Known targets — ChEMBL curated mechanism
AGTR1DHFRGABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTNR3C2PBP2XPTGS1PTGS2VKORC1blablaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAftsImrcAmrcBmrdApbp1apbp1bpbp2apbp2bpbp3polthyA
The experimentally established mechanism targets of Potassium Ion. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Potassium Ion SCHEMBL9872003 | 0.91 | CA1 (0.43) | — | |
| SCHEMBL11061081 | 0.89 | CA1 (0.60) | — | |
| Potassium Ion SCHEMBL1331713 | 0.89 | — | — | |
| Potassium Ion SCHEMBL1811073 | 0.89 | — | — | |
| Potassium Ion SCHEMBL1332472 | 0.89 | — | — | |
| Potassium Ion SCHEMBL4239524 | 0.89 | CA1 (0.60) | — | |
| Potassium Ion SCHEMBL1284 | 0.89 | — | — | |
| SCHEMBL17438 | 0.89 | — | — | |
| Potassium Ion SCHEMBL1332522 | 0.89 | — | — | |
| SCHEMBL11759143 | 0.89 | CA1 (0.60) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 267 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025095846-A1 | PREPARATION OF METALLENES | KASHIWAYA SHUN (SE) | 2025-05-08 | — | — | WO | claimed |
| CN-119946994-A | Ultra-thin copper foil with carrier and manufacturing method thereof | 南亚塑胶工业股份有限公司 | 2025-05-06 | — | — | CN | claimed |
| US-20250137155-A1 | CARRIER-ATTACHED ULTRA-THIN COPPER FOIL AND METHOD FOR PRODUCING THE SAME | NAN YA PLASTICS CORPORATION (TW) | 2025-05-01 | — | — | US | claimed |
| CN-117410556-A | Preparation method, product and application of modified polymer electrolyte | 西安工业大学 | 2024-01-16 | — | — | CN | claimed |
| CN-107447237-B | Slip ring with reduced contact noise | 史莱福灵有限公司 | 2021-04-20 | — | — | CN | claimed |
| CN-109985648-A | Porous cubic double-metal phosphide catalyst of one kind and its preparation method and application | 安徽大学 | 2019-07-09 | — | — | CN | claimed |
| EP-3170924-A1 | ELECTROLYTE AND METHOD FOR ELECTROLYTIC DEPOSITION OF GOLD-COPPER ALLOYS | Enthone, Inc. (US) | 2017-05-24 | — | — | EP | claimed |
| US-8282801-B2 | Methods for passivating a metal substrate and related coated metal substrates | PPG INDUSTRIES OHIO, INC. (US) | 2012-10-09 | — | — | US | claimed |
| US-20120171367-A1 | DISPLACEMENT GOLD PLATING SOLUTION AND METHOD FOR FORMING CONNECTING PORTION | ELECTROPLATING ENGINEERS OF JAPAN LIMITED (JP) | 2012-07-05 | — | — | US | claimed |
| EP-1983077-A1 | Electrolyte and method for electrolytic deposition of gold-copper alloys | Enthone, Inc. (US) | 2008-10-22 | — | — | EP | claimed |
| WO-2006103550-A1 | PROCESSES FOR THE PREPARATION OF CITALOPRAM AND ITS INTERMEDIATE 5-AMINOPHTHALIDE | RANBAXY LABORATORIES LIMITED (US) | 2006-10-05 | — | — | WO | claimed |
| US-7011697-B2 | Electroless gold plating solution | KANTO KAGAKU KABUSHIKI KAISHA (JP) | 2006-03-14 | — | — | US | claimed |
| US-20060027462-A1 | Copper strike plating bath | SHINKO ELECTRIC INDUSTRIES CO., LTD. (JP) | 2006-02-09 | — | — | US | claimed |
| US-20050098061-A1 | Electroless gold plating solution | KANTO KAGAKU KABUSHIKI KAISHA (JP) | 2005-05-12 | — | — | US | claimed |
| JP-6013753-A | — | — | None | — | — | JP | disclosed |
| JP-2043372-A | — | — | None | — | — | JP | disclosed |
| JP-56079459-A | — | — | None | — | — | JP | disclosed |
| JP-S5679459-A | PRETREATMENT METHOD FOR PLATING OF EXTERNAL LEAD WIRE AFTER SEMICONDUCTOR MOLDING | NOGE DENKI KOGYO:KK | 1981-06-30 | — | — | JP | disclosed |
| US-4251327-A | Electroplating method | MOTOROLA, INC. (US) | 1981-02-17 | — | — | US | disclosed |
| EP-0018803-A1 | Process for preparation of aromatic tertiary hydroperoxides and phenols prepared therefrom | MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) | 1980-11-12 | — | — | EP | disclosed |