Tetramethylammonium Ion

Tetramethylammonium Ion

SCHEMBL3360726

CCC(c1cccc(F)c1)C(OB([O-])O)(c1cccc(F)c1)c1cccc(F)c1.C[N+](C)(C)C

nearest known ligand 0.32

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Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.32
TDO2 P48775 1/20 0.32
EDNRB P24530 1/20 0.32
EDNRA P25101 1/20 0.32
AOC3 Q16853 1/20 0.32
RPS6KB1 P23443 1/20 0.31
KCNN4 O15554 1/20 0.31
MEN1 O00255 1/20 0.30
ALDH1A1 P00352 1/20 0.30
CYP1A2 P05177 1/20 0.30
POLB P06746 1/20 0.30
CYP3A4 P08684 1/20 0.30
CYP2C9 P11712 1/20 0.30
KMT2A Q03164 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetrylammonium SCHEMBL3361103 0.93 EDNRB (0.31) EDNRBEDNRAAOC3RPS6KB1
Tetramethylammonium Ion SCHEMBL3362589 0.89 SLC7A5 (0.32) EDNRBEDNRA
SCHEMBL4961262 0.87 EDNRB (0.37) IDO1TDO2EDNRBEDNRAAOC3
Tetrylammonium SCHEMBL3361654 0.83 SLC7A5 (0.33)
Tetrabuthylammonium SCHEMBL809815 0.82 SLC7A5 (0.30)
Tetramethylammonium Ion SCHEMBL2428732 0.81 LMNA (0.34) MEN1CYP1A2POLBCYP3A4CYP2C9
Tetramethylammonium Ion SCHEMBL3360762 0.79 SLC6A9 (0.31)
Tetrabuthylammonium SCHEMBL18094601 0.76
SCHEMBL4606555 0.75 SLC7A5 (0.34) IDO1TDO2EDNRBEDNRAAOC3
Tetrylammonium SCHEMBL4331841 0.74 CHRM2 (0.35) MEN1CYP1A2POLBCYP3A4CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2172806-A2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board Hitachi Chemical Company, Ltd. (JP) 2010-04-07 EP disclosed
US-7232647-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-06-19 US disclosed
US-7220533-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-05-22 US disclosed
US-20050164124-A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20040038149-A1 Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1282010-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2003-02-05 EP disclosed