Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE known ✓ | P22303 | 3/20 | 0.46 |
| ▸ | LMNA | P02545 | 3/20 | 0.53 |
| ▸ | APEX1 | P27695 | 3/20 | 0.50 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.50 |
| ▸ | MEN1 | O00255 | 4/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.46 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.46 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.46 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.46 |
| ▸ | PMP22 | Q01453 | 2/20 | 0.46 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.46 |
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.46 |
| ▸ | RAB9A | P51151 | 1/20 | 0.46 |
| ▸ | DNM1 | Q05193 | 6/20 | 0.42 |
| ▸ | APAF1 | O14727 | 1/20 | 0.36 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.36 |
| ▸ | RAD52 | P43351 | 1/20 | 0.36 |
| ▸ | BBOX1 | O75936 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8377928 | 0.95 | LMNA (0.59) | LMNAAPEX1NPSR1MEN1KMT2A | |
| SCHEMBL15305643 | 0.95 | LMNA (0.59) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Bromide SCHEMBL5266454 | 0.93 | LMNA (0.57) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Hydrochloric Acid SCHEMBL10586515 | 0.93 | LMNA (0.55) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Hydrochloric Acid SCHEMBL120655 | 0.93 | LMNA (0.55) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Hydrochloric Acid SCHEMBL31003437 | 0.93 | LMNA (0.55) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Hydrochloric Acid SCHEMBL667334 | 0.91 | LMNA (0.53) | LMNAAPEX1NPSR1MEN1KMT2A | |
| SCHEMBL1232505 | 0.90 | LMNA (0.57) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Iodide SCHEMBL8679481 | 0.88 | LMNA (0.55) | LMNAAPEX1NPSR1MEN1KMT2A | |
| Water SCHEMBL3347894 | 0.88 | LMNA (0.55) | LMNAAPEX1NPSR1MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2141198-B1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | HITACHI CHEMICAL CO LTD (JP) | 2017-07-05 | — | — | EP | disclosed |
| US-8404769-B2 | Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-03-26 | — | — | US | disclosed |
| US-20130040153-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE, THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | FUJIMOTO DAISUKE (JP) | 2013-02-14 | — | — | US | disclosed |
| US-20100129676-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | RESONAC CORPORATION (JP) | 2010-05-27 | — | — | US | disclosed |
| EP-2141198-A1 | PROCESS FOR PRODUCING RESIN VARNISH CONTAINING SEMI-IPN COMPOSITE THERMOSETTING RESIN AND, PROVIDED USING THE SAME, RESIN VARNISH FOR PRINTED WIRING BOARD, PREPREG AND METAL-CLAD LAMINATE | Hitachi Chemical Company, Ltd. (JP) | 2010-01-06 | — | — | EP | disclosed |
| US-20090323300-A1 | Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-31 | — | — | US | disclosed |