Tetramethylammonium Ion

Tetramethylammonium Ion

SCHEMBL3362589

CCCCC(c1cccc(F)c1)C(OB([O-])O)(c1cccc(F)c1)c1cccc(F)c1.C[N+](C)(C)C

nearest known ligand 0.32

Full drug profile on Sugi Atlas →

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
SLC7A5 Q01650 1/20 0.32
OPRM1 P35372 2/20 0.32
OPRD1 P41143 2/20 0.32
OPRK1 P41145 2/20 0.32
OPRL1 P41146 2/20 0.32
EDNRB P24530 1/20 0.30
EDNRA P25101 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetrylammonium SCHEMBL3361654 0.94 SLC7A5 (0.33) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrabuthylammonium SCHEMBL809815 0.93 SLC7A5 (0.30) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetramethylammonium Ion SCHEMBL3360726 0.89 IDO1 (0.32) EDNRBEDNRA
SCHEMBL4606555 0.88 SLC7A5 (0.34) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrabuthylammonium SCHEMBL18094601 0.86
SCHEMBL7659869 0.85 SLC7A5 (0.36) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrabuthylammonium SCHEMBL20508670 0.84 EDNRB (0.31) SLC7A5OPRM1OPRD1OPRK1OPRL1
Tetrylammonium SCHEMBL3361103 0.83 EDNRB (0.31) SLC7A5EDNRBEDNRA
Tetramethylammonium Ion SCHEMBL3361129 0.81 FAAH (0.32)
Tetramethylammonium Ion SCHEMBL1263432 0.76 NPC1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2172806-A2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board Hitachi Chemical Company, Ltd. (JP) 2010-04-07 EP disclosed
US-7232647-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-06-19 US disclosed
US-7220533-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-05-22 US disclosed
US-20050164124-A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20040038149-A1 Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1282010-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2003-02-05 EP disclosed
US-6489374-B1 ORGANONITROGEN COMPOUNDS THAT YIELD AMINES, IMINES OR AMIDINES WHEN EXPOSED TO VISIBLE OR ULTRAVIOLET RADIATION; POLYMERIZATION CATALYSTS USED IN ONE-POT SYSTEMS HAVING STORAGE STABILITY CIBA SPECIALTY CHEMICALS CORPORATION 2002-12-03 US disclosed