SCHEMBL331778

SCHEMBL331778

Cc1cccc(C)c1N1C(=O)C=CC1=O

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 9/20 0.59
HSP90AA1 P07900 2/20 0.50
FAAH O00519 2/20 0.48
DPP4 P27487 3/20 0.47
TLR9 Q9NR96 1/20 0.46
ANPEP P15144 2/20 0.46
MEN1 O00255 1/20 0.44
ALDH1A1 P00352 1/20 0.44
POLB P06746 1/20 0.44
KMT2A Q03164 1/20 0.44
PTGS1 P23219 1/20 0.44
PTGS2 P35354 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.42
ADRA2A P08913 1/20 0.41
DRD4 P21917 1/20 0.41
HRH2 P25021 1/20 0.41
HTR7 P34969 1/20 0.41
OPRK1 P41145 1/20 0.41
HTR2B P41595 1/20 0.41
SLC6A3 Q01959 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9336242 0.88 MGLL (0.48) MGLLHSP90AA1FAAHDPP4ANPEP
SCHEMBL9067136 0.87 MGLL (0.68) MGLLHSP90AA1FAAHTLR9MEN1
SCHEMBL29737472 0.86 MGLL (0.50) MGLLHSP90AA1FAAHDPP4TLR9
SCHEMBL11878725 0.86 MGLL (0.50) MGLLHSP90AA1FAAHTLR9MEN1
SCHEMBL30302476 0.84 MGLL (0.56) MGLLHSP90AA1FAAHDPP4TLR9
SCHEMBL3674228 0.84 MGLL (0.56) MGLLHSP90AA1FAAHDPP4TLR9
SCHEMBL3675670 0.82 MGLL (0.56) MGLLHSP90AA1FAAHDPP4ANPEP
Methane SCHEMBL28428548 0.82 MGLL (0.55) MGLLHSP90AA1FAAHDPP4TLR9
SCHEMBL10883538 0.81 MGLL (0.46) MGLLHSP90AA1FAAHDPP4TLR9
SCHEMBL3040777 0.80 MGLL (0.44) MGLLHSP90AA1FAAHDPP4TLR9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 950 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12617895-B2 Resin composition and article made therefrom ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD. (CN) 2026-05-05 US claimed
US-20260117065-A1 INSULATING RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) 2026-04-30 US claimed
US-20260117046-A1 PHOSPHORUS-CONTAINING COMPOUND, METHOD OF PREPARING THE SAME, RESIN COMPOSITION AND ARTICLE MADE THEREFROM ELITE ELECTRONIC MAT ZHONGSHAN CO LTD (CN) 2026-04-30 US claimed
US-20250361404-A1 RESIN COMPOSITION AND ARTICLE MADE THEREFROM Elite Material Co., Ltd. (TW) 2025-11-27 US claimed
CN-119775702-A Bismaleimide resin composition and application thereof 广东盈骅新材料科技有限公司 2025-04-08 CN claimed
CN-119775773-A Resin composition and preparation method thereof, prepreg, laminated board and printed circuit board 广东盈骅新材料科技有限公司 2025-04-08 CN claimed
CN-119735876-A Resin composition and preparation method thereof, prepreg, laminated board and printed circuit board 广东盈骅新材料科技有限公司 2025-04-01 CN claimed
CN-119684793-A Organosilicon modified bismaleimide resin and preparation method and application thereof 广东盈骅新材料科技有限公司 2025-03-25 CN claimed
US-20250084199-A1 ALLYL-TYPE FLAME-RETARDANT PREPOLYMER, RESIN COMPOSITION, COMPOSITE RESIN, PREPREG AND LAMINATE RESEARCH INSTITUTE OF TSINGHUA, PEARL RIVER DELTA (CN) 2025-03-13 US claimed
US-20250059369-A1 RESIN COMPOSITION, AND PREPARATION METHOD THEREFOR AND APPLICATION THEREOF Guangdong Hinno-tech Co., Ltd. (CN) 2025-02-20 US claimed
EP-1985654-A1 THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME Hitachi Chemical Co., Ltd. (JP) 2008-10-29 EP claimed
US-20080160405-A1 Battery electrode paste composition containing modified maleimides INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 2008-07-03 US claimed
CN-101210077-A Halogen-free high-temperature-resistant composition IND TECH RES INST (CN) 2008-07-02 CN claimed
WO-2008077141-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2008-06-26 WO claimed
US-20080146706-A1 Halogen-free and thermal resistant composition INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 2008-06-19 US claimed
US-20080146738-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. 2008-06-19 US claimed
US-5629397-A GLASS TRANSITION TEMPERATURE, COLORLESS DSM CHEMIE LINZ GMBH (AT) 1997-05-13 US claimed
EP-0628578-A2 2,6-Dimethylphenylphenymaleimide as comonomer in the copolymerisation of styrene or vinyl chlorid DSM Chemie Linz GmbH (AT) 1994-12-14 EP claimed
EP-0463432-B1 Binder for magnetic recording medium SEIKISUI CHEMICAL CO LTD (JP) 1994-05-11 EP claimed
EP-0463432-A1 Binder for magnetic recording medium SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1992-01-02 EP claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12617895-B2 Resin composition and article made therefrom PBRM1, PCNA, COPE MGLL 1366/4885HSP90AA1 1335/4885FAAH 3669/4885
US-20260117065-A1 INSULATING RESIN COMPOSITION AND ARTICLE MADE THEREFROM RPTOR, RICTOR, PRPF6 MGLL 2724/4885HSP90AA1 3589/4885FAAH 4030/4885
US-20260117046-A1 PHOSPHORUS-CONTAINING COMPOUND, METHOD OF PREPARING THE SAME, RESIN COMPOSITION AND ARTICLE MADE THEREFROM PTH1R, ITGAM, TERB1 MGLL 4793/4885HSP90AA1 1796/4885FAAH 4228/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.