SCHEMBL349106

SCHEMBL349106

O=C1C=CC(=O)N1c1ccc(Oc2ccc(Cc3ccc(Oc4ccc(N5C(=O)C=CC5=O)cc4)cc3)cc2)cc1

nearest known ligand 0.78

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 16/20 0.78
FAAH O00519 6/20 0.78
HSP90AA1 P07900 3/20 0.51
PKM P14618 2/20 0.51
ALDH1A1 P00352 2/20 0.51
HPGD P15428 2/20 0.51
HTT P42858 2/20 0.51
MEN1 O00255 1/20 0.51
LMNA P02545 1/20 0.51
CCR6 P51684 1/20 0.51
KMT2A Q03164 1/20 0.51
ATM Q13315 1/20 0.51
NPSR1 Q6W5P4 2/20 0.47
TDP1 Q9NUW8 2/20 0.47
MAPK1 P28482 1/20 0.47
DDAH1 O94760 1/20 0.43
CACNA1B Q00975 1/20 0.42
APBA1 Q02410 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23220502 0.91 MGLL (0.64) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL486996 0.89 MGLL (0.68) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL331752 0.88 MGLL (0.84) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL487033 0.88 MGLL (0.84) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL4385482 0.88 MGLL (0.84) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL114168 0.88 MGLL (1.00) MGLLFAAHHSP90AA1PKMALDH1A1
Phthalic Anhydride SCHEMBL10456911 0.87 MGLL (0.60) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL22325656 0.86 MGLL (0.64) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL8853360 0.86 MGLL (0.79) MGLLFAAHHSP90AA1PKMALDH1A1
SCHEMBL27820745 0.86 MGLL (0.64) MGLLFAAHHSP90AA1PKMALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 215 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119490747-A Resin composition, prepreg comprising same, laminated board and metal foil-clad laminated board 广东生益科技股份有限公司 2025-02-21 CN claimed
CN-116410595-B Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2025-02-14 CN claimed
CN-116410596-B Resin composition and application thereof 广东生益科技股份有限公司 2025-02-14 CN claimed
CN-118256088-A Resin composition and application thereof 广东生益科技股份有限公司 2024-06-28 CN claimed
CN-118240342-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN claimed
CN-118240341-A Thermosetting resin composition and application thereof 广东生益科技股份有限公司 2024-06-25 CN claimed
CN-116410594-B Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2024-06-14 CN claimed
CN-116496199-A Modified maleimide compound and application thereof 广东生益科技股份有限公司 2023-07-28 CN claimed
CN-116410595-A Resin composition, prepreg comprising same, and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-116410596-A Resin composition and application thereof 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-116410594-A Resin composition, prepreg and metal foil-clad laminate 广东生益科技股份有限公司 2023-07-11 CN claimed
CN-112625442-A Cyanate ester resin composition, prepreg, laminate and printed wiring board 广东盈骅新材料科技有限公司 2021-04-09 CN claimed
EP-0449292-B1 Multilayer printed circuit board and production thereof HITACHI LTD (JP) 1997-08-20 EP claimed
JP-7149721-A None JP disclosed
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2026-03-12 US disclosed
US-20250326893-A1 RESIN COMPOSITION, PREPREG, LAMINATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE RESONAC CORP (JP) 2025-10-23 US disclosed
US-5352762-A Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion HITACHI, LTD. (JP) 1994-10-04 US disclosed
US-5225499-A Molding materials of epoxy resins and ether imides HITACHI, LTD. (JP) 1993-07-06 US disclosed
EP-0476589-A2 Multi-layer wiring substrate and production thereof HITACHI, LTD. (JP) 1992-03-25 EP disclosed
EP-0449292-A2 Multilayer printed circuit board and production thereof HITACHI, LTD. (JP) 1991-10-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260071011-A1 COMPOUND, RESIN COMPOSITION, PREPREG, RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE CD79B, C1R, TGFBR1 MGLL 3867/4885FAAH 4069/4885HSP90AA1 3849/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.