SCHEMBL36674

SCHEMBL36674

Cc1cc(C(c2ccc(O)c(C)c2)c2ccc(O)c(O)c2)ccc1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 8/20 0.48
TP53 P04637 1/20 0.48
RECQL P46063 6/20 0.47
MAPT P10636 6/20 0.47
KDM4E B2RXH2 5/20 0.47
KMT2A Q03164 4/20 0.47
LMNA P02545 3/20 0.47
APEX1 P27695 3/20 0.47
TSHR P16473 2/20 0.47
HIF1A Q16665 2/20 0.47
HSD17B10 Q99714 2/20 0.47
MTOR P42345 2/20 0.47
BLM P54132 2/20 0.47
ALOX15 P16050 1/20 0.47
NFKB1 P19838 1/20 0.47
THPO P40225 1/20 0.47
POLB P06746 1/20 0.47
TRPA1 O75762 2/20 0.47
PTGS1 P23219 1/20 0.47
CACNA1C Q13936 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30374855 1.00 TDP1 (0.48) TDP1TP53RECQLMAPTKDM4E
SCHEMBL29637883 1.00 TDP1 (0.48) TDP1TP53RECQLMAPTKDM4E
SCHEMBL29465801 0.93 TP53 (0.54) TDP1TP53MAPTKDM4EHIF1A
SCHEMBL674987 0.93 TP53 (0.54) TDP1TP53MAPTKDM4EHIF1A
SCHEMBL1596751 0.91 TP53 (0.52) TDP1TP53MAPTKDM4EHIF1A
SCHEMBL29373036 0.88 TDP1 (0.44) TDP1RECQLMAPTKDM4EKMT2A
SCHEMBL36227 0.88 TDP1 (0.44) TDP1RECQLMAPTKDM4EKMT2A
SCHEMBL24282281 0.88 ALDH1A1 (0.53) TDP1TP53RECQLMAPTKDM4E
SCHEMBL109026 0.86 TDP1 (0.54) TDP1RECQLMAPTKDM4EKMT2A
SCHEMBL31516962 0.86 TDP1 (0.54) TDP1RECQLMAPTKDM4EKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 420 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7879528-B2 For forming pattern that prevents contamination within the exposure apparatus; lithography TOKYO OHKA KOGYO CO., LTD. (JP) 2011-02-01 US claimed
US-20080176170-A1 RESIST COMPOSITION FOR ELECTRON BEAM OR EUV TOKYO OHKA KOGYO CO., LTD. (JP) 2008-07-24 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-6790582-B1 NOVOLAK RESIN PARTIALLY ESTERIFIED WITH NAPHTHOQUINONEDIAZIDOSULFONYL GROUP; DILUTION RESIN(S), AND SOLVENT CLARIANT FINANCE BVI LIMITED (VG) 2004-09-14 US claimed
US-5817610-A Non-corrosive cleaning composition for removing plasma etching residues OLIN MICROELECTRONIC CHEMICALS, INC. (US) 1998-10-06 US claimed
WO-2025079919-A1 PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, AND SEMICONDUCTOR DEVICE 주식회사 엘지화학 2025-04-17 WO disclosed
US-20240384116-A1 MODIFIED EPOXY RESIN AND ELECTRODEPOSITION COATING MATERIAL KANSAI PAINT CO., LTD. (JP) 2024-11-21 US disclosed
EP-4410858-A1 MODIFIED EPOXY RESIN AND ELECTRODEPOSITION COATING MATERIAL Kansai Paint Co., Ltd. (JP) 2024-08-07 EP disclosed
US-20240248396-A1 XANTHENE COMPOUND, RESIN COMPOSITION, CURED OBJECT, METHOD FOR PRODUCING CURED OBJECT, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2024-07-25 US disclosed
US-11953830-B2 Photosensitive resin composition, photosensitive resin sheet, cured film, method for producing cured film, organic EL display device and electronic component TORAY INDUSTRIES, INC. (JP) 2024-04-09 US disclosed
EP-4023694-B1 EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME MITSUBISHI CHEM CORP (JP) 2024-02-14 EP disclosed
US-6316170-B2 COATING, EXPOSURE, DEVELOPMENT AND HEAT TREATMENT KABUSHIKI KAISHA TOSHIBA (JP) 2001-11-13 US disclosed
EP-1146394-A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION CLARIANT INTERNATIONAL LTD. (CH) 2001-10-17 EP disclosed
US-20010006767-A1 Developing solution and method of forming polyimide pattern by using the developing solution YOSHIAKI KAWAMONZEN 2001-07-05 US disclosed
EP-0943640-A1 HIGHLY HEAT-RESISTANT, HIGH-PURITY POLYARYLATE AND FILM PRODUCED FROM THE SAME UNITIKA LTD. (JP) 1999-09-22 EP disclosed
US-5856058-A HALATION INHIBITOR WHICH IS AN ESTERIFICATION PRODUCT BETWEEN A SPECIFIED PHENOLIC COMPOUND AND A NAPHTHOQUINONE-1,2-DIAZIDE SULFONIC ACID. TOKYO OHKA KOGYO CO., LTD. (JP) 1999-01-05 US disclosed
EP-0828197-A1 Photoresist stripping and cleaning compositions Olin Microelectronic Chemicals, Inc. (US) 1998-03-11 EP disclosed
US-5501936-A IMPROVED RESOLUTION OF VERY FINE PATTERNS TOKYO OHKA KOGYO CO., LTD. (JP) 1996-03-26 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240248396-A1 XANTHENE COMPOUND, RESIN COMPOSITION, CURED OBJECT, METHOD FOR PRODUCING CURED OBJECT, ORGANIC EL DISPLAY DEVICE, AND DISPLAY DEVICE NLRP3, XPA, ASIC1 TDP1 3005/4885TP53 4753/4885RECQL 1468/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.