SCHEMBL3356030

SCHEMBL3356030

COCc1cc(COC)c(COC)cc1COC

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.48
PRKCE Q02156 3/20 0.48
MYLK Q15746 2/20 0.48
TDP1 Q9NUW8 2/20 0.48
MAPT P10636 2/20 0.48
MEN1 O00255 1/20 0.48
PRKCG P05129 1/20 0.48
PRKCA P17252 1/20 0.48
APEX1 P27695 1/20 0.48
RECQL P46063 1/20 0.48
KMT2A Q03164 1/20 0.48
LMNA P02545 1/20 0.38
POLB P06746 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
KDM4E B2RXH2 4/20 0.36
HPGD P15428 4/20 0.36
HSD17B10 Q99714 3/20 0.36
GAA P10253 1/20 0.36
HSD17B3 P37058 1/20 0.35
CYP1A2 P05177 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10793829 0.82 ALDH1A1 (0.41) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL9505644 0.78 ALDH1A1 (0.43) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL20817185 0.78 CYP1A2 (0.44) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL29871264 0.78 CYP1A2 (0.44) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL4965724 0.76 LMNA (0.40) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL8256542 0.76 KDM4E (0.41) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL9684250 0.76 PRKCE (0.38) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL28379905 0.76 HSD17B3 (0.47) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL14255402 0.76 ALDH1A1 (0.52) ALDH1A1PRKCEMYLKTDP1MAPT
SCHEMBL25085954 0.76 PRKCE (0.41) ALDH1A1PRKCEMYLKTDP1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP claimed
US-12043770-B2 Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package DAXIN MATERIALS CORPORATION (TW) 2024-07-23 US disclosed
US-11292002-B2 Surfactant additives for digital microfluidic devices for high protein content droplets transport THE GOVERNING COUNCIL OF THE UNIVERSITY OF TORONTO (CA) 2022-04-05 US disclosed
US-20210040365-A1 TEMPORARY BONDING COMPOSITION, TEMPORARY BONDING FILM, COMPOSITE FILM, METHOD FOR TEMPORARY BONDING WORKPIECE AND SEMICONDUCTOR WAFER PACKAGING DAXIN MATERIALS CORPORATION (TW) 2021-02-11 US disclosed
US-9905768-B2 Semiconductor device and insulating layer-forming composition FUJIFILM CORPORATION (JP) 2018-02-27 US disclosed
US-9905768-B2 Semiconductor device and insulating layer-forming composition FUJIFILM CORPORATION (JP) 2018-02-27 US disclosed
US-20170054076-A1 SEMICONDUCTOR DEVICE AND INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORPORATION (JP) 2017-02-23 US disclosed
US-20170054076-A1 SEMICONDUCTOR DEVICE AND INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORPORATION (JP) 2017-02-23 US disclosed
US-20170005266-A1 SEMICONDUCTOR ELEMENT AND INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORPORATION (JP) 2017-01-05 US disclosed
US-20170005266-A1 SEMICONDUCTOR ELEMENT AND INSULATING LAYER-FORMING COMPOSITION FUJIFILM CORPORATION (JP) 2017-01-05 US disclosed
US-9400430-B2 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film, mask blank and method of forming pattern FUJIFILM CORPORATION (JP) 2016-07-26 US disclosed
US-9400430-B2 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film, mask blank and method of forming pattern FUJIFILM CORPORATION (JP) 2016-07-26 US disclosed
US-20140242502-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, MASK BLANK AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2014-08-28 US disclosed
US-20140242502-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, MASK BLANK AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2014-08-28 US disclosed
WO-2013069812-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM, MASK BLANK AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2013-05-16 WO disclosed
EP-1806618-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORP (JP) 2010-06-09 EP disclosed