Tetrylammonium

Tetrylammonium

SCHEMBL3361652

CC[N+](CC)(CC)CC.[BH3-]CCCCCC(c1cccc(F)c1)(c1cccc(F)c1)c1cccc(F)c1

nearest known ligand 0.37

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 8/20 0.37
CYP3A4 P08684 1/20 0.35
CYP2D6 P10635 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
KCNH2 Q12809 1/20 0.35
KCNN4 O15554 4/20 0.33
SCN5A Q14524 3/20 0.30
SCN9A Q15858 3/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tetrylammonium SCHEMBL3361102 0.94 KIF11 (0.38) KIF11CYP3A4CYP2D6CYP2C9CYP2C19
Tetramethylammonium Ion SCHEMBL3362588 0.90 KIF11 (0.37) KIF11CYP3A4CYP2D6CYP2C9CYP2C19
Tetrabuthylammonium SCHEMBL809814 0.88 SCN5A (0.36) KIF11CYP3A4CYP2D6CYP2C9CYP2C19
Tetramethylammonium Ion SCHEMBL3360720 0.84 KIF11 (0.39) KIF11CYP3A4CYP2D6CYP2C9CYP2C19
Tetrylammonium SCHEMBL3361543 0.82 KIF11 (0.33) KIF11
Tetrabuthylammonium SCHEMBL18094600 0.78
Tetrylammonium SCHEMBL3361497 0.76 KIF11 (0.34) KIF11KCNH2
Tetrylammonium SCHEMBL374839 0.76 KIF11 (0.48) KIF11CYP3A4CYP2D6CYP2C9CYP2C19
Tetrylammonium SCHEMBL3362447 0.75 KIF11 (0.32) KIF11
SCHEMBL809990 0.74 KCNN4 (0.39) KIF11CYP3A4CYP2D6CYP2C9CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2172806-A2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board Hitachi Chemical Company, Ltd. (JP) 2010-04-07 EP disclosed
US-7232647-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-06-19 US disclosed
US-7220533-B2 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2007-05-22 US disclosed
US-20050164124-A1 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2005-07-28 US disclosed
US-20040038149-A1 Photosensitive resin composition, photosensitive element comprising the same, method for producing resist pattern, and method for producing printed wiring board HITACHI CHEMICAL CO., LTD. (JP) 2004-02-26 US disclosed
EP-1282010-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2003-02-05 EP disclosed