-05 US claimed
US-11059938-B2 Film composition and a film prepared thereby INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2021-07-13 US claimed
US-11008456-B2 Resin composition and uses of the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-05-18 US claimed
US-20200291228-A1 RESIN COMPOSITION AND USES OF THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2020-09-17 US claimed
CN-105647118-B Resin composition, and prepreg, laminate, and printed wiring board using same 日立化成株式会社 2020-06-26 CN claimed
EP-0131027-A1 CURABLE THERMOSETTING PREPOLYMERISED IMIDE RESIN COMPOSITIONS. SECR DEFENCE BRIT (GB) 1985-01-16 EP claimed
WO-1984002528-A1 CURABLE THERMOSETTING PREPOLYMERISED IMIDE RESIN COMPOSITIONS SECR DEFENCE BRIT (GB) 1984-07-05 WO claimed
US-4404330-A ACRYLONITRILE-BUTADIENE COPOLYMER OR TERPOLYMER AND CYANATE ESTER COMPOUNDS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-09-13 US claimed
US-4403073-A MODIFIED POLYBUTADIENE AND ISOCYANATE ESTER; HEAT RESISTANCE; FLEXIBILITY; ELASTICITY MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-09-06 US claimed
US-4396745-A POLYFUNCTIONAL AROMATIC CYANATE, RUBBER MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-08-02 US claimed
US-4396679-A Plastic articles suitable for electroless plating MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-08-02 US claimed
US-4356227-A AMINO ACID HYDRAZIDE-MODIFIED UNSATURATED BISIMIDE POLYMER; LAMINATION; MECHANICAL PROPERTIES TECHNOCHEMIE GMBH (DE) 1982-10-26 US claimed
US-4303779-A Thermosetting imide resins from dihydrazide TECHNOCHEMIE GMBH-VERFAHRENSTECHNIK (DE) 1981-12-01 US claimed
US-4276352-A Reinforced composites containing unsaturated polyimide resins CIBA-GEIGY CORPORATION (US) 1981-06-30 US claimed
US-4211860-A N,N*-BISMALEIMIDE TECHNOCHEMIE GMBH VERFAHRENSTECHNIK (DE) 1980-07-08 US claimed