SCHEMBL3675474

SCHEMBL3675474

CC1=C(c2ccccc2C)C(=O)NC1=O

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GSK3B P49841 4/20 0.48
DAO P14920 1/20 0.44
CASP3 P42574 1/20 0.42
CASP2 P42575 1/20 0.42
CASP7 P55210 1/20 0.42
CASP6 P55212 1/20 0.42
CASP8 Q14790 1/20 0.42
PRKCB P05771 1/20 0.41
STK10 O94804 3/20 0.40
SLK Q9H2G2 3/20 0.40
POLB P06746 1/20 0.40
QPCT Q16769 1/20 0.40
NOTUM Q6P988 1/20 0.40
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
PBRM1 Q86U86 1/20 0.39
TNKS2 Q9H2K2 1/20 0.39
CCNE2 O96020 1/20 0.39
CDK4 P11802 1/20 0.39
CCND1 P24385 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19583334 0.90 GSK3B (0.54) GSK3BCASP3CASP2CASP7CASP6
SCHEMBL9200511 0.79 STK10 (0.43) GSK3BCASP3CASP2CASP7CASP6
SCHEMBL9204436 0.79 STK10 (0.43) GSK3BCASP3CASP2CASP7CASP6
SCHEMBL5442626 0.78 GSK3B (0.42) GSK3BDAOCASP3CASP2CASP7
SCHEMBL3671511 0.78 GSK3B (0.66) GSK3BSTK10SLK
SCHEMBL2301106 0.78 DAO (0.46) GSK3BDAOCASP3CASP2CASP7
SCHEMBL3673282 0.78 DAO (0.41) GSK3BDAOPRKCB
SCHEMBL3671502 0.77 GAA (0.47) MEN1KMT2A
SCHEMBL8890003 0.77 MYC (0.49) GSK3BPOLBMEN1KMT2A
SCHEMBL94488 0.76 PTGS2 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114685991-A Resin composition and article thereof 中山台光电子材料有限公司 2022-07-01 CN claimed
CN-113980051-A Flame-retardant compound, method for producing same, resin composition, and article thereof 中山台光电子材料有限公司 2022-01-28 CN claimed
CN-112898773-A Resin composition and product thereof 中山台光电子材料有限公司 2021-06-04 CN claimed
CN-111171242-A Resin composition and articles made therefrom 台光电子材料股份有限公司 2020-05-19 CN claimed
US-7825188-B2 Thermoplastic elastomer with acyloxyphenyl hard block segment DESIGNER MOLECULES, INC. (US) 2010-11-02 US claimed
WO-2008077141-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2008-06-26 WO claimed
US-20080146738-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. 2008-06-19 US claimed
CN-113292824-B Long-chain alkyl polyphenyl ether resin composition and application thereof 珠海宏昌电子材料有限公司 2022-03-11 CN disclosed
CN-113292824-A Long-chain alkyl polyphenyl ether resin composition and application thereof 珠海宏昌电子材料有限公司 2021-08-24 CN disclosed
US-7825188-B2 Thermoplastic elastomer with acyloxyphenyl hard block segment DESIGNER MOLECULES, INC. (US) 2010-11-02 US disclosed
WO-2008077141-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. (US) 2008-06-26 WO disclosed
US-20080146738-A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF DESIGNER MOLECULES, INC. 2008-06-19 US disclosed
US-5869184-A RESIN RAW MATERIALS FOR PAINTS, ADHESIVES MITSUI TOATSU CHEMICALS, INC. (JP) 1999-02-09 US disclosed