Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19895695 | 0.94 | LPAR3 (0.31) | LPAR3LPAR2 | |
| SCHEMBL30695089 | 0.94 | LPAR3 (0.31) | LPAR3LPAR2 | |
| SCHEMBL190266 | 0.94 | LPAR3 (0.31) | LPAR3LPAR2 | |
| SCHEMBL7528483 | 0.94 | — | — | |
| SCHEMBL190569 | 0.94 | LPAR3 (0.31) | LPAR3LPAR2 | |
| Zinc Ion SCHEMBL191361 | 0.94 | LPAR3 (0.31) | LPAR3LPAR2 | |
| SCHEMBL6051110 | 0.82 | — | — | |
| SCHEMBL29120170 | 0.78 | LPAR3 (0.32) | LPAR3LPAR2 | |
| SCHEMBL7159576 | 0.77 | TRPM8 (0.41) | LPAR3LPAR2 | |
| Zinc Ion SCHEMBL28846269 | 0.77 | TRPM8 (0.41) | LPAR3LPAR2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 288 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220356328-A1 | Polyamide Composition and the Article Thereof | BASF SE (DE) | 2022-11-10 | — | — | US | claimed |
| EP-4041801-A1 | POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF | BASF SE (DE) | 2022-08-17 | — | — | EP | claimed |
| CN-114502656-A | Polyamide composition and article thereof | 巴斯夫欧洲公司 | 2022-05-13 | — | — | CN | claimed |
| WO-2021069456-A1 | POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF | BASF SE (DE) | 2021-04-15 | — | — | WO | claimed |
| US-20260139106-A1 | INSULATION FILM | BASF SE (DE) | 2026-05-21 | — | — | US | disclosed |
| EP-4743515-A1 | A FILLER COMPOSITION AND ITS USE IN POLYAMIDE-BASED MATERIAL | BASF SE (DE) | 2026-05-20 | — | — | EP | disclosed |
| WO-2026098475-A1 | BIO-BASED POLYAMIDE COMPOSITION HAVING GOOD STIFFNESS AND HEAT RESISTANCE | BASF SE (DE) | 2026-05-15 | — | — | WO | disclosed |
| EP-4169977-B1 | RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER | MITSUBISHI CHEM CORP (JP) | 2026-03-18 | — | — | EP | disclosed |
| EP-4700081-A1 | THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED ARTICLE COMPRISING SAME | LG Chem, Ltd. (KR) | 2026-02-25 | — | — | EP | disclosed |
| US-12559623-B2 | Resin composition and electromagnetic wave absorber | MITSUBISHI CHEMICAL CORPORATION (JP) | 2026-02-24 | — | — | US | disclosed |
| EP-4685188-A1 | THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND MOLDED ARTICLE COMPRISING SAME | LG Chem, Ltd. (KR) | 2026-01-28 | — | — | EP | disclosed |
| US-12534597-B2 | Polyamide resin composition and molded object thereof | KURARAY CO., LTD. (JP) | 2026-01-27 | — | — | US | disclosed |
| US-20090029138-A1 | Resin Composition Having Excellent Heat Resistance | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-01-29 | — | — | US | disclosed |
| EP-1995280-A1 | FLAME RETARDANT POLYAMIDE RESIN COMPOSITION AND MOLDING | Mitsubishi Engineering-Plastics Corporation (JP) | 2008-11-26 | — | — | EP | disclosed |
| CN-101309971-A | heat-resistant resin composition | ASAHI CHEMICAL CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| CN-101309972-A | Resin composition having excellent heat resistance | ASAHI CHEMICAL CORP (JP) | 2008-11-19 | — | — | CN | disclosed |
| EP-1956048-A1 | RESIN COMPOSITION EXCELLENT IN FLAME RETARDANCE | Asahi Kasei Chemicals Corporation (JP) | 2008-08-13 | — | — | EP | disclosed |
| EP-1950249-A1 | RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| EP-1950248-A1 | HEAT-RESISTANT RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2008-07-30 | — | — | EP | disclosed |
| US-20070235893-A1 | Method for producing resin strand | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-10-11 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12534597-B2 | Polyamide resin composition and molded object thereof | SMC2, DAP3, RPTOR | LPAR3 1406/4885LPAR2 652/4885 |
| US-20260139106-A1 | INSULATION FILM | PAICS, KIF11, ABAT | LPAR3 4498/4885LPAR2 4638/4885 |
| US-12559623-B2 | Resin composition and electromagnetic wave absorber | TERB1, LBR, TEX10 | LPAR3 3152/4885LPAR2 3647/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.