Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAP3K14 | Q99558 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5855515 | 0.82 | MAP3K14 (0.39) | MAP3K14 | |
| SCHEMBL5970075 | 0.76 | MAP3K14 (0.34) | MAP3K14 | |
| SCHEMBL1028530 | 0.76 | MAP3K14 (0.39) | MAP3K14 | |
| SCHEMBL193688 | 0.76 | MAP3K14 (0.39) | MAP3K14 | |
| SCHEMBL114367 | 0.73 | NPC1 (0.36) | MAP3K14 | |
| SCHEMBL17065492 | 0.72 | MAP3K14 (0.33) | MAP3K14 | |
| SCHEMBL114517 | 0.71 | GLA (0.37) | MAP3K14 | |
| SCHEMBL10754755 | 0.69 | MAP3K14 (0.48) | MAP3K14 | |
| SCHEMBL8348991 | 0.69 | MAP3K14 (0.48) | MAP3K14 | |
| SCHEMBL17065483 | 0.69 | NPC1 (0.37) | MAP3K14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110471257-A | The manufacturing method of photosensitive polymer combination, photosensitive dry film and its manufacturing method, resist film, substrate and plating forming object | TOKYO OHKA KOGYO COMPANY | 2019-11-19 | — | — | CN | disclosed |
| CN-110317174-A | Hydrogen barrier, hydrogen barrier film, which are formed, uses composition, hydrogen barrier film, the manufacturing method of hydrogen barrier film and electronic component | 东京应化工业株式会社 | 2019-10-11 | — | — | CN | disclosed |
| CN-109799680-A | Chemical amplification positive photosensitive resin composition and its application | 奇美实业股份有限公司 | 2019-05-24 | — | — | CN | disclosed |
| CN-109709770-A | The manufacturing method of resin combination, dry film and manufacturing method, resist film and substrate and plating forming object, sulfhydryl compound | 东京应化工业株式会社 | 2019-05-03 | — | — | CN | disclosed |
| CN-109557764-A | Chemically amplified positive photosensitive resin composition, resist pattern and method for forming the same, and electronic device | 奇美实业股份有限公司 | 2019-04-02 | — | — | CN | disclosed |
| CN-109116681-A | Chemically amplified positive photosensitive resin composition, photoresist pattern and method for forming the same, and electronic device | 奇美实业股份有限公司 | 2019-01-01 | — | — | CN | disclosed |
| US-9436084-B2 | Positive-working photoresist composition for thick film formation | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-09-06 | — | — | US | disclosed |
| EP-1861751-B1 | POSITIVE-WORKING PHOTORESIST COMPOSITION FOR THICK FILM FORMATION | TOKYO OHKA KOGYO CO LTD (JP) | 2010-11-24 | — | — | EP | disclosed |
| US-20080026321-A1 | Positive-working photoresist composition for thick film formation | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-01-31 | — | — | US | disclosed |
| EP-1861751-A1 | POSITIVE-WORKING PHOTORESIST COMPOSITION FOR THICK FILM FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-12-05 | — | — | EP | disclosed |
| EP-1761823-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-03-14 | — | — | EP | disclosed |
| WO-2006101250-A1 | POSITIVE-WORKING PHOTORESIST COMPOSITION FOR THICK FILM FORMATION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-09-28 | — | — | WO | disclosed |
| WO-2006003757-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |