SCHEMBL869263

SCHEMBL869263

CC(S)CC(=O)O.CC(S)CC(=O)O.CCC(CO)(CO)CO

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 4/20 0.33
TDP1 Q9NUW8 3/20 0.31
ALDH1A1 P00352 2/20 0.31
LMNA P02545 1/20 0.31
MAPT P10636 1/20 0.31
PTGS2 P35354 1/20 0.31
SLC22A6 Q4U2R8 1/20 0.31
MME P08473 1/20 0.31
ACE P12821 1/20 0.31
CPA1 P15085 1/20 0.31
ACE2 Q9BYF1 1/20 0.31
CACNA2D1 P54289 2/20 0.31
CACNB3 P54284 1/20 0.31
CACNA1C Q13936 1/20 0.31
PGR P06401 1/20 0.31
ADRA1A P35348 1/20 0.31
HTR2B P41595 1/20 0.31
CACNA2D2 Q9NY47 1/20 0.31
GABRP O00591 2/20 0.30
GABRD O14764 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL394575 1.00 GPR84 (0.33) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL98138 1.00 GPR84 (0.33) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL30608639 0.90 RNPEP (0.36) TDP1ALDH1A1LMNAMAPTPTGS2
SCHEMBL29045247 0.90 SLC22A6 (0.35) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL868958 0.90 SLC22A6 (0.35) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL869410 0.90 SLC22A6 (0.35) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL98625 0.90 SLC22A6 (0.35) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL869643 0.90 SLC22A6 (0.35) GPR84TDP1ALDH1A1LMNAMAPT
SCHEMBL353476 0.90 SLC22A6 (0.35) GPR84TDP1ALDH1A1LMNAMAPT
3-Methylbutanoic Acid SCHEMBL28216368 0.85 ALDH1A1 (0.39) GPR84TDP1ALDH1A1SLC22A6MME

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 40 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119709079-A Low-temperature curing epoxy adhesive and preparation method thereof 亿铖达(深圳)新材料有限公司 2025-03-28 CN claimed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-12534563-B2 Block copolymer, resin composition, stretch conductor, electronic device, and pressure-sensitive adhesive film ARTIENCE CO., LTD. (JP) 2026-01-27 US disclosed
US-20250188329-A1 CURABLE COMPOSITION PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2025-06-12 US disclosed
US-12297301-B2 High-molecular-weight compound and method for producing same, composition and method for producing same, resin composition, additive for lubricating oil, and lubricating oil MITSUBISHI CHEMICAL CORPORATION (JP) 2025-05-13 US disclosed
CN-119709079-A Low-temperature curing epoxy adhesive and preparation method thereof 亿铖达(深圳)新材料有限公司 2025-03-28 CN disclosed
CN-119343407-A Photocurable composition and method for manufacturing camera module 松下知识产权经营株式会社 2025-01-21 CN disclosed
CN-118891308-A Curable composition 松下知识产权经营株式会社 2024-11-01 CN disclosed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12534563-B2 Block copolymer, resin composition, stretch conductor, electronic device, and pressure-sensitive adhesive film EPB41, ITGB4, ITGB5 GPR84 1773/4885TDP1 3356/4885ALDH1A1 2727/4885
US-12297301-B2 High-molecular-weight compound and method for producing same, composition and method for producing same, resin composition, additive for lubricating oil, and lubricating oil TMT1A, TST, NOTUM GPR84 874/4885TDP1 2143/4885ALDH1A1 2047/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.