SCHEMBL3612829

SCHEMBL3612829

NCCCCCC(N)(C(=O)OCc1c([N+](=O)[O-])cccc1[N+](=O)[O-])C(=O)OCc1c([N+](=O)[O-])cccc1[N+](=O)[O-]

nearest known ligand 0.36

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
KAT2B Q92831 2/20 0.36
ALDH1A1 P00352 4/20 0.35
L3MBTL1 Q9Y468 2/20 0.33
CTSD P07339 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
GPR35 Q9HC97 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
MAOB P27338 1/20 0.33
HTT P42858 1/20 0.33
LMNA P02545 1/20 0.32
KDM4E B2RXH2 1/20 0.32
SLC9A1 P19634 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29362035 0.87 MAOB (0.44) KAT2BALDH1A1L3MBTL1CTSDNPSR1
SCHEMBL2201163 0.87 ALDH1A1 (0.35) ALDH1A1GPR35TDP1HTTLMNA
SCHEMBL1130378 0.87 MAOB (0.44) KAT2BALDH1A1L3MBTL1CTSDNPSR1
SCHEMBL16924652 0.84 GPR35 (0.39) ALDH1A1CTSDNPSR1GPR35TDP1
SCHEMBL2201250 0.81 MAPT (0.36) KAT2BALDH1A1KDM4E
SCHEMBL1056792 0.80 KAT2B (0.40) KAT2BALDH1A1L3MBTL1CTSDGPR35
SCHEMBL2200132 0.79 CYP1A2 (0.45) KAT2BALDH1A1GPR35TDP1KDM4E
SCHEMBL1055261 0.79 KAT2B (0.37) KAT2BALDH1A1L3MBTL1CTSDNPSR1
SCHEMBL2200690 0.79 RAB9A (0.46) ALDH1A1MAOBHTT
SCHEMBL16225602 0.78 KAT2B (0.40) KAT2BALDH1A1CTSDGPR35TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8367190-B2 At low temperature, fast hardening composition for preparing protecting film, protecting film prepared therefrom, and substrate comprising the same LG CHEM, LTD. (KR) 2013-02-05 US claimed
US-20100080973-A1 LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2010-04-01 US claimed
WO-2008035890-A1 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2008-03-27 WO claimed
EP-3161061-B1 METHOD OF FORMING A PATTERNED THIN FILM COMPONENT AND ORGANIC THIN FILM TRANSISTOR FLEXTERRA INC (US) 2020-11-18 EP disclosed
EP-3374467-B1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS ROLIC TECH AG (CH) 2020-04-15 EP disclosed
CN-106663736-B Photopatternable composition, patterned high dielectric thin film dielectric and related devices 飞利斯有限公司 2020-01-17 CN disclosed
US-10409159-B2 Photopatternable compositions, patterned high k thin film dielectrics and related devices FLEXTERRA, INC. (US) 2019-09-10 US disclosed
US-10162260-B2 Photosensitive resin composition, protective film, and liquid crystal display element CHI MEI CORPORATION (TW) 2018-12-25 US disclosed
US-20180320072-A1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS Rolic Technologies AG (CH) 2018-11-08 US disclosed
EP-3374467-A1 COMPOSITIONS OF PHOTO-ALIGNABLE MATERIALS ROLIC Technologies AG (CH) 2018-09-19 EP disclosed
US-20170192354-A1 PHOTOPATTERNABLE COMPOSITIONS, PATTERNED HIGH K THIN FILM DIELECTRICS AND RELATED DEVICES USINVEST LLC 2017-07-06 US disclosed
US-8367190-B2 At low temperature, fast hardening composition for preparing protecting film, protecting film prepared therefrom, and substrate comprising the same LG CHEM, LTD. (KR) 2013-02-05 US disclosed
US-20100080973-A1 LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2010-04-01 US disclosed
WO-2008035890-A1 AT LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME LG CHEM, LTD. (KR) 2008-03-27 WO disclosed
US-6403499-B2 FOR SEMICONDUCTORS MICRON TECHNOLOGY, INC. 2002-06-11 US disclosed
US-20010007798-A1 Planarization of non-planar surfaces in device fabrication MARSH EUGENE P (US) 2001-07-12 US disclosed
US-6218316-B1 Planarization of non-planar surfaces in device fabrication MICRON TECHNOLOGY, INC. 2001-04-17 US disclosed
US-5545509-A INTEGRATED CIRCUITS; HIGH DENSITY INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1996-08-13 US disclosed
EP-0599571-B1 Photoresist composition IBM (US) 1996-03-27 EP disclosed
EP-0599571-A2 Photoresist composition International Business Machines Corporation (US) 1994-06-01 EP disclosed