SCHEMBL3475906

SCHEMBL3475906

O=C(O)c1ccc(C(c2ccccc2)(c2ccc(C(=O)O)c(C(=O)O)c2)C(F)(F)C(F)(F)F)cc1C(=O)O

nearest known ligand 0.42

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 3/20 0.42
ALDH1A1 P00352 3/20 0.42
KDM4E B2RXH2 3/20 0.42
HPGD P15428 2/20 0.42
CDC25A P30304 1/20 0.41
CDC25B P30305 1/20 0.41
ALOX15 P16050 1/20 0.41
SORT1 Q99523 6/20 0.40
GRIK1 P39086 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
ACLY P53396 2/20 0.39
RXRA P19793 1/20 0.38
RXRB P28702 1/20 0.38
USP2 O75604 1/20 0.38
CYP2C19 P33261 1/20 0.38
HNF4A P41235 1/20 0.38
ACMSD Q8TDX5 1/20 0.38
MPO P05164 1/20 0.37
TAS2R14 Q9NYV8 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29405528 0.90 ALDH1A1 (0.45) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL3475902 0.90 ALDH1A1 (0.45) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL9720141 0.83 ACMSD (0.47) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL829980 0.80 HSD17B10 (0.47) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL8676346 0.80 HSD17B10 (0.47) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL8923161 0.80 HSD17B10 (0.47) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL16990744 0.79 KDM4E (0.53) HSD17B10ALDH1A1KDM4EHPGDSORT1
SCHEMBL8920312 0.78 HSD17B10 (0.46) HSD17B10ALDH1A1KDM4EHPGDCDC25A
Water SCHEMBL1093471 0.78 HSD17B10 (0.46) HSD17B10ALDH1A1KDM4EHPGDCDC25A
SCHEMBL12046457 0.77 TDP1 (0.45) HSD17B10ALDH1A1KDM4EHPGDCDC25A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2092807-B1 COMPOSITE ORGANIC ENCAPSULANTS CDA PROC LTD LIABILITY COMPANY (US) 2013-04-17 EP claimed
US-7745516-B2 Composition of polyimide and sterically-hindered hydrophobic epoxy E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-29 US claimed
US-20090111948-A1 Compositions comprising polyimide and hydrophobic epoxy and phenolic resins, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2009-04-30 US claimed
EP-2027184-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 2009-02-25 EP claimed
US-20080185561-A1 Resistor compositions for electronic circuitry applications U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2008-08-07 US claimed
US-20080185361-A1 Compositions for electronic circuitry applications and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2008-08-07 US claimed
WO-2007146382-A2 HYDROPHOBIC COMPOSITIONS FOR ELECTRONIC APPLICATIONS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-12-21 WO claimed
US-20070290379-A1 Hydrophobic compositions for electronic applications E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US claimed
US-20070083017-A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2007-04-12 US claimed
EP-2092807-B1 COMPOSITE ORGANIC ENCAPSULANTS CDA PROC LTD LIABILITY COMPANY (US) 2013-04-17 EP disclosed
US-8233261-B2 Composite organic encapsulants CDA PROCESSING LIMITED LIABILITY COMPANY (US) 2012-07-31 US disclosed
US-7745516-B2 Composition of polyimide and sterically-hindered hydrophobic epoxy E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-06-29 US disclosed
US-20100085680-A1 CRYSTALLINE ENCAPSULANTS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2010-04-08 US disclosed
US-20100067168-A1 COMPOSITE ORGANIC ENCAPSULANTS E.I. DU PONT DE NEMOURS AND COMPANY Patents Records Center/Dupont Legal (DE) 2010-03-18 US disclosed
WO-2007146383-A1 ORGANIC ENCAPSULANT COMPOSITIONS BASED ON HETEROCYCLIC POLYMERS FOR PROTECTION OF ELECTRONIC COMPONENTS E. I. DU PONT DE NEMOURS AND COMPANY (US) 2007-12-21 WO disclosed
US-20070291440-A1 Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US disclosed
US-20070290379-A1 Hydrophobic compositions for electronic applications E. I. DU PONT DE NEMOURS AND COMPANY 2007-12-20 US disclosed
WO-2007047384-A1 COMPOSITIONS COMPRISING POLYIMIDE AND HYDROPHOBIC EPOXY, AND METHODS RELATING THERETO E.I. DU PONT DE NEMOURS AND COMPANY (US) 2007-04-26 WO disclosed
US-20070083016-A1 Photosensitive polyimide compositions E. I. DUPONT DE NEMOURS AND COMPANY 2007-04-12 US disclosed
US-20070083017-A1 Compositions comprising polyimide and hydrophobic epoxy, and methods relating thereto CDA PROCESSING LIMITED LIABILITY COMPANY 2007-04-12 US disclosed