SCHEMBL4551613

SCHEMBL4551613

O=C=Nc1ccc(Oc2ccc(Oc3ccc(N=C=O)cc3)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 5/20 0.54
TSHR P16473 3/20 0.54
TDP1 Q9NUW8 3/20 0.45
MAPK1 P28482 1/20 0.45
ADRA2A P08913 1/20 0.43
ADRA2B P18089 1/20 0.43
ADRA2C P18825 1/20 0.43
TRPA1 O75762 1/20 0.42
CYP1A2 P05177 1/20 0.39
ALDH1A1 P00352 4/20 0.36
KMT2A Q03164 2/20 0.36
MEN1 O00255 1/20 0.36
ESR1 P03372 1/20 0.36
ESR2 Q92731 1/20 0.36
FURIN P09958 1/20 0.35
PARP10 Q53GL7 2/20 0.34
HPGD P15428 2/20 0.34
PARP15 Q460N3 1/20 0.34
PARP14 Q460N5 1/20 0.34
PARP16 Q8N5Y8 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4544188 1.00 CYP3A4 (0.54) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL50333 1.00 CYP3A4 (0.54) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL1415412 0.93 CYP3A4 (0.48) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL14493735 0.91 CYP3A4 (0.47) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL242048 0.91 LTA4H (0.50) CYP3A4TSHRPARP10LTA4HCA1
SCHEMBL11025348 0.89 MAPT (0.47) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL15494520 0.89 ALDH1A1 (0.56) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL10534838 0.89 MAPK1 (0.47) CYP3A4TSHRTDP1MAPK1ADRA2A
SCHEMBL28101787 0.89 LTA4H (0.48) CYP3A4TSHRTDP1MAPK1TRPA1
SCHEMBL668152 0.89 TEAD4 (0.47) CYP3A4TSHRTDP1MAPK1ADRA2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8466251-B2 Polyamide-imide resin insulating paint and insulation wire using same HITACHI MAGNET WIRE CORP. (JP) 2013-06-18 US claimed
EP-0244727-B1 1,4-BIS-(4-ISOCYANATOPHENOXY)-BENZENES, PROCESS FOR THEIR PREPARATION AND THEIR USE IN THE PRODUCTION OF POLYURETHANE PLASTICS BAYER AG (DE) 1990-08-01 EP claimed
EP-0244727-A1 1,4-Bis-(4-isocyanatophenoxy)-benzenes, process for their preparation and their use in the production of polyurethane plastics BAYER AG (DE) 1987-11-11 EP claimed
US-20140212665-A1 POLYAMIDE-IMIDE COATING MATERIAL AND INSULATED WIRE USING THE SAME HITACHI METALS, LTD. (JP) 2014-07-31 US disclosed
US-8759472-B2 Polyamide-imide resin insulating paint and insulation wire using the same HITACHI METALS, LTD. (JP) 2014-06-24 US disclosed
US-20130228359-A1 Polyamide-Imide Resin Insulating Paint and Insulation Wire Using the Same HITACHI MAGNET WIRE CORP. (JP) 2013-09-05 US disclosed
US-8466251-B2 Polyamide-imide resin insulating paint and insulation wire using same HITACHI MAGNET WIRE CORP. (JP) 2013-06-18 US disclosed
US-20130032374-A1 POLYAMIDE-IMIDE RESIN INSULATING VARNISH AND METHOD OF MANUFACTURING THE SAME, INSULATED WIRE AND COIL HITACHI CABLE, LTD. (JP) 2013-02-07 US disclosed
US-20120318555-A1 POLYAMIDE-IMIDE RESIN INSULATING COATING MATERIAL, INSULATED WIRE AND COIL HITACHI CABLE, LTD. (JP) 2012-12-20 US disclosed
US-20100247867-A1 RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE, AND METHOD FOR MANUFACTURING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-09-30 US disclosed
US-20090176961-A1 Polyamide-imide resin insulating paint and insulation wire using same HITACHI MAGNET WIRE CORP. 2009-07-09 US disclosed
EP-0869151-A2 Thermosetting resin composition NITTO DENKO CORPORATION (JP) 1998-10-07 EP disclosed
EP-0810244-A2 Aromatic polycarbodiimide and sheet using it NITTO DENKO CORPORATION (JP) 1997-12-03 EP disclosed
EP-0792897-A1 Aromatic polycarbodiimide and films thereof NITTO DENKO CORPORATION (JP) 1997-09-03 EP disclosed
EP-0244727-B1 1,4-BIS-(4-ISOCYANATOPHENOXY)-BENZENES, PROCESS FOR THEIR PREPARATION AND THEIR USE IN THE PRODUCTION OF POLYURETHANE PLASTICS BAYER AG (DE) 1990-08-01 EP disclosed
EP-0244727-B1 1,4-BIS-(4-ISOCYANATOPHENOXY)-BENZENES, PROCESS FOR THEIR PREPARATION AND THEIR USE IN THE PRODUCTION OF POLYURETHANE PLASTICS BAYER AG (DE) 1990-08-01 EP disclosed
EP-0244727-A1 1,4-Bis-(4-isocyanatophenoxy)-benzenes, process for their preparation and their use in the production of polyurethane plastics BAYER AG (DE) 1987-11-11 EP disclosed
EP-0244727-A1 1,4-Bis-(4-isocyanatophenoxy)-benzenes, process for their preparation and their use in the production of polyurethane plastics BAYER AG (DE) 1987-11-11 EP disclosed
EP-0244727-A1 1,4-Bis-(4-isocyanatophenoxy)-benzenes, process for their preparation and their use in the production of polyurethane plastics BAYER AG (DE) 1987-11-11 EP disclosed
US-4059580-A Sulphonated polybenz-1,3-oxazin-2,4-diones BAYER AKTIENGESELLSCHAFT (DT) 1977-11-22 US disclosed