Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 14/20 | 0.64 |
| ▸ | FAAH | O00519 | 5/20 | 0.52 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.49 |
| ▸ | LMNA | P02545 | 3/20 | 0.49 |
| ▸ | PKM | P14618 | 2/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.49 |
| ▸ | CCR6 | P51684 | 2/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.49 |
| ▸ | HPGD | P15428 | 1/20 | 0.49 |
| ▸ | HTT | P42858 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.49 |
| ▸ | ATM | Q13315 | 1/20 | 0.49 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.44 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.44 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.41 |
| ▸ | BCHE | P06276 | 1/20 | 0.40 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.40 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.40 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25960468 | 0.92 | MGLL (0.59) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL19511791 | 0.89 | MGLL (0.65) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL486869 | 0.86 | MGLL (0.55) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL4385482 | 0.85 | MGLL (0.84) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL331752 | 0.85 | MGLL (0.84) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL487033 | 0.85 | MGLL (0.84) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL9245833 | 0.80 | MGLL (0.75) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL3675014 | 0.78 | MGLL (1.00) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL27043314 | 0.77 | MGLL (0.66) | MGLLFAAHHSP90AA1LMNAPKM | |
| SCHEMBL332770 | 0.77 | MGLL (0.66) | MGLLFAAHHSP90AA1LMNAPKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 160 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2026-03-12 | — | — | US | disclosed |
| US-20250326893-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250326929-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-10-23 | — | — | US | disclosed |
| US-20250287499-A1 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORPORATION (JP) | 2025-09-11 | — | — | US | disclosed |
| US-20250188263-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | RESONAC CORP (JP) | 2025-06-12 | — | — | US | disclosed |
| WO-2025105440-A1 | CURABLE COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MOLDED ARTICLE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| WO-2025105439-A1 | CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2025-05-22 | — | — | WO | disclosed |
| EP-4527860-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | Resonac Corporation (JP) | 2025-03-26 | — | — | EP | disclosed |
| CN-119698440-A | Compound, resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package | 株式会社力森诺科 | 2025-03-25 | — | — | CN | disclosed |
| WO-2025033356-A1 | ADHESIVE FILM, ADHESIVE FILM WITH METAL LAYER, MEMBER FOR WIRING FORMATION, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMING MEMBER | 株式会社レゾナック | 2025-02-13 | — | — | WO | disclosed |
| EP-2412743-A1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-02-01 | — | — | EP | disclosed |
| CN-102336935-A | Thermocurable resin composition comprising semi-ipn-type complex, and varnish, prepreg and metal-clad laminate sheet using the same | HITACHI CHEMICAL CO LTD | 2012-02-01 | — | — | CN | disclosed |
| EP-2407503-A1 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Hitachi Chemical Co., Ltd. (JP) | 2012-01-18 | — | — | EP | disclosed |
| US-20100233495-A1 | Thermosetting Resin Composition of Semi-IPN Composite, and Varnish, Prepreg and Metal Clad Laminated Board Using the Same | RESONAC CORPORATION (JP) | 2010-09-16 | — | — | US | disclosed |
| US-20100129676-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | RESONAC CORPORATION (JP) | 2010-05-27 | — | — | US | disclosed |
| EP-2141198-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| EP-1985654-A1 | THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2008-10-29 | — | — | EP | disclosed |
| EP-0471522-B1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS (JP) | 1995-12-13 | — | — | EP | disclosed |
| US-5266654-A | Polymaleimide, phenolic resin with xylylene groups, epoxy resin | MITSUI TOATSU CHEMICALS, INCORPORATED (JP) | 1993-11-30 | — | — | US | disclosed |
| EP-0471522-A1 | Resin composition based on polymaleimide and phenolic aralkyl resin | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1992-02-19 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260071011-A1 | COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | CD79B, C1R, TGFBR1 | MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.