SCHEMBL3360841

SCHEMBL3360841

[CH2]C(O)C(Cl)CCOC(=O)C=C

nearest known ligand 0.48

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.48
ALDH1A1 P00352 4/20 0.48
TP53 P04637 3/20 0.48
HIF1A Q16665 3/20 0.48
CYP3A4 P08684 2/20 0.48
HSD17B10 Q99714 1/20 0.48
HPGD P15428 1/20 0.44
MAPK1 P28482 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
THRB P10828 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28183263 0.84 TSHR (0.48) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL709412 0.82 TSHR (0.54) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL317171 0.80 TSHR (0.56) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL10714314 0.80 TSHR (0.56) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL996461 0.78 TSHR (0.58) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL10337184 0.78 TSHR (0.58) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL6368712 0.78 TSHR (0.58) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL3269816 0.77 TSHR (0.52) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL1434271 0.76 TSHR (0.50) TSHRALDH1A1TP53HIF1ACYP3A4
SCHEMBL11805799 0.76 TSHR (0.55) TSHRALDH1A1TP53HIF1ACYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-6236031-A None JP disclosed
EP-2236647-B1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM CORP (JP) 2018-02-21 EP disclosed
EP-2236647-A1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM Corporation (JP) 2010-10-06 EP disclosed
JP-H06236031-A PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME ASAHI DENKA KOGYO KK 1994-08-23 JP disclosed