Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ADRA2A | P08913 | 4/20 | 0.33 |
| ▸ | ADRA2B | P18089 | 4/20 | 0.33 |
| ▸ | ADRA2C | P18825 | 4/20 | 0.33 |
| ▸ | HTR1A | P08908 | 3/20 | 0.32 |
| ▸ | NISCH | Q9Y2I1 | 1/20 | 0.32 |
| ▸ | ELANE | P08246 | 1/20 | 0.31 |
| ▸ | CYP4F2 | P78329 | 1/20 | 0.31 |
| ▸ | CYP4A11 | Q02928 | 1/20 | 0.31 |
| ▸ | LIPG | Q9Y5X9 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.31 |
| ▸ | PPARG | P37231 | 1/20 | 0.31 |
| ▸ | PPARA | Q07869 | 1/20 | 0.31 |
| ▸ | SLC6A2 | P23975 | 2/20 | 0.30 |
| ▸ | SLC6A4 | P31645 | 2/20 | 0.30 |
| ▸ | SLC6A3 | Q01959 | 2/20 | 0.30 |
| ▸ | PPARD | Q03181 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3481842 | 0.89 | LIPG (0.40) | CYP4F2CYP4A11LIPGPPARA | |
| SCHEMBL3482236 | 0.87 | ALDH1A1 (0.35) | ADRA2AADRA2BADRA2CHTR1ANISCH | |
| SCHEMBL4267871 | 0.84 | MAPT (0.40) | CYP4F2CYP4A11MAPTNPSR1L3MBTL1 | |
| SCHEMBL3482132 | 0.82 | ADRA2A (0.34) | ADRA2AADRA2BADRA2CHTR1ANISCH | |
| SCHEMBL1069351 | 0.82 | TAAR1 (0.36) | CYP4F2CYP4A11LIPG | |
| SCHEMBL28537235 | 0.82 | CYP4F2 (0.38) | ELANECYP4F2CYP4A11LIPG | |
| SCHEMBL28546603 | 0.82 | CYP4F2 (0.32) | CYP4F2CYP4A11LIPG | |
| SCHEMBL28693907 | 0.82 | LIPG (0.45) | ADRA2ALIPGMAPTPPARGPPARA | |
| SCHEMBL555267 | 0.81 | — | — | |
| SCHEMBL6666783 | 0.81 | MEN1 (0.34) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115181223-A | Low-gloss matte auxiliary agent, preparation method thereof and formed body | 铨盛聚碳科技股份有限公司 | 2022-10-14 | — | — | CN | disclosed |
| CN-114085382-A | Hydrogen-containing poly titanium boron siloxane flame retardant, and preparation method and application thereof | 铨盛聚碳科技股份有限公司 | 2022-02-25 | — | — | CN | disclosed |
| CN-108250754-B | Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2022-01-25 | — | — | CN | disclosed |
| US-9546237-B2 | Stabilization of polymers that contain a hydrolyzable functionality | BRIDGESTONE CORPORATION (JP) | 2017-01-17 | — | — | US | disclosed |
| US-9091920-B2 | Photosensitive siloxane resin composition | MERCK PATENT GMBH (DE) | 2015-07-28 | — | — | US | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8906993-B2 | Coating composition containing siloxane resin | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2014-12-09 | — | — | US | disclosed |
| US-20140335448-A1 | PHOTOSENSITIVE SILOXANE RESIN COMPOSITION | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2014-11-13 | — | — | US | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-20140024758-A1 | COATING COMPOSITION CONTAINING SILOXANE RESIN | AZ ELECTRONIC MATERIALS USA CORP. (US) | 2014-01-23 | — | — | US | disclosed |
| US-20130331520-A1 | STABILIZATION OF POLYMERS THAT CONTAIN A HYDROLYZABLE FUNCTIONALITY | BRIDGESTONE CORPORATION (JP) | 2013-12-12 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| EP-0410798-A2 | Process for preparation of anti-fogging coating | TORAY INDUSTRIES, INC. (JP) | 1991-01-30 | — | — | EP | disclosed |
| EP-0400785-A2 | Ultraviolet curable phenyl and acrylamide group-containing silicone compositions | DOW CORNING CORPORATION (US) | 1990-12-05 | — | — | EP | disclosed |
| EP-0400786-A2 | Heat stable acrylamide polysiloxane composition | DOW CORNING CORPORATION (US) | 1990-12-05 | — | — | EP | disclosed |