SCHEMBL3482541

SCHEMBL3482541

Cc1ccc([SiH](Cl)c2ccccc2)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACHE P22303 2/20 0.48
LMNA P02545 2/20 0.48
TSHR P16473 1/20 0.48
ALOX12 P18054 1/20 0.48
HPGD P15428 4/20 0.41
TDP1 Q9NUW8 3/20 0.40
CES2 O00748 1/20 0.38
CES1 P23141 1/20 0.38
POLB P06746 2/20 0.38
ALDH1A1 P00352 3/20 0.37
SMN1; SMN2 Q16637 2/20 0.37
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
KDM4E B2RXH2 2/20 0.35
MAPT P10636 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
NPC1 O15118 4/20 0.34
RAB9A P51151 4/20 0.34
HTT P42858 1/20 0.34
CYP2C19 P33261 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3039654 0.89 ACHE (0.50) ACHELMNATSHRALOX12TDP1
SCHEMBL297217 0.84 TSHR (0.39) ACHELMNATSHRALOX12HPGD
SCHEMBL3482115 0.81 ACHE (0.38) ACHELMNATSHRALOX12TDP1
Water SCHEMBL9174447 0.81 TSHR (0.37) ACHELMNATSHRALOX12TDP1
SCHEMBL22830125 0.81 TSHR (0.37) ACHELMNATSHRALOX12TDP1
SCHEMBL2455761 0.79 ACHE (0.53) ACHELMNATSHRALOX12HPGD
SCHEMBL7825995 0.79 ACHE (0.53) ACHELMNATSHRALOX12HPGD
SCHEMBL12825596 0.78 ACHE (0.36) ACHELMNATSHRALOX12HPGD
SCHEMBL25690657 0.77 CYP1A2 (0.48) LMNATSHRTDP1ALDH1A1SMN1; SMN2
SCHEMBL12191027 0.77 ACHE (0.50) ACHELMNATSHRALOX12HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2128897-B1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LTD (JP) 2015-05-06 EP disclosed
US-8716209-B2 Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device FUJITSU LIMITED (JP) 2014-05-06 US disclosed
US-20100007031-A1 AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2128897-A1 SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE Fujitsu Limited (JP) 2009-12-02 EP disclosed