Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL703768 | 0.84 | KCNN4 (0.35) | KCNN4LMNA | |
| SCHEMBL3481886 | 0.78 | MAPK1 (0.36) | LMNA | |
| SCHEMBL3482153 | 0.77 | TP53 (0.41) | KCNN4LMNA | |
| SCHEMBL704048 | 0.73 | KCNN4 (0.38) | KCNN4LMNA | |
| SCHEMBL706839 | 0.73 | KCNN4 (0.38) | KCNN4LMNA | |
| SCHEMBL4281338 | 0.73 | KCNN4 (0.38) | KCNN4LMNA | |
| SCHEMBL708048 | 0.73 | KCNN4 (0.34) | KCNN4LMNA | |
| SCHEMBL5024578 | 0.72 | TAAR1 (0.38) | KCNN4LMNA | |
| SCHEMBL3482395 | 0.72 | ALDH1A1 (0.31) | — | |
| SCHEMBL4281342 | 0.72 | KCNN4 (0.36) | KCNN4LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |