SCHEMBL346354

SCHEMBL346354

O=Cc1ccc(Oc2ccc(Oc3ccc(O)cc3)cc2)cc1

nearest known ligand 0.73

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH5A1 P51649 1/20 0.73
ABAT P80404 1/20 0.73
KMT2A Q03164 2/20 0.64
MEN1 O00255 1/20 0.64
ESR1 P03372 1/20 0.64
ESR2 Q92731 1/20 0.64
PARP10 Q53GL7 2/20 0.60
PARP3 Q9Y6F1 1/20 0.60
LTA4H P09960 3/20 0.54
NR1H2 P55055 1/20 0.54
BAX Q07812 1/20 0.54
ALDH1A1 P00352 3/20 0.52
CYP2A6 P11509 1/20 0.52
KDM4E B2RXH2 3/20 0.52
LMNA P02545 1/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
ALDH1A3 P47895 1/20 0.47
STS P08842 1/20 0.45
MAPT P10636 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7545244 1.00 ALDH5A1 (0.73) ALDH5A1ABATKMT2AMEN1ESR1
4-Hydroxybenzaldehyde SCHEMBL28577371 1.00 ALDH5A1 (0.73) ALDH5A1ABATKMT2AMEN1ESR1
SCHEMBL6928612 0.90 ALDH5A1 (0.59) ALDH5A1ABATKMT2AMEN1ESR1
Phenol SCHEMBL17941265 0.90 LTA4H (0.59) ALDH5A1ABATKMT2AMEN1ESR1
SCHEMBL5050902 0.88 PARP10 (0.65) ALDH5A1ABATKMT2APARP10PARP3
SCHEMBL1663469 0.88 PARP10 (0.65) ALDH5A1ABATKMT2APARP10PARP3
Phenol SCHEMBL17941267 0.88 LTA4H (0.63) ALDH5A1ABATKMT2AMEN1ESR1
SCHEMBL22065383 0.86 ALDH5A1 (0.59) ALDH5A1ABATKMT2AMEN1ESR1
SCHEMBL22064844 0.86 ALDH5A1 (0.59) ALDH5A1ABATKMT2AMEN1ESR1
4-Hydroxybenzaldehyde SCHEMBL37193 0.85

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2328978-B1 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS MILLER WASTE MILLS D B A RTP COMPANY (US) 2016-07-20 EP claimed
US-9136036-B2 Injection moldable, thermoplastic composite materials Miller Waster Mills (US) 2015-09-15 US claimed
EP-2328978-A2 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS Miller Waste Mills D/b/a Rtp Company (US) 2011-06-08 EP claimed
US-20100003438-A1 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS Miller Waste Mills d/b/a RTP Company 2010-01-07 US claimed
WO-2010002546-A2 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS Miller Waste Mills d/b/a RTP Company (US) 2010-01-07 WO claimed
EP-2335320-B1 FLUID CARRYING ELEMENT FOR USE AS A DIELECTRIC ISOLATOR EATON CORP (US) 2018-09-05 EP disclosed
CN-104192312-B DIELECRTIC ISOLATORS 伊顿公司 2017-05-03 CN disclosed
US-9618148-B2 Dielectric isolators EATON CORPORATION (US) 2017-04-11 US disclosed
EP-2310270-B1 FLUID CARRYING ELEMENT FOR USE IN DIELECTRIC ISOLATORS EATON CORP (US) 2016-10-26 EP disclosed
CN-102137794-B Dielecrtic isolators 伊顿公司 2016-10-19 CN disclosed
EP-2328978-B1 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS MILLER WASTE MILLS D B A RTP COMPANY (US) 2016-07-20 EP disclosed
US-9234615-B2 Dielectric isolators EATON CORPORATION (US) 2016-01-12 US disclosed
EP-2328978-A2 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS Miller Waste Mills D/b/a Rtp Company (US) 2011-06-08 EP disclosed
EP-2310270-A1 DIELECTRIC ISOLATORS Eaton Corporation (US) 2011-04-20 EP disclosed
WO-2010044930-A2 DIELECRTIC ISOLATORS EATON CORPORATION (US) 2010-04-22 WO disclosed
US-20100003438-A1 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS Miller Waste Mills d/b/a RTP Company 2010-01-07 US disclosed
US-20100001512-A1 Dielectric Isolators EATON INTELLIGENT POWER LIMITED (IE) 2010-01-07 US disclosed
US-20100003840-A1 Dielectric Isolators EATON CORPORATION (US) 2010-01-07 US disclosed
WO-2010001238-A1 DIELECTRIC ISOLATORS EATON CORPORATION (US) 2010-01-07 WO disclosed
WO-2010002546-A2 INJECTION MOLDABLE, THERMOPLASTIC COMPOSITE MATERIALS Miller Waste Mills d/b/a RTP Company (US) 2010-01-07 WO disclosed