SCHEMBL3481905

SCHEMBL3481905

CCCC(C)C(CC)O[SiH3]

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
METAP1 P53582 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20134679 0.87 METAP1 (0.32) METAP1
SCHEMBL3481995 0.86 ALDH1A1 (0.33)
SCHEMBL3481613 0.84 OPRM1 (0.39)
SCHEMBL2769493 0.81
SCHEMBL2772993 0.80
SCHEMBL4771676 0.79 TSHR (0.36)
SCHEMBL13953238 0.77 METAP1 (0.32) METAP1
SCHEMBL3482265 0.77 LMNA (0.31)
SCHEMBL4766514 0.74 METAP1 (0.33) METAP1
SCHEMBL706291 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10995249-B2 Tire with reduced cavity noise HANKOOK TIRE CO., LTD. 2021-05-04 US disclosed
US-10947430-B2 Tire with reduced cavity noise HANKOOK TIRE CO., LTD. 2021-03-16 US disclosed
EP-3321108-B1 TIRE WITH REDUCED CAVITY NOISE HANKOOK TIRE CO LTD (KR) 2019-05-15 EP disclosed
US-20180282600-A1 TIRE WITH REDUCED CAVITY NOISE HANKOOK TIRE CO., LTD. (KR) 2018-10-04 US disclosed
EP-3381712-A1 TIRE WITH REDUCED CAVITY NOISE Hankook Tire Co., Ltd. (KR) 2018-10-03 EP disclosed
US-20180134933-A1 TIRE WITH REDUCED CAVITY NOISE HANKOOK TIRE CO., LTD. (KR) 2018-05-17 US disclosed
EP-3321108-A1 TIRE WITH REDUCED CAVITY NOISE Hankook Tire Co., Ltd. (KR) 2018-05-16 EP disclosed
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed
CN-100354319-C Hydrogenation catalyst composition and method for hydrogenating conjugate diene polymer TAIWAN RUBBER CO LTD (CN) 2007-12-12 CN disclosed
CN-1781955-A Hydrogenation catalyst composition and method for hydrogenating conjugate diene polymer TAIWAN RUBBER CO LTD (CN) 2006-06-07 CN disclosed