SCHEMBL348491

SCHEMBL348491

Cc1cc(C)c(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(C(c2cc(C)cc(C)c2Oc2ccc(N3C(=O)C=CC3=O)cc2)(C(F)(F)F)C(F)(F)F)c1

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 11/20 0.43
AR P10275 1/20 0.41
HSP90AA1 P07900 5/20 0.40
CCR6 P51684 2/20 0.40
ALDH1A1 P00352 2/20 0.40
HPGD P15428 2/20 0.40
HTT P42858 2/20 0.40
MEN1 O00255 1/20 0.40
LMNA P02545 1/20 0.40
PKM P14618 1/20 0.40
KMT2A Q03164 1/20 0.40
ATM Q13315 1/20 0.40
FAAH O00519 3/20 0.37
CACNA1B Q00975 1/20 0.34
APBA1 Q02410 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
NPBWR1 P48145 2/20 0.33
MCHR1 Q99705 2/20 0.33
G6PD P11413 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8735694 0.85 MGLL (0.48) MGLLARHSP90AA1CCR6ALDH1A1
SCHEMBL28064497 0.84 MGLL (0.56) MGLLARHSP90AA1CCR6ALDH1A1
SCHEMBL349317 0.78 MGLL (0.43) MGLLHSP90AA1CCR6ALDH1A1HPGD
SCHEMBL7610901 0.78 ALDH1A1 (0.49) ARALDH1A1HPGDMEN1KMT2A
SCHEMBL28606344 0.78 MGLL (0.46) MGLLARHSP90AA1CCR6ALDH1A1
SCHEMBL8046371 0.78 MGLL (0.49) MGLLHSP90AA1CCR6ALDH1A1HPGD
SCHEMBL8985417 0.77 AR (0.50) AR
SCHEMBL8730209 0.76 MGLL (0.47) MGLLHSP90AA1CCR6ALDH1A1HPGD
SCHEMBL31180030 0.76 MGLL (0.60) MGLLHSP90AA1CCR6ALDH1A1HPGD
SCHEMBL31180052 0.76 MGLL (0.56) MGLLHSP90AA1CCR6ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20190203048-A1 Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2019-07-04 US disclosed
EP-1646486-B1 Process for preparing medical devices BOSTON SCIENT LTD (BB) 2012-02-22 EP disclosed
US-20120013043-A1 MEDICAL DEVICES AND PROCESSES FOR PREPARING SAME BOSTON SCIENTIFIC SCIMED, INC. (US) 2012-01-19 US disclosed
US-8025637-B2 Medical balloons and processes for preparing same BOSTON SCIENTIFIC SCIMED, INC. (US) 2011-09-27 US disclosed
EP-1646486-A2 MEDICAL DEVICES AND PROCESSES FOR PREPARING SAME Boston Scientific Limited (BB) 2006-04-19 EP disclosed
WO-2005007375-A2 MEDICAL DEVICES AND PROCESSES FOR PREPARING SAME BOSTON SCIENTIFIC LIMITED (BB) 2005-01-27 WO disclosed
US-20050015046-A1 Medical devices and processes for preparing same SCIMED LIFE SYSTEMS, INC. (US) 2005-01-20 US disclosed
US-20020151659-A1 Formed from 6,6'-bis(2-(4-fluorophenyl)-4- phenylquinoline) and 4,4'-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol and 2,2-bis((4-maleimidophenoxy)phenyl)propane; dielectrics HITACHI CHEMICAL CO., LTD. (JP) 2002-10-17 US disclosed
US-6462148-B1 RESIN COMPOSITION COMPRISING A POLYMER CONTAINING A QUINOLINE RING AND A THERMOSETTING RESIN, AN INSULATING MATERIAL CONSTITUTED BY SAID RESIN COMPOSITION AND AN ADHESIVE FILM, PARTICULARLY A RESIN FOR AN INTERLAYER INSULATION FILM HITACHI CHEMICAL CO., LTD. (JP) 2002-10-08 US disclosed
US-6132852-A LAMINATE OF POLYMER CONDUCTOR AND DIELECTRIC HITACHI, LTD. (JP) 2000-10-17 US disclosed
EP-0476589-B1 Multi-layer wiring substrate and production thereof HITACHI LTD (JP) 1996-06-12 EP disclosed
EP-0476589-A2 Multi-layer wiring substrate and production thereof HITACHI, LTD. (JP) 1992-03-25 EP disclosed