SCHEMBL868958

SCHEMBL868958

CC(S)CC(=O)O.CC(S)CC(=O)O.CC(S)CC(=O)O.CC(S)CC(=O)O.CC(S)CC(=O)O.OCC(CO)(CO)CO.OCC(CO)(CO)CO

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.35
TDP1 Q9NUW8 3/20 0.34
ALDH1A1 P00352 2/20 0.34
LMNA P02545 1/20 0.34
MAPT P10636 1/20 0.34
PTGS2 P35354 1/20 0.34
CACNA2D1 P54289 2/20 0.33
GABRP O00591 2/20 0.33
GABRD O14764 2/20 0.33
GABRA1 P14867 2/20 0.33
GABRB1 P18505 2/20 0.33
GABRG2 P18507 2/20 0.33
GABRB3 P28472 2/20 0.33
GABRA5 P31644 2/20 0.33
GABRA3 P34903 2/20 0.33
GABRA2 P47869 2/20 0.33
GABRB2 P47870 2/20 0.33
GABRA4 P48169 2/20 0.33
GABRE P78334 2/20 0.33
GABRA6 Q16445 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL98625 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL353476 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL29045247 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL869410 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL869643 1.00 SLC22A6 (0.35) SLC22A6TDP1ALDH1A1LMNAMAPT
Thioglycolic Acid SCHEMBL31028746 0.94 TDP1 (0.31) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL394575 0.90 GPR84 (0.33) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL98138 0.90 GPR84 (0.33) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL869263 0.90 GPR84 (0.33) SLC22A6TDP1ALDH1A1LMNAMAPT
SCHEMBL868171 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-9557444-B2 Alkali-soluble resin, photosensitive resin composition, color filter, method for manufacturing the same, and liquid crystal display apparatus CHI MEI CORPORATION (TW) 2017-01-31 US disclosed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP disclosed
US-20150060746-A1 ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER AND METHOD FOR MANUFACTURING THE SAME, LIQUID CRYSTAL DISPLAY APPARATUS CHI MEI CORPORATION (TW) 2015-03-05 US disclosed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-8053167-B2 Curable compositions containing hydroxythiol compound, and cured products thereof SHOWA DENKO K.K. (JP) 2011-11-08 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed