Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 4/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | MEN1 | O00255 | 3/20 | 0.42 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.42 |
| ▸ | POLB | P06746 | 1/20 | 0.40 |
| ▸ | CFTR | P13569 | 1/20 | 0.39 |
| ▸ | AOX1 | Q06278 | 1/20 | 0.39 |
| ▸ | ACHE | P22303 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.37 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.37 |
| ▸ | USP2 | O75604 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.37 |
| ▸ | CA1 | P00915 | 1/20 | 0.37 |
| ▸ | CA2 | P00918 | 1/20 | 0.37 |
| ▸ | CA4 | P22748 | 1/20 | 0.37 |
| ▸ | CA5A | P35218 | 1/20 | 0.37 |
| ▸ | CA7 | P43166 | 1/20 | 0.37 |
| ▸ | CA9 | Q16790 | 1/20 | 0.37 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL331585 | 1.00 | L3MBTL1 (0.42) | L3MBTL1TDP1MEN1KMT2APOLB | |
| SCHEMBL18935750 | 0.82 | TSHR (0.42) | L3MBTL1MEN1KMT2APOLBCFTR | |
| SCHEMBL779341 | 0.79 | L3MBTL1 (0.47) | L3MBTL1TDP1MEN1KMT2APOLB | |
| SCHEMBL9001600 | 0.74 | L3MBTL1 (0.51) | L3MBTL1TDP1MEN1KMT2ATSHR | |
| SCHEMBL23528299 | 0.71 | L3MBTL1 (0.46) | L3MBTL1TDP1MEN1KMT2AHTT | |
| SCHEMBL30627057 | 0.71 | L3MBTL1 (0.52) | L3MBTL1TDP1MEN1KMT2ACFTR | |
| SCHEMBL18486575 | 0.71 | MEN1 (0.41) | L3MBTL1MEN1KMT2ACFTRAOX1 | |
| SCHEMBL18486534 | 0.71 | MEN1 (0.41) | L3MBTL1MEN1KMT2ACFTRAOX1 | |
| SCHEMBL18486579 | 0.71 | MEN1 (0.41) | L3MBTL1MEN1KMT2ACFTRAOX1 | |
| SCHEMBL18486535 | 0.71 | MEN1 (0.41) | L3MBTL1MEN1KMT2ACFTRAOX1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 130 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4745198-A1 | RESIN COMPOSITION, MOLDED ARTICLE, RESIN ADDITIVE COMPOSITION, METHOD FOR PRODUCING RESIN COMPOSITION, METHOD FOR IMPROVING CRYSTALLINITY OF CRYSTALLINE RESIN, AND MATERIAL FOR RESIN ADDITIVE COMPOSITION | ADEKA CORPORATION (JP) | 2026-05-20 | — | — | EP | disclosed |
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-23 | — | — | US | disclosed |
| EP-4729563-A1 | HEAT-CURABLE RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD., (JP) | 2026-04-22 | — | — | EP | disclosed |
| US-20260002014-A1 | RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | ADEKA CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-12435205-B2 | Resin composition and molded article thereof | ADEKA CORPORATION (JP) | 2025-10-07 | — | — | US | disclosed |
| EP-4130197-B1 | FLAME RETARDANT COMPOSITION, FLAME-RESISTANT SYNTHETIC RESIN COMPOSITION, AND MOLDED BODY | ADEKA CORP (JP) | 2025-10-01 | — | — | EP | disclosed |
| EP-3904446-B1 | NUCLEATING AGENT FOR POLYOLEFIN RESIN, NUCLEATING AGENT COMPOSITION FOR POLYOLEFIN RESIN CONTAINING SAME, MASTER BATCH FOR POLYOLEFIN RESIN, POLYOLEFIN RESIN COMPOSITION, MOLDED ARTICLE THEREOF, FILM THEREOF, METHOD FOR PRODUCING POROUS FILM, AND PACKAGE | ADEKA CORP (JP) | 2025-07-30 | — | — | EP | disclosed |
| CN-116285378-B | Resin composition, adhesive sheet containing same, and metal foil-clad laminate | 广东生益科技股份有限公司 | 2025-05-16 | — | — | CN | disclosed |
| US-12264224-B2 | Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package | RESONAC CORPORATION (JP) | 2025-04-01 | — | — | US | disclosed |
| US-20250084205-A1 | RESIN COMPOSITION | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-03-13 | — | — | US | disclosed |
| EP-3246352-A1 | RESIN COMPOSITION, SUPPORT WITH RESIN LAYER, PREPREG, LAMINATE, MULTILAYERED PRINTED WIRING BOARD, AND PRINTED WIRING BOARD FOR MILLIMETER-WAVE RADAR | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-11-22 | — | — | EP | disclosed |
| EP-2141198-B1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | HITACHI CHEMICAL CO LTD (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-20170051109-A1 | POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2017-02-23 | — | — | US | disclosed |
| EP-3127936-A1 | POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2017-02-08 | — | — | EP | disclosed |
| EP-1985654-B1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2013-04-10 | — | — | EP | disclosed |
| US-20130040153-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | FUJIMOTO DAISUKE (JP) | 2013-02-14 | — | — | US | disclosed |
| EP-2546287-A1 | Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2013-01-16 | — | — | EP | disclosed |
| EP-2407503-A1 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2012-01-18 | — | — | EP | disclosed |
| EP-2141198-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260109860-A1 | HEAT-CURABLE RESIN COMPOSITION | RAD51, COL2A1, SEM1 | L3MBTL1 1635/4885TDP1 810/4885MEN1 355/4885 |
| US-20260002014-A1 | RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | NXF1, NOP2, RTF1 | L3MBTL1 3422/4885TDP1 555/4885MEN1 2827/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.