SCHEMBL190569

SCHEMBL190569

CCCP(C)(=O)[O-].CCCP(C)(=O)[O-].[Ca+2]

nearest known ligand 0.32

Known targets — ChEMBL curated mechanism

GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
LPAR3 Q9UBY5 3/20 0.31
LPAR2 Q9HBW0 1/20 0.31
FDPS P14324 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL190266 0.94 LPAR3 (0.31) LPAR3LPAR2
SCHEMBL345249 0.94 LPAR3 (0.31) LPAR3LPAR2
Zinc Ion SCHEMBL191361 0.94 LPAR3 (0.31) LPAR3LPAR2
SCHEMBL7528483 0.94
SCHEMBL19895695 0.94 LPAR3 (0.31) LPAR3LPAR2
SCHEMBL30695089 0.94 LPAR3 (0.31) LPAR3LPAR2
SCHEMBL6051110 0.87
SCHEMBL688210 0.83 CA2 (0.31)
SCHEMBL29120174 0.78 LPAR3 (0.32) LPAR3LPAR2FDPS
SCHEMBL4623520 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 268 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220356328-A1 Polyamide Composition and the Article Thereof BASF SE (DE) 2022-11-10 US claimed
EP-4041801-A1 POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF BASF SE (DE) 2022-08-17 EP claimed
CN-114502656-A Polyamide composition and article thereof 巴斯夫欧洲公司 2022-05-13 CN claimed
WO-2021069456-A1 POLYAMIDE COMPOSITION AND THE ARTICLE THEREOF BASF SE (DE) 2021-04-15 WO claimed
US-20260139106-A1 INSULATION FILM BASF SE (DE) 2026-05-21 US disclosed
EP-4743515-A1 A FILLER COMPOSITION AND ITS USE IN POLYAMIDE-BASED MATERIAL BASF SE (DE) 2026-05-20 EP disclosed
WO-2026098475-A1 BIO-BASED POLYAMIDE COMPOSITION HAVING GOOD STIFFNESS AND HEAT RESISTANCE BASF SE (DE) 2026-05-15 WO disclosed
EP-4169977-B1 RESIN COMPOSITION, MOLDED BODY AND ELECTROMAGNETIC WAVE ABSORBER MITSUBISHI CHEM CORP (JP) 2026-03-18 EP disclosed
EP-4700081-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD FOR PREPARING SAME, AND MOLDED ARTICLE COMPRISING SAME LG Chem, Ltd. (KR) 2026-02-25 EP disclosed
US-12559623-B2 Resin composition and electromagnetic wave absorber MITSUBISHI CHEMICAL CORPORATION (JP) 2026-02-24 US disclosed
EP-4685188-A1 THERMOPLASTIC RESIN COMPOSITION, PREPARATION METHOD THEREFOR AND MOLDED ARTICLE COMPRISING SAME LG Chem, Ltd. (KR) 2026-01-28 EP disclosed
US-12534597-B2 Polyamide resin composition and molded object thereof KURARAY CO., LTD. (JP) 2026-01-27 US disclosed
CN-101309971-A heat-resistant resin composition ASAHI CHEMICAL CORP (JP) 2008-11-19 CN disclosed
CN-101309972-A Resin composition having excellent heat resistance ASAHI CHEMICAL CORP (JP) 2008-11-19 CN disclosed
EP-1956048-A1 RESIN COMPOSITION EXCELLENT IN FLAME RETARDANCE Asahi Kasei Chemicals Corporation (JP) 2008-08-13 EP disclosed
EP-1950249-A1 RESIN COMPOSITION HAVING EXCELLENT HEAT RESISTANCE Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
EP-1950248-A1 HEAT-RESISTANT RESIN COMPOSITION Asahi Kasei Chemicals Corporation (JP) 2008-07-30 EP disclosed
EP-1670862-B1 FLAME-PROOFED POLYAMIDE MOULDING MATERIALS AND THE USE THEREOF EMS CHEMIE AG (CH) 2008-06-18 EP disclosed
US-20070235893-A1 Method for producing resin strand ASAHI KASEI CHEMICALS CORPORATION (JP) 2007-10-11 US disclosed
US-20070072970-A1 Flame-proofed polyamide molding materials and the use thereof EMS-CHEMIE AG (CH) 2007-03-29 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12534597-B2 Polyamide resin composition and molded object thereof SMC2, DAP3, RPTOR LPAR3 1406/4885LPAR2 652/4885FDPS 2523/4885
US-20260139106-A1 INSULATION FILM PAICS, KIF11, ABAT LPAR3 4498/4885LPAR2 4638/4885FDPS 3914/4885
US-12559623-B2 Resin composition and electromagnetic wave absorber TERB1, LBR, TEX10 LPAR3 3152/4885LPAR2 3647/4885FDPS 4596/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.