SCHEMBL349582

SCHEMBL349582

Cc1cc(Cc2ccc(Oc3ccc(N4C(=O)C=CC4=O)cc3)c(C)c2)ccc1Oc1ccc(N2C(=O)C=CC2=O)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 12/20 0.54
FAAH O00519 4/20 0.54
HSP90AA1 P07900 3/20 0.41
ALDH1A1 P00352 2/20 0.41
HPGD P15428 2/20 0.41
HTT P42858 2/20 0.41
CCR6 P51684 2/20 0.41
MEN1 O00255 1/20 0.41
LMNA P02545 1/20 0.41
PKM P14618 1/20 0.41
KMT2A Q03164 1/20 0.41
ATM Q13315 1/20 0.41
CACNA1B Q00975 1/20 0.40
APBA1 Q02410 1/20 0.40
NPSR1 Q6W5P4 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
NTRK1 P04629 1/20 0.40
IGF1R P08069 1/20 0.40
FGFR1 P11362 1/20 0.40
NTRK2 Q16620 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853248 0.90 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8852789 0.88 MGLL (0.60) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL15442737 0.85 MGLL (0.54) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8767021 0.84 MGLL (0.56) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL348925 0.83 MGLL (0.54) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL348535 0.83 MGLL (0.54) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL15443133 0.83 MGLL (0.53) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8732715 0.81 MGLL (0.49) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL349106 0.80 MGLL (0.78) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL349016 0.80 MGLL (0.50) MGLLFAAHHSP90AA1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP claimed
CN-113156762-A Photosensitive resin composition, dry film, cured product and printed wiring board 日本化药株式会社 2021-07-23 CN disclosed
US-20190203048-A1 Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2019-07-04 US disclosed
US-20170324116-A1 NON-AQUEOUS ELECTROLYTE SOLUTION AND NON-AQUEOUS ELECTROLYTE SOLUTION SECONDARY BATTERY USING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2017-11-09 US disclosed
US-20170324116-A1 NON-AQUEOUS ELECTROLYTE SOLUTION AND NON-AQUEOUS ELECTROLYTE SOLUTION SECONDARY BATTERY USING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2017-11-09 US disclosed
US-9331536-B2 Rotator coil and method of manufacturing the same MITSUBISHI ELECTRIC CORPORATION (JP) 2016-05-03 US disclosed
US-8785567-B2 Liquid crystal alignment agent, film and display element CHI MEI CORPORATION (TW) 2014-07-22 US disclosed
US-20140028140-A1 ROTATOR COIL AND METHOD OF MANUFACTURING THE SAME MITSUBISHI ELECTRIC CORPORATION (JP) 2014-01-30 US disclosed
EP-1646486-B1 Process for preparing medical devices BOSTON SCIENT LTD (BB) 2012-02-22 EP disclosed
US-20120013043-A1 MEDICAL DEVICES AND PROCESSES FOR PREPARING SAME BOSTON SCIENTIFIC SCIMED, INC. (US) 2012-01-19 US disclosed
US-6462148-B1 RESIN COMPOSITION COMPRISING A POLYMER CONTAINING A QUINOLINE RING AND A THERMOSETTING RESIN, AN INSULATING MATERIAL CONSTITUTED BY SAID RESIN COMPOSITION AND AN ADHESIVE FILM, PARTICULARLY A RESIN FOR AN INTERLAYER INSULATION FILM HITACHI CHEMICAL CO., LTD. (JP) 2002-10-08 US disclosed
US-6132852-A LAMINATE OF POLYMER CONDUCTOR AND DIELECTRIC HITACHI, LTD. (JP) 2000-10-17 US disclosed
EP-0618269-B1 Thermosetting resin compositions and their use for making resin articles and thin film wiring boards HITACHI LTD (JP) 1998-11-11 EP disclosed
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP disclosed
EP-0755979-A2 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1997-01-29 EP disclosed
EP-0476589-B1 Multi-layer wiring substrate and production thereof HITACHI LTD (JP) 1996-06-12 EP disclosed
EP-0618269-A1 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1994-10-05 EP disclosed
US-5352762-A Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion HITACHI, LTD. (JP) 1994-10-04 US disclosed
EP-0476589-A2 Multi-layer wiring substrate and production thereof HITACHI, LTD. (JP) 1992-03-25 EP disclosed
EP-0449292-A2 Multilayer printed circuit board and production thereof HITACHI, LTD. (JP) 1991-10-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20170324116-A1 NON-AQUEOUS ELECTROLYTE SOLUTION AND NON-AQUEOUS ELECTROLYTE SOLUTION SECONDARY BATTERY USING THE SAME KCNN2, KCNE1, KCNN1 MGLL 2639/4885FAAH 1457/4885HSP90AA1 4025/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.