Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PTGS2 | P35354 | 3/20 | 0.37 |
| ▸ | ACACB | O00763 | 11/20 | 0.36 |
| ▸ | ACACA | Q13085 | 11/20 | 0.36 |
| ▸ | EGFR | P00533 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10006671 | 0.87 | PTGS2 (0.43) | PTGS2ACACBACACA | |
| SCHEMBL7193397 | 0.80 | PTGS2 (0.48) | PTGS2 | |
| SCHEMBL7132790 | 0.77 | PTGS2 (0.44) | PTGS2 | |
| SCHEMBL3675474 | 0.76 | GSK3B (0.48) | — | |
| SCHEMBL1164429 | 0.75 | PTGS2 (0.58) | PTGS2EGFR | |
| SCHEMBL2230096 | 0.74 | MGLL (0.42) | — | |
| SCHEMBL2228525 | 0.74 | MGLL (0.44) | PTGS2 | |
| SCHEMBL3729848 | 0.73 | CAMK2D (0.44) | PTGS2 | |
| SCHEMBL3671502 | 0.73 | GAA (0.47) | PTGS2EGFR | |
| SCHEMBL19583334 | 0.72 | GSK3B (0.54) | PTGS2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102396113-B | Circuit connecting material, film-like circuit connecting material using the circuit connecting material, structure for connecting circuit member, and method for connecting circuit member | HITACHI CHEMICAL CO LTD | 2014-09-24 | — | — | CN | disclosed |
| CN-102174299-B | Circuit-connecting material, and connection structure for circuit member | HITACHI CHEMICAL CO LTD | 2014-01-29 | — | — | CN | disclosed |
| US-8501045-B2 | Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-08-06 | — | — | US | disclosed |
| US-8202622-B2 | Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2012-06-19 | — | — | US | disclosed |
| US-20120138868-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-06-07 | — | — | US | disclosed |
| EP-2426787-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE CIRCUIT CONNECTING MATERIAL, STRUCTURE FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR CONNECTING CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2012-03-07 | — | — | EP | disclosed |
| US-8043709-B2 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2011-10-25 | — | — | US | disclosed |
| US-20110247870-A1 | CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-10-13 | — | — | US | disclosed |
| US-20110247757-A1 | CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME | ARIFUKU MOTOHIRO | 2011-10-13 | — | — | US | disclosed |
| US-8029911-B2 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-10-04 | — | — | US | disclosed |
| US-20100025097-A1 | CIRCUIT CONNECTION STRUCTURE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-02-04 | — | — | US | disclosed |
| EP-2148393-A1 | CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER | Hitachi Chemical Company, Ltd. (JP) | 2010-01-27 | — | — | EP | disclosed |
| US-20090321116-A1 | CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME | ARIFUKU MOTOHIRO | 2009-12-31 | — | — | US | disclosed |
| EP-1628363-B1 | CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL CO LTD (JP) | 2009-12-16 | — | — | EP | disclosed |
| EP-2081222-A1 | CIRCUIT CONNECTION STRUCTURE | Hitachi Chemical Company, Ltd. (JP) | 2009-07-22 | — | — | EP | disclosed |
| US-20070166549-A1 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | NOMURA SATOYUKI | 2007-07-19 | — | — | US | disclosed |
| US-7208105-B2 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-04-24 | — | — | US | disclosed |
| US-20060100314-A1 | Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same | HITACHI CHEMICAL CO., LTD. (JP) | 2006-05-11 | — | — | US | disclosed |
| EP-1628363-A1 | CIRCUIT CONNECTING MATERIAL, FILM-LIKE CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF PRODUCING THE SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20030141014-A1 | Mixture of electroconductive particles and polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2003-07-31 | — | — | US | disclosed |