Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KIF11 | P52732 | 4/20 | 0.34 |
| ▸ | CYP17A1 | P05093 | 1/20 | 0.31 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetrylammonium SCHEMBL3361543 | 0.94 | KIF11 (0.33) | KIF11 | |
| Tetramethylammonium Ion SCHEMBL3360757 | 0.88 | KIF11 (0.35) | KIF11KCNH2 | |
| Tetrylammonium SCHEMBL374839 | 0.83 | KIF11 (0.48) | KIF11KCNH2 | |
| Tetrylammonium SCHEMBL3361102 | 0.81 | KIF11 (0.38) | KIF11KCNH2 | |
| Tetramethylammonium Ion SCHEMBL3361126 | 0.81 | KIF11 (0.33) | KIF11KCNH2 | |
| Tetrylammonium SCHEMBL3361652 | 0.76 | KIF11 (0.37) | KIF11KCNH2 | |
| Tetrylammonium SCHEMBL3360743 | 0.75 | KIF11 (0.33) | KIF11 | |
| Tetrylammonium SCHEMBL3362447 | 0.70 | KIF11 (0.32) | KIF11 | |
| Tetramethylammonium Ion SCHEMBL6517997 | 0.69 | KIF11 (0.53) | KIF11KCNH2 | |
| Tetrabuthylammonium SCHEMBL1350363 | 0.69 | KIF11 (0.44) | KIF11KCNH2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2172806-A2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | Hitachi Chemical Company, Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| US-7232647-B2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7220533-B2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-22 | — | — | US | disclosed |
| US-20050164124-A1 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20040038149-A1 | Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-02-26 | — | — | US | disclosed |
| EP-1282010-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2003-02-05 | — | — | EP | disclosed |