Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 3/20 | 0.38 |
| ▸ | POLB | P06746 | 2/20 | 0.38 |
| ▸ | GAA | P10253 | 2/20 | 0.38 |
| ▸ | GLA | P06280 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.37 |
| ▸ | NPC1 | O15118 | 3/20 | 0.37 |
| ▸ | RAB9A | P51151 | 3/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 3/20 | 0.35 |
| ▸ | PTPRC | P08575 | 2/20 | 0.35 |
| ▸ | HPGD | P15428 | 2/20 | 0.35 |
| ▸ | MEN1 | O00255 | 2/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.35 |
| ▸ | APAF1 | O14727 | 1/20 | 0.35 |
| ▸ | TDP2 | O95551 | 1/20 | 0.35 |
| ▸ | NSD2 | O96028 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19622621 | 0.88 | ALDH1A1 (0.45) | TSHRPOLBGAAGLAALDH1A1 | |
| SCHEMBL23878080 | 0.87 | ALDH1A1 (0.40) | TSHRPOLBGAAGLAALDH1A1 | |
| SCHEMBL27801366 | 0.83 | MAOA (0.42) | TSHRPOLBGAAGLAALDH1A1 | |
| SCHEMBL25941241 | 0.82 | PTPN11 (0.39) | TSHRPOLBALDH1A1CYP3A4SMN1; SMN2 | |
| SCHEMBL3480852 | 0.80 | CASP1 (0.37) | TSHRPOLBALDH1A1CYP3A4TDP1 | |
| SCHEMBL25518221 | 0.78 | ALDH1A1 (0.32) | TSHRALDH1A1CYP3A4CASP1KDM4E | |
| SCHEMBL17643517 | 0.76 | APP (0.38) | — | |
| SCHEMBL21021741 | 0.76 | CYP3A4 (0.52) | TSHRPOLBGAAALDH1A1CYP3A4 | |
| SCHEMBL20382436 | 0.76 | TSHR (0.31) | TSHRPOLBGAAGLAALDH1A1 | |
| SCHEMBL20612874 | 0.76 | ALDH1A1 (0.52) | TSHRPOLBGAAALDH1A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10077337-B2 | Polyimide, resin film, and metal-clad laminate | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2018-09-18 | — | — | US | claimed |
| US-20170321011-A1 | POLYIMIDE, RESIN FILM, AND METAL-CLAD LAMINATE | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2017-11-09 | — | — | US | claimed |
| CN-105339416-B | Polyimides, resin film and metallic cover layered product | 新日铁住金化学株式会社 | 2017-07-14 | — | — | CN | claimed |
| CN-115122735-B | Polyimide, resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-clad laminate, and circuit board | NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) | 2026-05-26 | — | — | CN | disclosed |
| CN-115891346-B | Metal-clad laminate, circuit board, electronic component, and electronic device | 日铁化学材料株式会社 | 2026-05-15 | — | — | CN | disclosed |
| EP-4029690-B1 | METAL-CLAD LAMINATE FOR FLEXIBLE ELECTRONIC DEVICES, AND FLEXIBLE ELECTRONIC DEVICE USING SAME | NIPPON STEEL CHEMICAL & MAT CO LTD (JP) | 2026-04-22 | — | — | EP | disclosed |
| WO-2025070767-A1 | RESIN COMPOSITION, COATING SOLUTION, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025070797-A1 | COPOLYMER, RESIN BASE MATERIAL, RESIN COMPOSITION, COATING LIQUID, POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, AND MANUFACTURING METHOD | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025027948-A1 | ADHESIVE COMPOSITION FOR PRINTED WIRING BOARDS, BONDING FILM FOR PRINTED WIRING BOARDS, COVERLAY FOR PRINTED WIRING BOARDS, AND PRINTED WIRING BOARD | 住友電工プリントサーキット株式会社 | 2025-02-06 | — | — | WO | disclosed |
| CN-119217819-A | Laminate, metal-clad laminate, circuit board, electronic component, device, adhesive resin composition, method for producing the same, and adhesive film | 日铁化学材料株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-112571901-B | Polyimide film, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-105532080-A | Adhesive composition for printed wiring board, bonding film, cover layer, copper clad laminate, and printed wiring board | SUMITOMO ELECTRIC INDUSTRIES | 2016-04-27 | — | — | CN | disclosed |
| US-9181381-B2 | Photosensitive resin composition and cured film | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2015-11-10 | — | — | US | disclosed |
| US-9181381-B2 | Photosensitive resin composition and cured film | NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) | 2015-11-10 | — | — | US | disclosed |
| JP-5367809-B2 | — | — | 2013-12-11 | — | — | JP | disclosed |
| US-20120015298-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2012-01-19 | — | — | US | disclosed |
| US-20120015298-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2012-01-19 | — | — | US | disclosed |
| US-8026036-B2 | Photosensitive resin composition and circuit substrate employing the same | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2011-09-27 | — | — | US | disclosed |
| WO-2010110335-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM | 新日鐵化学株式会社 (JP) | 2010-09-30 | — | — | WO | disclosed |
| US-20090202786-A1 | Photosensitive Resin Composition and Circuit Substrate Employing the Same | NIPPON STEEL CHEMICALS CO., LTD (JP) | 2009-08-13 | — | — | US | disclosed |