SCHEMBL486869

SCHEMBL486869

O=C1C=CC(=O)N1c1cccc(Oc2ccc([S+]([O-])c3ccc(Oc4cccc(N5C(=O)C=CC5=O)c4)cc3)cc2)c1

nearest known ligand 0.55

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 13/20 0.55
FAAH O00519 5/20 0.51
HSP90AA1 P07900 4/20 0.45
HPN P05981 1/20 0.44
ALDH1A1 P00352 2/20 0.44
PKM P14618 2/20 0.44
HTT P42858 2/20 0.44
ATM Q13315 2/20 0.44
LPAR1 Q92633 1/20 0.38
LPAR5 Q9H1C0 1/20 0.38
LPAR3 Q9UBY5 1/20 0.38
MEN1 O00255 1/20 0.36
LMNA P02545 1/20 0.36
HPGD P15428 1/20 0.36
CCR6 P51684 1/20 0.36
KMT2A Q03164 1/20 0.36
BRD4 O60885 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29391228 0.87 MGLL (0.70) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL487151 0.87 MGLL (0.70) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL29754402 0.87 MGLL (0.70) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL9491223 0.87 MGLL (0.70) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL332808 0.86 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL2120468 0.84 MGLL (0.77) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL2120164 0.84 MGLL (0.72) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL24119952 0.83 MGLL (0.74) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL331306 0.83 MGLL (0.64) MGLLFAAHHSP90AA1HPNALDH1A1
SCHEMBL30793027 0.83 MGLL (0.64) MGLLFAAHHSP90AA1HPNALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 166 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0372775-B1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS (JP) 1994-05-18 EP claimed
US-4968762-A IMPACT STRENGTH, TOUGHNESS, LOW WATER ABSORPTION MITSUI TOATSU CHEMICALS, INC. (JP) 1990-11-06 US claimed
EP-0372775-A1 Thermosetting-resin-forming compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-06-13 EP claimed
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2026-03-12 US disclosed
US-20250326893-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-20250326929-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-20250287499-A1 PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORPORATION (JP) 2025-09-11 US disclosed
US-20250188263-A1 RESIN COMPOSITION, PREPREG, LAMINATED BOARD, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-06-12 US disclosed
WO-2025105439-A1 CURABLE COMPOSITION FOR PREPREG, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE 株式会社レゾナック 2025-05-22 WO disclosed
WO-2025105440-A1 CURABLE COMPOSITION, PREPREG, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND MOLDED ARTICLE 株式会社レゾナック 2025-05-22 WO disclosed
EP-4527860-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE Resonac Corporation (JP) 2025-03-26 EP disclosed
EP-0359500-A2 Resin compositions for sealing semiconductors MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-03-21 EP disclosed
CN-1037721-A Compositions of thermosetting resin MITSUI TOATSU CHEMICALS (JP) 1989-12-06 CN disclosed
EP-0342912-A1 Thermosetting resin compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
EP-0342943-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-23 EP disclosed
US-4831102-A Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and polyarylene diamine MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1989-05-16 US disclosed
EP-0294931-A1 Self-lubricating thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0294930-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-14 EP disclosed
EP-0288251-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-10-26 EP disclosed
EP-0253586-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-20 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE CD79B, C1R, TGFBR1 MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.