SCHEMBL3422904

SCHEMBL3422904

O=C(O)c1c(O)cc(O)c2ccccc12

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.57
KDM4E B2RXH2 5/20 0.52
HSD17B10 Q99714 5/20 0.52
HPGD P15428 4/20 0.52
MEN1 O00255 3/20 0.52
KMT2A Q03164 3/20 0.52
ALDH1A1 P00352 3/20 0.52
CYP1A2 P05177 1/20 0.52
GLA P06280 1/20 0.52
CYP2C19 P33261 1/20 0.52
APP P05067 1/20 0.49
CA12 O43570 2/20 0.48
CA1 P00915 2/20 0.48
CA2 P00918 2/20 0.48
CA7 P43166 2/20 0.48
CA9 Q16790 2/20 0.48
CA14 Q9ULX7 2/20 0.48
MAPT P10636 3/20 0.46
MCL1 Q07820 2/20 0.46
NSD2 O96028 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11411960 0.83 ALDH1A1 (0.50) THRBKDM4EHSD17B10MEN1KMT2A
SCHEMBL27571871 0.83 THRB (0.58) THRBKDM4EHSD17B10HPGDMEN1
SCHEMBL4781541 0.83 THRB (0.69) THRBKDM4EHSD17B10HPGDMEN1
Hydrochloric Acid SCHEMBL7535914 0.82 THRB (0.56) THRBKDM4EHSD17B10HPGDMEN1
SCHEMBL28256436 0.82 HPGD (0.47) THRBKDM4EHSD17B10HPGDMEN1
SCHEMBL8747706 0.80 HMGB1 (0.59) THRBKDM4EHSD17B10HPGDMEN1
SCHEMBL9813995 0.79 CA12 (0.45) THRBKDM4EHSD17B10KMT2AALDH1A1
SCHEMBL29599456 0.78 KDM4E (0.68) THRBKDM4EHSD17B10HPGDMEN1
SCHEMBL70004 0.78 KDM4E (0.68) THRBKDM4EHSD17B10HPGDMEN1
Benzene SCHEMBL10558251 0.78 KDM4E (0.68) THRBKDM4EHSD17B10HPGDMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12044969-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-12044969-B2 Resist underlayer film-forming composition NISSAN CHEMICAL CORPORATION (JP) 2024-07-23 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-20230296984-A1 EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2023-09-21 US disclosed
US-11693313-B2 Resist composition and method of forming resist pattern TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-04 US disclosed
US-20220179313-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-06-09 US disclosed
US-20220146939-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2022-05-12 US disclosed
US-20220121118-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN TOKYO OHKA KOGYO CO., LTD. (JP) 2022-04-21 US disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210397090-A1 RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME NISSAN CHEMICAL CORPORATION (JP) 2021-12-23 US disclosed
US-20130059942-A1 CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME NIPPON SODA CO., LTD. (JP) 2013-03-07 US disclosed
CN-102892849-A Curable powder coating composition and cured product thereof NIPPON SODA CO 2013-01-23 CN disclosed
CN-102725273-A Clathrate and method for producing same NIPPON SODA CO 2012-10-10 CN disclosed
CN-101802049-B Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2012-09-12 CN disclosed
EP-2489689-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF Nippon Soda Co., Ltd. (JP) 2012-08-22 EP disclosed
US-20120196991-A1 COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) 2012-08-02 US disclosed
CN-101802049-A Epoxy resin composition for semiconductor encapsulation containing inclusion complex NIPPON SODA CO 2010-08-11 CN disclosed
US-20100179250-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION NIPPON SODA CO., LTD. (JP) 2010-07-15 US disclosed
EP-2192139-A1 INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION Nippon Soda Co., Ltd. (JP) 2010-06-02 EP disclosed
WO-1998000762-A1 OPTICAL COATINGS CONTAINING A BINDER AND ONE OR MORE OF POLYHYDROXYFLAVONES, HYDROXYLATED BENZOIC ACID DERIVATIVES AND HYDROXYLATED NAPHTHOIC ACID DERIVATIVES ZENECA LIMITED (GB) 1998-01-08 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11693313-B2 Resist composition and method of forming resist pattern C1R, C1S, C9 THRB 1707/4885KDM4E 4803/4885HSD17B10 413/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.