SCHEMBL8730209

SCHEMBL8730209

O=C1C=CC(=O)N1c1ccc(Oc2c(C(F)(F)F)cc(C(c3cc(C(F)(F)F)c(Oc4ccc(N5C(=O)C=CC5=O)cc4)c(C(F)(F)F)c3)(C(F)(F)F)C(F)(F)F)cc2C(F)(F)F)cc1

nearest known ligand 0.47

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.47
HSP90AA1 P07900 3/20 0.42
PKM P14618 2/20 0.42
MEN1 O00255 1/20 0.42
ALDH1A1 P00352 1/20 0.42
LMNA P02545 1/20 0.42
HPGD P15428 1/20 0.42
HTT P42858 1/20 0.42
CCR6 P51684 1/20 0.42
KMT2A Q03164 1/20 0.42
ATM Q13315 1/20 0.42
FAAH O00519 5/20 0.40
MAPK1 P28482 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
NPBWR1 P48145 3/20 0.33
MCHR1 Q99705 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8735694 0.85 MGLL (0.48) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL8729999 0.85 MGLL (0.44) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL8734840 0.84 MGLL (0.47) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL8730074 0.83
SCHEMBL94319 0.82 MGLL (0.60) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL7605833 0.80 MGLL (0.41) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL30793053 0.80 MGLL (0.41) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL8046371 0.78 MGLL (0.49) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL348491 0.76 MGLL (0.43) MGLLHSP90AA1PKMMEN1ALDH1A1
SCHEMBL349317 0.76 MGLL (0.43) MGLLHSP90AA1PKMMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0618269-B1 Thermosetting resin compositions and their use for making resin articles and thin film wiring boards HITACHI LTD (JP) 1998-11-11 EP disclosed
EP-0755979-A2 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1997-01-29 EP disclosed
EP-0618269-A1 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1994-10-05 EP disclosed