Tetrabuthylammonium

Tetrabuthylammonium

SCHEMBL809815

CCCCC(c1cccc(F)c1)C(OB([O-])O)(c1cccc(F)c1)c1cccc(F)c1.CCCC[N+](CCCC)(CCCC)CCCC

nearest known ligand 0.32

Full drug profile on Sugi Atlas →

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
SLC7A5 Q01650 1/20 0.30
OPRM1 P35372 2/20 0.30
OPRD1 P41143 2/20 0.30
OPRK1 P41145 2/20 0.30
OPRL1 P41146 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetrylammonium SCHEMBL3361654 0.93 SLC7A5 (0.33) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrabuthylammonium SCHEMBL18094601 0.93
Tetramethylammonium Ion SCHEMBL3362589 0.93 SLC7A5 (0.32) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrabuthylammonium SCHEMBL20508670 0.92 EDNRB (0.31) SLC7A5OPRM1OPRD1OPRK1OPRL1
SCHEMBL4606555 0.85 SLC7A5 (0.34) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrabuthylammonium SCHEMBL810026 0.84 CTSK (0.35)
SCHEMBL7659869 0.83 SLC7A5 (0.36) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrylammonium SCHEMBL3361103 0.82 EDNRB (0.31) SLC7A5
Tetrabuthylammonium SCHEMBL3362457 0.82 FAAH (0.33)
Tetramethylammonium Ion SCHEMBL3360726 0.82 IDO1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 110 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260022199-A1 HOLOGRAPHIC PHOTOPOLYMER MATERIAL, HOLOGRAPHIC PHOTOSENSITIVE FILM, HOLOGRAPHIC OPTICAL ELEMENT, AND DISPLAY DEVICE HUAWEI TECH CO LTD (CN) 2026-01-22 US claimed
EP-4668017-A1 HOLOGRAPHIC PHOTOPOLYMERIZABLE MATERIAL, HOLOGRAPHIC PHOTOSENSITIVE FILM, HOLOGRAPHIC OPTICAL ELEMENT, AND DISPLAY DEVICE Huawei Technologies Co., Ltd. (CN) 2025-12-24 EP claimed
EP-4291953-A1 IMPROVED BLEACHING Xetos AG (DE) 2023-12-20 EP claimed
EP-4291587-A1 PHOTOPOLYMERIZABLE HOE COMPOSITION Xetos AG (DE) 2023-12-20 EP claimed
EP-4291951-A1 TWO-COMPONENT SYSTEM Xetos AG (DE) 2023-12-20 EP claimed
WO-2022171821-A1 PHOTOPOLYMERIZABLE HOE COMPOSITION XETOS AG (DE) 2022-08-18 WO claimed
WO-2022171820-A1 IMPROVED BLEACHING XETOS AG (DE) 2022-08-18 WO claimed
WO-2022171814-A1 TWO-COMPONENT SYSTEM XETOS AG (DE) 2022-08-18 WO claimed
EP-2218745-B1 Prepolymer-based polyurethane formulations for producing holographic films BAYER MATERIALSCIENCE AG (DE) 2011-11-23 EP claimed
US-20100203241-A1 Prepolymer-Based Polyurethane Formulations For The Production Of Holographic Films BAYER MATERIALSCIENCE AG (DE) 2010-08-12 US claimed
US-20260022199-A1 HOLOGRAPHIC PHOTOPOLYMER MATERIAL, HOLOGRAPHIC PHOTOSENSITIVE FILM, HOLOGRAPHIC OPTICAL ELEMENT, AND DISPLAY DEVICE HUAWEI TECH CO LTD (CN) 2026-01-22 US disclosed
EP-4668017-A1 HOLOGRAPHIC PHOTOPOLYMERIZABLE MATERIAL, HOLOGRAPHIC PHOTOSENSITIVE FILM, HOLOGRAPHIC OPTICAL ELEMENT, AND DISPLAY DEVICE Huawei Technologies Co., Ltd. (CN) 2025-12-24 EP disclosed
EP-4291951-A1 TWO-COMPONENT SYSTEM Xetos AG (DE) 2023-12-20 EP disclosed
WO-2022171823-A1 PHOTOPOLYMERIZABLE COMPOSITION XETOS AG (DE) 2022-08-18 WO disclosed
WO-2022171814-A1 TWO-COMPONENT SYSTEM XETOS AG (DE) 2022-08-18 WO disclosed
US-7232647-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-06-19 US disclosed
US-7220533-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-05-22 US disclosed
US-20050164124-A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20040038149-A1 Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1282010-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2003-02-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260022199-A1 HOLOGRAPHIC PHOTOPOLYMER MATERIAL, HOLOGRAPHIC PHOTOSENSITIVE FILM, HOLOGRAPHIC OPTICAL ELEMENT, AND DISPLAY DEVICE VCL, MACF1, FGB SLC7A5 4798/4885OPRM1 1254/4885OPRD1 2157/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.