SCHEMBL353476

SCHEMBL353476

CC(S)CC(=O)O.CC(S)CC(=O)O.CC(S)CC(=O)O.CC(S)CC(=O)O.OCC(CO)(CO)CO

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.35
TDP1 Q9NUW8 3/20 0.34
ALDH1A1 P00352 2/20 0.34
LMNA P02545 1/20 0.34
MAPT P10636 1/20 0.34
PTGS2 P35354 1/20 0.34
CACNA2D1 P54289 2/20 0.33
GABRP O00591 2/20 0.33
GABRD O14764 2/20 0.33
GABRA1 P14867 2/20 0.33
GABRB1 P18505 2/20 0.33
GABRG2 P18507 2/20 0.33
GABRB3 P28472 2/20 0.33
GABRA5 P31644 2/20 0.33
GABRA3 P34903 2/20 0.33
GABRA2 P47869 2/20 0.33
GABRB2 P47870 2/20 0.33
GABRA4 P48169 2/20 0.33
GABRE P78334 2/20 0.33
GABRA6 Q16445 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98625 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL868958 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL29045247 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL869410 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL869643 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
Thioglycolic Acid SCHEMBL31028746 0.94 TDP1 (0.31) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL394575 0.90 GPR84 (0.33) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL98138 0.90 GPR84 (0.33) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL869263 0.90 GPR84 (0.33) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL868171 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1529 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4682184-A1 CURABLE EPOXY RESIN COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT DAIKIN INDUSTRIES, LTD. (JP) 2026-01-21 EP claimed
EP-4642651-A1 PHOSPHINE OXIDE-BASED PHOTOINITIATORS ARKEMA France (FR) 2025-11-05 EP claimed
WO-2025041532-A1 ACTIVE ENERGY RAY-CURABLE ANTIFOGGING COMPOSITION AND RESIN MOLDED BODY スタンレー電気株式会社 2025-02-27 WO claimed
WO-2025041652-A1 ACTIVE ENERGY RAY-CURABLE ANTIFOGGING COMPOSITION AND RESIN MOLDED ARTICLE スタンレー電気株式会社 2025-02-27 WO claimed
US-20250019488-A1 BINDER COMPOSITION, EPOXY-BASED CURED PRODUCT FORMED THEREFROM, AND LIGHT EMITTING LAYER CONTAINING EPOXY-BASED CURED PRODUCT HYUNDAI MOTOR COMPANY (KR) 2025-01-16 US claimed
WO-2024218251-A1 POLYMER DISPERSIONS OF POLYMERS P BASF SE (DE) 2024-10-24 WO claimed
WO-2024141190-A1 PHOSPHINE OXIDE-BASED PHOTOINITIATORS ARKEMA FRANCE (FR) 2024-07-04 WO claimed
WO-2023109165-A1 UNDERFILL MATERIAL, AND PREPARATION METHOD THEREFOR AND USE THEREOF 韦尔通科技股份有限公司 2023-06-22 WO claimed
US-20230161087-A1 OPTICAL FILM, METHOD FOR MANUFACTURING THE SAME, AND BACKLIGHT MODULE NAN YA PLASTICS CORPORATION (TW) 2023-05-25 US claimed
US-20230140137-A1 OPTICAL FILM, METHOD FOR MANUFACTURING THE SAME, AND BACKLIGHT MODULE NAN YA PLASTICS CORPORATION (TW) 2023-05-04 US claimed
US-20130304183-A1 STENT DELIVERY SYSTEM TERUMO KABUSHIKI KAISHA (JP) 2013-11-14 US claimed
US-8541510-B2 Thermosetting composition BRIDGESTONE CORPORATION (JP) 2013-09-24 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20110224382-A1 THERMOSETTING COMPOSITION BRIDGESTONE CORPORATION (JP) 2011-09-15 US claimed
US-7989567-B2 Method for production of water/oil repellent composition and article ASAHI GLASS COMPANY, LIMITED (JP) 2011-08-02 US claimed
EP-2341100-A1 THERMOSETTING COMPOSITION Bridgestone Corporation (JP) 2011-07-06 EP claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed