Water

Water

SCHEMBL357936

C[N+](C)(C)CC1CO1.[OH-]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ

The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL33571 0.97
Water SCHEMBL28103080 0.94
Hydrochloric Acid SCHEMBL286149 0.94 CHRM2 (0.67)
Hydrochloric Acid SCHEMBL28187844 0.94 CHRM2 (0.67)
Hydrochloric Acid SCHEMBL9333503 0.94
Iodide SCHEMBL902246 0.94
Hydrochloric Acid SCHEMBL42703 0.94
Bromide SCHEMBL456270 0.94
Hydrochloric Acid SCHEMBL10723477 0.94
Hydrochloric Acid SCHEMBL9749642 0.94

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109137613-B Face glue for book and periodical printing and preparation method thereof 江苏康普印刷科技有限公司 2020-07-07 CN disclosed
CN-110230233-B Surface glue for packaging printing and preparation method and application thereof 江苏康普印刷科技有限公司 2020-05-22 CN disclosed
EP-1621927-B1 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJIFILM CORP (JP) 2018-05-23 EP disclosed
EP-1566693-B1 Use of a Resist Composition for Immersion Exposure and Pattern Formation Method Using the Composition FUJIFILM CORP (JP) 2018-05-23 EP disclosed
US-9798235-B2 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJIFILM CORPORATION (JP) 2017-10-24 US disclosed
US-20170255098-A1 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND A METHOD OF FORMING THE PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2017-09-07 US disclosed
US-9703196-B2 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJIFILM CORPORATION (JP) 2017-07-11 US disclosed
US-20160370701-A1 POSITIVE TYPE RESIST COMPOSITION FOR USE IN LIQUID IMMERSION EXPOSURE AND A METHOD OF FORMING THE PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2016-12-22 US disclosed
EP-1580598-B1 Positive resist composition for immersion exposure and pattern-forming method using the same FUJIFILM CORP (JP) 2016-10-12 EP disclosed
US-9465292-B2 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJIFILM CORPORATION (JP) 2016-10-11 US disclosed
EP-1645908-A1 Positive resist composition and pattern-forming method using the same FUJI PHOTO FILM CO., LTD. (JP) 2006-04-12 EP disclosed
EP-1621927-A2 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same Fuji Photo Film Co., Ltd. (JP) 2006-02-01 EP disclosed
US-20060008736-A1 Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same FUJI PHOTO FILM CO., LTD. 2006-01-12 US disclosed
EP-1612602-A2 Photosensitive composition and method for forming pattern using the same FUJI PHOTO FILM CO., LTD. (JP) 2006-01-04 EP disclosed
US-20050287473-A1 Photosensitive composition and method for forming pattern using the same FUJI PHOTO FILM CO., LTD. 2005-12-29 US disclosed
EP-1580598-A2 Positive resist composition for immersion exposure and pattern-forming method using the same Fuji Photo Film Co. Ltd. (JP) 2005-09-28 EP disclosed
US-20050208419-A1 Fluoropolymer containing unsaturated monomer with a adamantyl, decalin, norbornyl, cedrol , cyclohexyl, cycloheptyl, cyclooctyl , a cyclodecanyl, cyclododecanyl and/or tricyclodecanyl group; sulfonium type compound generates acid upon exposure to actinic radiation; semiconductor, integrated circuits FUJI PHOTO FILM CO., LTD. 2005-09-22 US disclosed
US-20050186505-A1 Positive resist composition for immersion exposure and method of pattern formation with the same FUJI PHOTO FILM CO., LTD. 2005-08-25 US disclosed
US-20050186503-A1 Resist composition for immersion exposure and pattern formation method using the same FUJI PHOTO FILM CO., LTD. 2005-08-25 US disclosed
EP-1566693-A2 Resist composition for immersion exposure and pattern forming method using the same FUJI PHOTO FILM CO., LTD. (JP) 2005-08-24 EP disclosed