Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KIF11 | P52732 | 10/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.36 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.36 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.36 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.36 |
| ▸ | KCNN4 | O15554 | 4/20 | 0.34 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.30 |
| ▸ | MDM4 | O15151 | 1/20 | 0.30 |
| ▸ | TP53 | P04637 | 1/20 | 0.30 |
| ▸ | MDM2 | Q00987 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetrylammonium SCHEMBL3361652 | 0.94 | KIF11 (0.37) | KIF11CYP3A4CYP2D6CYP2C9CYP2C19 | |
| Tetramethylammonium Ion SCHEMBL3360720 | 0.89 | KIF11 (0.39) | KIF11CYP3A4CYP2D6CYP2C9CYP2C19 | |
| Tetramethylammonium Ion SCHEMBL3362588 | 0.84 | KIF11 (0.37) | KIF11CYP3A4CYP2D6CYP2C9CYP2C19 | |
| Tetrabuthylammonium SCHEMBL809814 | 0.82 | SCN5A (0.36) | KIF11CYP3A4CYP2D6CYP2C9CYP2C19 | |
| Tetrylammonium SCHEMBL3361497 | 0.81 | KIF11 (0.34) | KIF11KCNH2 | |
| Tetrylammonium SCHEMBL374839 | 0.81 | KIF11 (0.48) | KIF11CYP3A4CYP2D6CYP2C9CYP2C19 | |
| Tetrylammonium SCHEMBL3361543 | 0.76 | KIF11 (0.33) | KIF11 | |
| Tetrylammonium SCHEMBL3360743 | 0.74 | KIF11 (0.33) | KIF11 | |
| Tetrabuthylammonium SCHEMBL18094600 | 0.73 | — | — | |
| SCHEMBL4961255 | 0.73 | KCNN4 (0.41) | KIF11CYP3A4CYP2D6CYP2C9CYP2C19 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2172806-A2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | Hitachi Chemical Company, Ltd. (JP) | 2010-04-07 | — | — | EP | disclosed |
| US-7232647-B2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2007-06-19 | — | — | US | disclosed |
| US-7220533-B2 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2007-05-22 | — | — | US | disclosed |
| US-20050164124-A1 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20040038149-A1 | Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board | HITACHI CHEMICAL CO., LTD. (JP) | 2004-02-26 | — | — | US | disclosed |
| EP-1282010-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2003-02-05 | — | — | EP | disclosed |