SCHEMBL333857

SCHEMBL333857

CC(C)Cc1ccc2sc3ccccc3c(=O)c2c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 3/20 0.54
MAPT P10636 5/20 0.54
ALDH1A1 P00352 5/20 0.54
NPC1 O15118 3/20 0.54
RAB9A P51151 3/20 0.54
L3MBTL1 Q9Y468 2/20 0.54
TDP1 Q9NUW8 1/20 0.54
MAOA P21397 1/20 0.43
MAOB P27338 1/20 0.43
PTGS2 P35354 1/20 0.42
HCRTR1 O43613 2/20 0.41
POLB P06746 2/20 0.41
LMNA P02545 1/20 0.41
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
HPGD P15428 2/20 0.40
GAA P10253 1/20 0.40
CYP1A2 P05177 1/20 0.40
CYP3A4 P08684 1/20 0.40
CYP2C9 P11712 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22009280 0.91 ALDH1A1 (0.47) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL17710557 0.88 KDM4E (0.55) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL17710469 0.88 MAPT (0.51) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL17710572 0.88 MAPT (0.51) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL18573507 0.87 GPR3 (0.48) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL11046756 0.85 MAPT (0.51) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL166961 0.83 KDM4E (0.58) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL29422893 0.83 KDM4E (0.58) KDM4EMAPTALDH1A1NPC1RAB9A
SCHEMBL24476988 0.82 GABRA1 (0.46) KDM4EMAPTALDH1A1RAB9ATDP1
SCHEMBL21298881 0.81 ALDH1A1 (0.49) KDM4EMAPTALDH1A1RAB9AL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260035490-A1 PHOTOPOLYMERIZATION SYNERGIST Piedmont Chemical Industries I, LLC 2026-02-05 US claimed
CN-119556524-A Negative photosensitive resin composition for spacer 上海玟昕科技有限公司 2025-03-04 CN claimed
US-11421049-B2 Photopolymerization synergist Piedmont Chemical Industries, LLC (US) 2022-08-23 US claimed
WO-2021096751-A1 PHOTOPOLYMERIZATION SYNERGIST Piedmont Chemical Industries, LLC (US) 2021-05-20 WO claimed
US-20210139616-A1 Photopolymerization Synergist Piedmont Chemical Industries, LLC 2021-05-13 US claimed
CN-101432375-B Paste composition for printing DONGJIN SEMICHEM CO LTD 2013-05-08 CN claimed
US-8098012-B2 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD. (KR) 2012-01-17 US claimed
US-20090317604-A1 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD. (KR) 2009-12-24 US claimed
US-7588877-B2 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD. (KR) 2009-09-15 US claimed
CN-101432375-A Paste composition for printing DONGJIN SEMICHEM CO LTD (KR) 2009-05-13 CN claimed
US-7378223-B2 a) an acrylate monomer having two urethane bonds, b) a crosslinkable urethane monomer having at least two ethylene double bonds, c) an alkali-soluble cellulose ester compound, d) a photopolymerization initiator selected from triazines, benzophenones, acetonphenones, phosphine oxides e) a solvent(MEK) DONGJIN SEMICHEM, CO., LTD. (KR) 2008-05-27 US claimed
US-7300606-B2 Pb free Ag paste composition for PDP address electrode DONGJIN SEMICHEM CO., LTD. (KR) 2007-11-27 US claimed
WO-2007123324-A1 PASTE COMPOSITION FOR PRINTING DONGJIN SEMICHEM CO., LTD (KR) 2007-11-01 WO claimed
US-20070060729-A1 Photosensitive resin composition and dry film resist using the same DONGJIN SEMICHEM CO., LTD. (KR) 2007-03-15 US claimed
US-20060115767-A1 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD., A CORPORATION ORGANIZED UNDER THE LAWS OF THE REPUBLIC OF KOREA (KR) 2006-06-01 US claimed
US-20060011895-A1 Pb free Ag paste composition for PDP address electrode DONGJIN SEMICHEM CO., LTD. (KR) 2006-01-19 US claimed
US-20050255405-A1 Photoresist resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2005-11-17 US claimed
WO-2004099876-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM RESIST USING THE SAME DONGJIN SEMICHEM CO., LTD. (KR) 2004-11-18 WO claimed
WO-2004072736-A1 AG PASTE COMPOSITION FOR MICROELECTRODE FORMATION AND MICROELECTRODE FORMED USING THE SAME DONGJIN SEMICHEM CO. LTD. (KR) 2004-08-26 WO claimed
US-20260035490-A1 PHOTOPOLYMERIZATION SYNERGIST Piedmont Chemical Industries I, LLC 2026-02-05 US disclosed
US-12252627-B2 Photosensitive resin composition, film prepared from the same, and electronic apparatus including the film SAMSUNG DISPLAY CO., LTD. (KR) 2025-03-18 US disclosed
CN-119556524-A Negative photosensitive resin composition for spacer 上海玟昕科技有限公司 2025-03-04 CN disclosed
CN-109244104-B Optical filter of organic light emitting device and organic light emitting device including the same 东进世美肯株式会社 2024-09-17 CN disclosed
CN-108693712-B Photosensitive resin composition and electronic device including the same 三星显示有限公司 2023-03-28 CN disclosed
US-20220403179-A1 PHOTOSENSETIVE RESIN COMPOSITION, FILM PREPARED FROM THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE FILM SAMSUNG DISPLAY CO., LTD. (KR) 2022-12-22 US disclosed
CN-115437215-A Photosensitive resin composition, film prepared therefrom, and electronic device including the film 三星显示有限公司 2022-12-06 CN disclosed
US-11421049-B2 Photopolymerization synergist Piedmont Chemical Industries, LLC (US) 2022-08-23 US disclosed
CN-106959582-B Photosensitive resin composition, film prepared using the same, and OLED device including the film 三星显示有限公司 2021-11-12 CN disclosed
WO-2021096751-A1 PHOTOPOLYMERIZATION SYNERGIST Piedmont Chemical Industries, LLC (US) 2021-05-20 WO disclosed
US-20210139616-A1 Photopolymerization Synergist Piedmont Chemical Industries, LLC 2021-05-13 US disclosed
CN-108020988-B Photosensitive resin composition and dry film photoresist containing same 长春人造树脂厂股份有限公司 2020-11-24 CN disclosed
US-10775698-B2 Photosensitive resin composition and electronic device including cured product of pattern-forming composition including the photosensitive resin composition SAMSUNG DISPLAY CO., LTD. (KR) 2020-09-15 US disclosed
EP-3407134-B1 PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE INCLUDING CURED PRODUCT OF PATTERN-FORMING COMPOSITION INCLUDING THE PHOTOSENSITIVE RESIN COMPOSITION SAMSUNG DISPLAY CO LTD (KR) 2020-01-29 EP disclosed
EP-3407134-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE INCLUDING CURED PRODUCT OF PATTERN-FORMING COMPOSITION INCLUDING THE PHOTOSENSITIVE RESIN COMPOSITION Samsung Display Co., Ltd. (KR) 2018-11-28 EP disclosed
US-20180292750-A1 PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE INCLUDING CURED PRODUCT OF PATTERN-FORMING COMPOSITION INCLUDING THE PHOTOSENSITIVE RESIN COMPOSITION SAMSUNG DISPLAY CO., LTD. (KR) 2018-10-11 US disclosed
US-10042253-B2 Photosensitive resin composition, film prepared by using the photosensitive resin composition, and organic light-emitting display device including the film SAMSUNG DISPLAY CO., LTD. (KR) 2018-08-07 US disclosed
US-20180037688-A1 CURABLE COMPOSITION FOR IMPRINTS, CURED PRODUCT, PATTERN FORMING METHOD, LITHOGRAPHY METHOD, PATTERN AND LITHOGRAPHY MASK FUJIFILM CORPORATION (JP) 2018-02-08 US disclosed
US-20170199454-A1 PHOTOSENSITIVE RESIN COMPOSITION, FILM PREPARED BY USING THE PHOTOSENSITIVE RESIN COMPOSITION, AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING THE FILM SAMSUNG DISPLAY CO., LTD. (KR) 2017-07-13 US disclosed
US-9678257-B2 Photoresist composition for green color filter SAMSUNG DISPLAY CO., LTD. (KR) 2017-06-13 US disclosed
US-20160327709-A1 PHOTORESIST COMPOSITION FOR GREEN COLOR FILTER SAMSUNG DISPLAY CO., LTD. (KR) 2016-11-10 US disclosed
EP-2458661-B1 Negative active material for rechargeable lithium battery, method of producing negative electrode and rechargeable lithium battery including the same SAMSUNG SDI CO LTD (KR) 2015-08-05 EP disclosed
CN-103193678-B Urethane acrylate low polymer and preparation method and application thereof ETERNAL GUANGZHOU ELECTRONIC MATERIAL CO LTD 2014-07-02 CN disclosed
US-20140111962-A1 TOUCH SCREEN PANEL DONGWOO FINE-CHEM CO., LTD. (KR) 2014-04-24 US disclosed
US-20140087064-A1 TOUCH SCREEN PANEL AND METHOD OF PREPARING THE SAME DONGWOO FINE-CHEM CO., LTD. (KR) 2014-03-27 US disclosed
US-20140075750-A1 TOUCH SCREEN PANEL AND METHOD OF PREPARING THE SAME DONGWOO FINE-CHEM CO., LTD. (KR) 2014-03-20 US disclosed
CN-102633984-B Polyurethane-acrylate oligomer, and synthesis method and application thereof ETERNAL GUANGZHOU ELECTRONIC MATERIAL CO LTD 2013-12-25 CN disclosed
CN-103193678-A Urethane acrylate low polymer and preparation method and application thereof ETERNAL GUANGZHOU ELECTRONIC MATERIAL CO LTD 2013-07-10 CN disclosed
CN-101432375-B Paste composition for printing DONGJIN SEMICHEM CO LTD 2013-05-08 CN disclosed
CN-102633984-A Polyurethane-acrylate oligomer, and synthesis method and application thereof ETERNAL GUANGZHOU ELECTRONIC MATERIAL CO LTD 2012-08-15 CN disclosed
US-20120135307-A1 NEGATIVE ACTIVE MATERIAL FOR RECHARGEABLE LITHIUM BATTERY, METHOD OF PRODUCING NEGATIVE ELECTRODE AND RECHARGEABLE LITHIUM BATTERY INCLUDING SAME SAMSUNG SDI., LTD. (KR) 2012-05-31 US disclosed
EP-2458661-A1 Negative active material for rechargeable lithium battery, method of producing negative electrode and rechargeable lithium battery including same Samsung SDI Co., Ltd. (KR) 2012-05-30 EP disclosed
US-8098012-B2 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD. (KR) 2012-01-17 US disclosed
CN-1749334-B Ink composition and color filter including the same SAMSUNG ELECTRONICS CO LTD 2011-04-06 CN disclosed
US-7811726-B2 Photoresist composition and method of manufacturing a color filter substrate by using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-10-12 US disclosed
US-7763402-B2 Photosensitive resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2010-07-27 US disclosed
US-20100021832-A1 PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A COLOR FILTER SUBSTRATE BY USING THE SAME TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2010-01-28 US disclosed
US-20090317604-A1 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD. (KR) 2009-12-24 US disclosed
US-7615322-B2 Photoresist composition and method of manufacturing a color filter substrate by using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-10 US disclosed
US-7611826-B2 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-11-03 US disclosed
US-7588877-B2 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD. (KR) 2009-09-15 US disclosed
US-20090191484-A1 PHOTOSENSITIVE RESIN COMPOSITION CONTROLLING SOLUBILITY AND PATTERN FORMATION METHOD OF DOUBLE-LAYER STRUCTURE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-07-30 US disclosed
CN-101432375-A Paste composition for printing DONGJIN SEMICHEM CO LTD (KR) 2009-05-13 CN disclosed
US-7378223-B2 a) an acrylate monomer having two urethane bonds, b) a crosslinkable urethane monomer having at least two ethylene double bonds, c) an alkali-soluble cellulose ester compound, d) a photopolymerization initiator selected from triazines, benzophenones, acetonphenones, phosphine oxides e) a solvent(MEK) DONGJIN SEMICHEM, CO., LTD. (KR) 2008-05-27 US disclosed
US-20080051483-A1 PHOTOSENSITIVE RESIN COMPOSITION DONGJIN SEMICHEM CO., LTD. (KR) 2008-02-28 US disclosed
US-20080044766-A1 a coloring agent including an anthraquinone-based dye and an organic pigment; a meta-cresol-formaldehyde novolak resin binder, hexakis/methoxymethyl/melamine crosslinker and propylene glycol methyl ether propionate as a solvent, benzophenone photopolymerization initiator; exposing to light, developing SAMSUNG ELECTRONICS CO., LTD. 2008-02-21 US disclosed
US-7300606-B2 Pb free Ag paste composition for PDP address electrode DONGJIN SEMICHEM CO., LTD. (KR) 2007-11-27 US disclosed
WO-2007123324-A1 PASTE COMPOSITION FOR PRINTING DONGJIN SEMICHEM CO., LTD (KR) 2007-11-01 WO disclosed
CN-100334506-C Photosensitive resin composition using photosensitive resin DONGJIN SEMIKAN CO LTD (KR) 2007-08-29 CN disclosed
US-20070060729-A1 Photosensitive resin composition and dry film resist using the same DONGJIN SEMICHEM CO., LTD. (KR) 2007-03-15 US disclosed
US-20060115767-A1 Photo-sensitive composition, photo-sensitive paste composition for barrier ribs comprising the same, and method for preparing barrier ribs for plasma display panel SAMSUNG SDI CO., LTD., A CORPORATION ORGANIZED UNDER THE LAWS OF THE REPUBLIC OF KOREA (KR) 2006-06-01 US disclosed
CN-1749334-A Composition for ink and the colour filter that comprises said composition SAMSUNG ELECTRONICS CO LTD (KR) 2006-03-22 CN disclosed
US-20060011895-A1 Pb free Ag paste composition for PDP address electrode DONGJIN SEMICHEM CO., LTD. (KR) 2006-01-19 US disclosed
US-20050255405-A1 Photoresist resin composition DONGJIN SEMICHEM CO., LTD. (KR) 2005-11-17 US disclosed
WO-2004099876-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM RESIST USING THE SAME DONGJIN SEMICHEM CO., LTD. (KR) 2004-11-18 WO disclosed
WO-2004072736-A1 AG PASTE COMPOSITION FOR MICROELECTRODE FORMATION AND MICROELECTRODE FORMED USING THE SAME DONGJIN SEMICHEM CO. LTD. (KR) 2004-08-26 WO disclosed
US-20040115558-A1 Photosensitive resin composition controlling solubility and pattern formation method of double-layer structure using the same DONGJIM SEMICHEM CO., LTD. (KR) 2004-06-17 US disclosed
CN-1497343-A Photoresist compound using photoresist 东进瑟弥侃株式会社 2004-05-19 CN disclosed
CN-1497343-A Photoresist compound using photoresist 东进瑟弥侃株式会社 2004-05-19 CN disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260035490-A1 PHOTOPOLYMERIZATION SYNERGIST EEF1D, ARCN1, RPS4Y1 KDM4E 284/4885MAPT 749/4885ALDH1A1 788/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.