SCHEMBL3657409

SCHEMBL3657409

CC(=O)c1cc(Cc2cc(C(C)=O)c(O)c(O)c2O)c(O)c(O)c1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.47
KMT2A Q03164 3/20 0.47
BCL2 P10415 2/20 0.46
HPGD P15428 2/20 0.42
SMN1; SMN2 Q16637 2/20 0.42
HTT P42858 2/20 0.42
CYP1A2 P05177 1/20 0.42
CYP3A4 P08684 1/20 0.42
CYP2D6 P10635 1/20 0.42
CYP2C9 P11712 1/20 0.42
CYP2C19 P33261 1/20 0.42
NPSR1 Q6W5P4 1/20 0.42
ALDH1A1 P00352 1/20 0.41
HSD17B10 Q99714 1/20 0.41
KDM4E B2RXH2 1/20 0.41
NSD2 O96028 1/20 0.41
POLB P06746 1/20 0.41
MAPT P10636 1/20 0.41
MCL1 Q07820 1/20 0.41
ALOX15 P16050 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8030968 0.91 AMY1A (0.49) MEN1KMT2ABCL2HPGDSMN1; SMN2
SCHEMBL8051907 0.83 MEN1 (0.45) MEN1KMT2AHPGDSMN1; SMN2HTT
SCHEMBL9636703 0.80 BCL2 (0.49) BCL2HPGDCYP3A4ALDH1A1MAPT
SCHEMBL7775745 0.79 HSP90AB1 (0.44) MEN1KMT2ABCL2HPGDCYP3A4
SCHEMBL26769478 0.77 MEN1 (0.46) MEN1KMT2AHPGDSMN1; SMN2HTT
SCHEMBL12786465 0.76 HPGD (0.68) MEN1KMT2AHPGDSMN1; SMN2HTT
SCHEMBL7773855 0.76 ALDH1A1 (0.52) BCL2HPGDHTTALDH1A1HSD17B10
SCHEMBL10498460 0.75 MEN1 (0.55) MEN1KMT2AHPGDSMN1; SMN2HTT
SCHEMBL30669860 0.74 MEN1 (0.41) MEN1KMT2ABCL2HPGDSMN1; SMN2
SCHEMBL5674830 0.74 HTT (0.65) MEN1KMT2AHPGDSMN1; SMN2HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 172 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-4702010-A1 PHOTOACTIVE COMPOUNDS Merck Patent GmbH (DE) 2026-03-04 EP disclosed
US-20250376552-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-12-11 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-4596608-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4596607-A1 RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
EP-4597225-A1 FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE FUJIFILM Corporation (JP) 2025-08-06 EP disclosed
US-20250236697-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-24 US disclosed
US-20250230283-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-07-17 US disclosed
US-4863827-A O-QUINONE DIAZIDE AMERICAN HOECHST CORPORATION (US) 1989-09-05 US disclosed
EP-0264845-A2 Multilayer positive-registration material HOECHST CELANESE CORPORATION (US) 1988-04-27 EP disclosed
US-4732836-A SOLUTION STABILITY PHENOLIC COMPOUNDS CONDENSED WITH QUINONES HOECHST CELANESE CORPORATION (US) 1988-03-22 US disclosed
US-4732837-A Novel mixed ester O-quinone photosensitizers HOECHST CELANESE CORPORATION (US) 1988-03-22 US disclosed
EP-0244763-A2 Positive-working photosensitive composition and photosensitive recording material prepared therefrom HOECHST CELANESE CORPORATION (US) 1987-11-11 EP disclosed
EP-0244762-A2 Photosensitive positive composition and photosensitive registration material prepared therefrom HOECHST CELANESE CORPORATION (US) 1987-11-11 EP disclosed
EP-0243964-A2 Photosensitive positive composition and photosensitive registration material prepared therefrom HOECHST CELANESE CORPORATION (US) 1987-11-04 EP disclosed
US-4407926-A PHOTORESISTS, PRINTING PLATES HOECHST AKTIENGESELLSCHAFT (DE) 1983-10-04 US disclosed
EP-0052788-A1 Photosensitive mixture based on o-naphthoquinone diazides, and photosensible copying material made therefrom HOECHST AKTIENGESELLSCHAFT (DE) 1982-06-02 EP disclosed