Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 13/20 | 0.48 |
| ▸ | HSP90AA1 | P07900 | 6/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.43 |
| ▸ | HPGD | P15428 | 2/20 | 0.43 |
| ▸ | HTT | P42858 | 2/20 | 0.43 |
| ▸ | PKM | P14618 | 2/20 | 0.43 |
| ▸ | CCR6 | P51684 | 2/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | ATM | Q13315 | 1/20 | 0.43 |
| ▸ | FAAH | O00519 | 3/20 | 0.41 |
| ▸ | NPSR1 | Q6W5P4 | 2/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.37 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.37 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.37 |
| ▸ | AR | P10275 | 1/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | NPBWR1 | P48145 | 1/20 | 0.36 |
| ▸ | MCHR1 | Q99705 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28606344 | 0.87 | MGLL (0.46) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL8730209 | 0.85 | MGLL (0.47) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL8734840 | 0.85 | MGLL (0.47) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL27939455 | 0.85 | HSP90AA1 (0.46) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL348491 | 0.85 | MGLL (0.43) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL8735089 | 0.85 | MGLL (0.51) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL8729990 | 0.84 | MGLL (0.46) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL8046371 | 0.84 | MGLL (0.49) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL31180052 | 0.83 | MGLL (0.56) | MGLLHSP90AA1ALDH1A1HPGDHTT | |
| SCHEMBL94319 | 0.83 | MGLL (0.60) | MGLLHSP90AA1ALDH1A1HPGDHTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12504687-B2 | Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2025-12-23 | — | — | US | disclosed |
| CN-117700990-A | Resin composition, adhesive, coating agent, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2024-03-15 | — | — | CN | disclosed |
| US-20240006183-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2024-01-04 | — | — | US | disclosed |
| US-11798810-B2 | Resist underlayer film-forming composition containing amide solvent | NISSAN CHEMICAL CORPORATION (JP) | 2023-10-24 | — | — | US | disclosed |
| CN-115877658-A | Curable photosensitive resin composition, cured product, resist pattern and method for producing same, semiconductor element, and electronic device | 荒川化学工业株式会社 | 2023-03-31 | — | — | CN | disclosed |
| US-20230101181-A1 | CURABLE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, RESIST PATTERN, METHOD OF PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| CN-113156762-A | Photosensitive resin composition, dry film, cured product and printed wiring board | 日本化药株式会社 | 2021-07-23 | — | — | CN | disclosed |
| US-20190354018-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2019-11-21 | — | — | US | disclosed |
| US-9596754-B2 | Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate | TAIYO INK MFG. CO., LTD. (JP) | 2017-03-14 | — | — | US | disclosed |
| US-9331536-B2 | Rotator coil and method of manufacturing the same | MITSUBISHI ELECTRIC CORPORATION (JP) | 2016-05-03 | — | — | US | disclosed |
| US-9188871-B2 | Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof | TAIYO INK MFG. CO., LTD. (JP) | 2015-11-17 | — | — | US | disclosed |
| US-9068100-B2 | Thermosetting resin composition, cured product thereof, and printed wiring board using the same | TAIYO INK MFG. CO., LTD. (JP) | 2015-06-30 | — | — | US | disclosed |
| US-8785567-B2 | Liquid crystal alignment agent, film and display element | CHI MEI CORPORATION (TW) | 2014-07-22 | — | — | US | disclosed |
| US-20140034371-A1 | PATTERN FORMING METHOD, ALKALI-DEVELOPABLE THERMOSETTING RESIN COMPOSITION, PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | TAIYO INK MFG. CO., LTD. (JP) | 2014-02-06 | — | — | US | disclosed |
| US-20140028140-A1 | ROTATOR COIL AND METHOD OF MANUFACTURING THE SAME | MITSUBISHI ELECTRIC CORPORATION (JP) | 2014-01-30 | — | — | US | disclosed |
| US-20130109785-A1 | THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD USING THE SAME | TAIYO INK MFG. CO., LTD. (JP) | 2013-05-02 | — | — | US | disclosed |
| EP-0618269-B1 | Thermosetting resin compositions and their use for making resin articles and thin film wiring boards | HITACHI LTD (JP) | 1998-11-11 | — | — | EP | disclosed |
| EP-0755979-A2 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1997-01-29 | — | — | EP | disclosed |
| EP-0618269-A1 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1994-10-05 | — | — | EP | disclosed |