Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.66 |
| ▸ | FAAH | O00519 | 5/20 | 0.54 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.50 |
| ▸ | HTT | P42858 | 3/20 | 0.50 |
| ▸ | PKM | P14618 | 3/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.50 |
| ▸ | LMNA | P02545 | 2/20 | 0.50 |
| ▸ | CCR6 | P51684 | 2/20 | 0.50 |
| ▸ | MEN1 | O00255 | 1/20 | 0.50 |
| ▸ | HPGD | P15428 | 1/20 | 0.50 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.50 |
| ▸ | ATM | Q13315 | 1/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.46 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.46 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.44 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.44 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.44 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27043314 | 1.00 | MGLL (0.66) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL27043316 | 0.95 | MGLL (0.60) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL27043308 | 0.91 | MGLL (0.64) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL27043311 | 0.91 | MGLL (0.55) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL9718403 | 0.89 | MGLL (0.68) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL331305 | 0.89 | MGLL (0.68) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL27043298 | 0.88 | MGLL (0.53) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL487033 | 0.87 | MGLL (0.84) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL331752 | 0.87 | MGLL (0.84) | MGLLFAAHHSP90AA1HTTPKM | |
| SCHEMBL4385482 | 0.87 | MGLL (0.84) | MGLLFAAHHSP90AA1HTTPKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 261 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| EP-4663669-A1 | FLAME RETARDANT AND USE THEREOF | SHIKOKU CHEMICALS CORPORATION (JP) | 2025-12-17 | — | — | EP | disclosed |
| US-20250326893-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250326929-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250287499-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2025-09-11 | — | — | US | disclosed |
| US-20250188263-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-06-12 | — | — | US | disclosed |
| CN-120051648-A | Rubber composition for rubber layer of laminated hose, and laminated hose for motor vehicle | 住友理工株式会社 | 2025-05-27 | — | — | CN | disclosed |
| WO-2025105439-A1 | CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105440-A1 | CURABLE COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MOLDED ARTICLE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| EP-4527860-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2025-03-26 | — | — | EP | disclosed |
| US-5667899-A | SELF-SUPPORTING BONDING FILM OF POLYIMIDES | HITACHI CHEMICAL CO. LTD. (JP) | 1997-09-16 | — | — | US | disclosed |
| US-5605763-A | POLYIMIDE; SEMICONDUCTORS | HITACHI CHEMICAL COMPANY LTD. (JP) | 1997-02-25 | — | — | US | disclosed |
| EP-0488389-B1 | Prepregs, process for producing the same and laminates produced with the same | MITSUBISHI RAYON CO (JP) | 1996-10-16 | — | — | EP | disclosed |
| EP-0471522-B1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS (JP) | 1995-12-13 | — | — | EP | disclosed |
| US-5279893-A | Fiber reinforced composite | MITSUBISHI RAYON CO., LTD. (JP) | 1994-01-18 | — | — | US | disclosed |
| US-5266654-A | Polymaleimide, phenolic resin with xylylene groups, epoxy resin | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-11-30 | — | — | US | disclosed |
| EP-0488389-A2 | Prepregs, process for producing the same and laminates produced with the same | MITSUBISHI RAYON CO., LTD. (JP) | 1992-06-03 | — | — | EP | disclosed |
| EP-0471522-A1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-02-19 | — | — | EP | disclosed |
| US-5087766-A | Reacting phenol with allyl halide; claisen rearrangement | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1992-02-11 | — | — | US | disclosed |
| EP-0394949-A2 | Process for producing allylsubstituted phenol compound and the product | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1990-10-31 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | CD79B, C1R, TGFBR1 | MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.