SCHEMBL3347485

SCHEMBL3347485

OCCc1c2ccccc2nc2ccccc12

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 9/20 0.64
ALDH1A1 P00352 8/20 0.64
GAA P10253 5/20 0.64
HPGD P15428 5/20 0.64
GLA P06280 5/20 0.53
POLB P06746 5/20 0.53
RAD52 P43351 4/20 0.53
RAB9A P51151 4/20 0.53
LMNA P02545 2/20 0.53
MITF O75030 1/20 0.53
TTR P02766 1/20 0.53
HSD17B10 Q99714 3/20 0.46
MAOA P21397 2/20 0.46
TDP1 Q9NUW8 2/20 0.46
CASP1 P29466 2/20 0.46
CASP7 P55210 2/20 0.46
SMN1; SMN2 Q16637 2/20 0.46
CHRM2 P08172 1/20 0.46
ADRA2A P08913 1/20 0.46
ADORA3 P0DMS8 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL321444 0.86 KDM4E (0.75) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL29446776 0.86 KDM4E (0.75) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL6223286 0.86 KDM4E (0.58) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL29446754 0.82 KDM4E (0.69) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL321679 0.82 KDM4E (0.69) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL9611245 0.82 KDM4E (0.57) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL29385771 0.82 KDM4E (0.69) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL320907 0.82 KDM4E (0.69) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL2314302 0.81 ALDH1A1 (0.52) KDM4EALDH1A1GAAHPGDGLA
SCHEMBL599897 0.80 KDM4E (0.67) KDM4EALDH1A1GAAHPGDGLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
JP-4301644-A None JP disclosed
CN-110114376-B Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2022-06-14 CN disclosed
CN-109188865-B Photosensitive covering film composition and application thereof 浙江福斯特新材料研究院有限公司 2022-03-15 CN disclosed
EP-3339331-B1 COMPOSITION ADEKA CORP (JP) 2022-02-16 EP disclosed
CN-108419438-B Coloring composition 株式会社艾迪科 2021-10-01 CN disclosed
CN-112154167-A Composition, cured product, optical filter, and method for producing cured product 株式会社艾迪科 2020-12-29 CN disclosed
CN-111566173-A Coating composition, method for curing the composition, barrier film, and method for producing cured product 株式会社艾迪科 2020-08-21 CN disclosed
WO-2020021969-A1 COMPOSITION, CURED PRODUCT, OPTICAL FILTER, AND PRODUCTION METHOD FOR CURED PRODUCT 株式会社ADEKA 2020-01-30 WO disclosed
CN-110114376-A Curable composition, method for producing cured product, cured product thereof, and adhesive using same 株式会社ADEKA 2019-08-09 CN disclosed
CN-101779165-B Photosensitive resin composition and laminate thereof ASAHI KASEI E MATERIALS CORP 2014-09-24 CN disclosed
CN-102844709-B Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2014-08-20 CN disclosed
CN-102844709-A Photosensitive resin composition, photoresist film using same, method for forming resist pattern, and method for manufacturing printed wiring board NICHIGO MORTON CO LTD 2012-12-26 CN disclosed
CN-101449208-B Photosensitive resin composition and laminate ASAHI KASEI E-MATERIALS CORP. (JP) 2011-12-14 CN disclosed
CN-101779165-A Photosensitive resin composition and laminate thereof ASAHI KASEI EMD CORP 2010-07-14 CN disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-101568882-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-10-28 CN disclosed
CN-101449208-A Photosensitive resin composition and laminate ASAHI KASEI EMD CORP (JP) 2009-06-03 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
JP-H04301644-A PHOTOINITIATOR AND PHOTOPOLYMERIZABLE COMPOSITION HITACHI CHEM CO LTD 1992-10-26 JP disclosed